JPS57121027A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS57121027A JPS57121027A JP597481A JP597481A JPS57121027A JP S57121027 A JPS57121027 A JP S57121027A JP 597481 A JP597481 A JP 597481A JP 597481 A JP597481 A JP 597481A JP S57121027 A JPS57121027 A JP S57121027A
- Authority
- JP
- Japan
- Prior art keywords
- pref
- component
- compounding
- polymerizable monomer
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prepare the titled composition having excellent curability and storage stability, and giving a cured product having excellent heat resistance and adhesivity, by compounding an epoxy resin and an acidic substance to a copolymer composed of a polymerizable monomer containing a basic group and an alkenyl phenol.
CONSTITUTION: The objective composition is prepared by compounding (A) a copolymer composed of (i) a basic group-containing polymerizable monomer (e.g. N,N-dimethylaminoethyl acrylate) and (ii) an alkenylphenol (e.g. vinylphenol) wherein the contents of the components (i) and (ii) are pref. 0.05W 10pts.wt. and 10W80pts. per 100pts. of the copolymer (A), respectively, (B) an epoxy resin (e.g. bisphenol-type resin) and (C) an acidic substance (e.g. a Lewis acid such as aluminum chloride). The ratio of the number of phenolic OH groups of the component A to that of the epoxy groups of the component B is pref. 0.5W2, and the amount of the component C is pref. 0.05W10pts. per 100pts. of the sum of the components A and B.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP597481A JPS57121027A (en) | 1981-01-20 | 1981-01-20 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP597481A JPS57121027A (en) | 1981-01-20 | 1981-01-20 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57121027A true JPS57121027A (en) | 1982-07-28 |
JPS6337814B2 JPS6337814B2 (en) | 1988-07-27 |
Family
ID=11625816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP597481A Granted JPS57121027A (en) | 1981-01-20 | 1981-01-20 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57121027A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53114900A (en) * | 1977-03-15 | 1978-10-06 | Cosmo Co Ltd | Polyalkenyl phenolic resin composition |
-
1981
- 1981-01-20 JP JP597481A patent/JPS57121027A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53114900A (en) * | 1977-03-15 | 1978-10-06 | Cosmo Co Ltd | Polyalkenyl phenolic resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS6337814B2 (en) | 1988-07-27 |
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