JPS548975A - Semiconuctor device - Google Patents
Semiconuctor deviceInfo
- Publication number
- JPS548975A JPS548975A JP7519477A JP7519477A JPS548975A JP S548975 A JPS548975 A JP S548975A JP 7519477 A JP7519477 A JP 7519477A JP 7519477 A JP7519477 A JP 7519477A JP S548975 A JPS548975 A JP S548975A
- Authority
- JP
- Japan
- Prior art keywords
- semiconuctor
- electrode
- couple
- dividing
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prevent the secondary disaster following an element breakdown by fixing an insulating ring between confronting faces of a couple of electrode metal blocks and by dividing the circumferential spaces of the electrode element.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7519477A JPS548975A (en) | 1977-06-23 | 1977-06-23 | Semiconuctor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7519477A JPS548975A (en) | 1977-06-23 | 1977-06-23 | Semiconuctor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS548975A true JPS548975A (en) | 1979-01-23 |
Family
ID=13569131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7519477A Pending JPS548975A (en) | 1977-06-23 | 1977-06-23 | Semiconuctor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS548975A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5932417U (en) * | 1982-08-25 | 1984-02-29 | 株式会社玉川繊維工業所 | Special laminated mat |
US5381038A (en) * | 1990-12-19 | 1995-01-10 | Fuji Electric Co., Ltd. | Semiconductor device having passivation protrusions defining electrical bonding area |
US8456001B2 (en) | 2006-09-26 | 2013-06-04 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
WO2023001354A1 (en) * | 2021-07-19 | 2023-01-26 | Dynex Semiconductor Limited | Semiconductor device having failure mode protection |
-
1977
- 1977-06-23 JP JP7519477A patent/JPS548975A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5932417U (en) * | 1982-08-25 | 1984-02-29 | 株式会社玉川繊維工業所 | Special laminated mat |
JPS6331958Y2 (en) * | 1982-08-25 | 1988-08-25 | ||
US5381038A (en) * | 1990-12-19 | 1995-01-10 | Fuji Electric Co., Ltd. | Semiconductor device having passivation protrusions defining electrical bonding area |
US8456001B2 (en) | 2006-09-26 | 2013-06-04 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
WO2023001354A1 (en) * | 2021-07-19 | 2023-01-26 | Dynex Semiconductor Limited | Semiconductor device having failure mode protection |
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