JPS57126992A - Treatment for preventing whisker generation of tin plated material - Google Patents
Treatment for preventing whisker generation of tin plated materialInfo
- Publication number
- JPS57126992A JPS57126992A JP1103481A JP1103481A JPS57126992A JP S57126992 A JPS57126992 A JP S57126992A JP 1103481 A JP1103481 A JP 1103481A JP 1103481 A JP1103481 A JP 1103481A JP S57126992 A JPS57126992 A JP S57126992A
- Authority
- JP
- Japan
- Prior art keywords
- temp
- plated material
- treatment
- predetermined
- tin plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract 2
- 238000007747 plating Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1103481A JPS57126992A (en) | 1981-01-27 | 1981-01-27 | Treatment for preventing whisker generation of tin plated material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1103481A JPS57126992A (en) | 1981-01-27 | 1981-01-27 | Treatment for preventing whisker generation of tin plated material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57126992A true JPS57126992A (en) | 1982-08-06 |
| JPS623239B2 JPS623239B2 (cg-RX-API-DMAC7.html) | 1987-01-23 |
Family
ID=11766777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1103481A Granted JPS57126992A (en) | 1981-01-27 | 1981-01-27 | Treatment for preventing whisker generation of tin plated material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57126992A (cg-RX-API-DMAC7.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007311258A (ja) * | 2006-05-19 | 2007-11-29 | Sumitomo Electric Ind Ltd | 合金の製造方法およびフラットケーブルの製造方法 |
| JP2009197280A (ja) * | 2008-02-22 | 2009-09-03 | Jst Mfg Co Ltd | めっき層の熱処理方法 |
| JP2010126766A (ja) * | 2008-11-27 | 2010-06-10 | Toyota Motor Corp | Snめっき層を有するめっき基材およびその製造方法 |
| CN110512244A (zh) * | 2019-09-19 | 2019-11-29 | 昆山一鼎工业科技有限公司 | 电镀雾锡产品的表面处理方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5119591B2 (ja) * | 2005-12-05 | 2013-01-16 | 住友電気工業株式会社 | フラットケーブルの製造方法 |
-
1981
- 1981-01-27 JP JP1103481A patent/JPS57126992A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007311258A (ja) * | 2006-05-19 | 2007-11-29 | Sumitomo Electric Ind Ltd | 合金の製造方法およびフラットケーブルの製造方法 |
| JP2009197280A (ja) * | 2008-02-22 | 2009-09-03 | Jst Mfg Co Ltd | めっき層の熱処理方法 |
| JP2010126766A (ja) * | 2008-11-27 | 2010-06-10 | Toyota Motor Corp | Snめっき層を有するめっき基材およびその製造方法 |
| CN110512244A (zh) * | 2019-09-19 | 2019-11-29 | 昆山一鼎工业科技有限公司 | 电镀雾锡产品的表面处理方法 |
| CN110512244B (zh) * | 2019-09-19 | 2021-03-09 | 昆山一鼎工业科技有限公司 | 电镀雾锡产品的表面处理方法 |
| WO2021052182A1 (zh) * | 2019-09-19 | 2021-03-25 | 昆山一鼎工业科技有限公司 | 电镀雾锡产品的表面处理方法 |
| US11441231B2 (en) | 2019-09-19 | 2022-09-13 | Kunshan Yiding Industrial Technology Co., Ltd | Method for surface treatment of matte tinplated product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS623239B2 (cg-RX-API-DMAC7.html) | 1987-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS57126992A (en) | Treatment for preventing whisker generation of tin plated material | |
| JPS5337383A (en) | Semiconductor integrated circuit | |
| JPS51114120A (en) | Photographic material | |
| JPS52798A (en) | Process for production of acteivated alumina | |
| JPS5265341A (en) | Heat radiation body | |
| JPS52117066A (en) | Semiconductor device | |
| JPS52113162A (en) | Preparation of semiconductor device | |
| JPS5228262A (en) | Process for assembling semiconductor device | |
| JPS5211860A (en) | Liquid phase epitaxial device | |
| JPS5419624A (en) | Adhering method of adhesive tape | |
| JPS545661A (en) | Radiator substance for semiconductor device | |
| JPS51111604A (en) | Manufacturing method of small type rectifier | |
| JPS5311583A (en) | Production and apparatus for integrated circuits wafers | |
| JPS5230163A (en) | Method for junction of semiconductor parts | |
| JPS5244566A (en) | Method of alloying semiconductor pellet | |
| JPS5419685A (en) | Securing method of semiconductor pellets | |
| JPS544067A (en) | Electrode forming method of semiconductor device | |
| JPS52149967A (en) | Peeling method of wafers | |
| JPS543469A (en) | Resin sealing method for semiconductor device | |
| JPS5360172A (en) | Production of semiconductor device | |
| JPS522273A (en) | Method of treating semiconductor substrate | |
| JPS52115179A (en) | Lead frame | |
| JPS5396759A (en) | Production of semiconductor device | |
| JPS52155471A (en) | Bottle drying method | |
| JPS51131792A (en) | Device for arraying and padding articles |