JPS57121027A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS57121027A
JPS57121027A JP597481A JP597481A JPS57121027A JP S57121027 A JPS57121027 A JP S57121027A JP 597481 A JP597481 A JP 597481A JP 597481 A JP597481 A JP 597481A JP S57121027 A JPS57121027 A JP S57121027A
Authority
JP
Japan
Prior art keywords
pref
component
compounding
polymerizable monomer
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP597481A
Other languages
Japanese (ja)
Other versions
JPS6337814B2 (en
Inventor
Shuhei Imon
Tomohide Yokoo
Kenji Ema
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP597481A priority Critical patent/JPS57121027A/en
Publication of JPS57121027A publication Critical patent/JPS57121027A/en
Publication of JPS6337814B2 publication Critical patent/JPS6337814B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the titled composition having excellent curability and storage stability, and giving a cured product having excellent heat resistance and adhesivity, by compounding an epoxy resin and an acidic substance to a copolymer composed of a polymerizable monomer containing a basic group and an alkenyl phenol.
CONSTITUTION: The objective composition is prepared by compounding (A) a copolymer composed of (i) a basic group-containing polymerizable monomer (e.g. N,N-dimethylaminoethyl acrylate) and (ii) an alkenylphenol (e.g. vinylphenol) wherein the contents of the components (i) and (ii) are pref. 0.05W 10pts.wt. and 10W80pts. per 100pts. of the copolymer (A), respectively, (B) an epoxy resin (e.g. bisphenol-type resin) and (C) an acidic substance (e.g. a Lewis acid such as aluminum chloride). The ratio of the number of phenolic OH groups of the component A to that of the epoxy groups of the component B is pref. 0.5W2, and the amount of the component C is pref. 0.05W10pts. per 100pts. of the sum of the components A and B.
COPYRIGHT: (C)1982,JPO&Japio
JP597481A 1981-01-20 1981-01-20 Thermosetting resin composition Granted JPS57121027A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP597481A JPS57121027A (en) 1981-01-20 1981-01-20 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP597481A JPS57121027A (en) 1981-01-20 1981-01-20 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS57121027A true JPS57121027A (en) 1982-07-28
JPS6337814B2 JPS6337814B2 (en) 1988-07-27

Family

ID=11625816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP597481A Granted JPS57121027A (en) 1981-01-20 1981-01-20 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS57121027A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114900A (en) * 1977-03-15 1978-10-06 Cosmo Co Ltd Polyalkenyl phenolic resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114900A (en) * 1977-03-15 1978-10-06 Cosmo Co Ltd Polyalkenyl phenolic resin composition

Also Published As

Publication number Publication date
JPS6337814B2 (en) 1988-07-27

Similar Documents

Publication Publication Date Title
JPS56136856A (en) Powder coating resin composition
JPS5536212A (en) Thermosetting resin composition
JPS55129341A (en) Photosensitive covering composition
JPS57105418A (en) Aqueous dispersion composition
JPS5632551A (en) Aqueous coating resin composition
JPS57121027A (en) Thermosetting resin composition
JPS5569616A (en) Epoxy resin composition for carbon fiber-reinforcement
JPS57209923A (en) Thermosetting resin composition
JPS5653119A (en) Curable resin composition
JPS56110765A (en) Thermosetting resin composition
JPS532587A (en) Preparation of curable polymer
JPS5523143A (en) Cold-setting resin composition
JPS55116721A (en) Molding composition
JPS57119921A (en) Curable resin composition
JPS5730719A (en) Preparation of cured novolak type epoxy resin
JPS5749613A (en) Thermosetting resin composition
JPS5659819A (en) Production of epoxy-modified copolymer
JPS5518458A (en) Coating resin composition
JPS5388094A (en) Preparation of curable compound
SU975750A1 (en) Polymeric composition
JPS56136860A (en) Water-dispersed electrodeposition coating
JPS562313A (en) Photosensitive grafted unsaturated resin and photosensitive resin composition containing the same
JPS5554371A (en) Modified starch size
JPS54155267A (en) Manufacture of glassfiber-reinforced transparent resin plate
JPS531227A (en) Preparation of coating compositions