JPS5712025A - Production of molding resin - Google Patents
Production of molding resinInfo
- Publication number
- JPS5712025A JPS5712025A JP8514280A JP8514280A JPS5712025A JP S5712025 A JPS5712025 A JP S5712025A JP 8514280 A JP8514280 A JP 8514280A JP 8514280 A JP8514280 A JP 8514280A JP S5712025 A JPS5712025 A JP S5712025A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- mixed
- melt
- inorg
- compsn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8514280A JPS5712025A (en) | 1980-06-25 | 1980-06-25 | Production of molding resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8514280A JPS5712025A (en) | 1980-06-25 | 1980-06-25 | Production of molding resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5712025A true JPS5712025A (en) | 1982-01-21 |
| JPS626572B2 JPS626572B2 (enrdf_load_stackoverflow) | 1987-02-12 |
Family
ID=13850404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8514280A Granted JPS5712025A (en) | 1980-06-25 | 1980-06-25 | Production of molding resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5712025A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58186166U (ja) * | 1982-06-04 | 1983-12-10 | ヤンマーディーゼル株式会社 | 列形燃料噴射ポンプ |
| JPS6151949A (ja) * | 1984-08-22 | 1986-03-14 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
| JPH0669259A (ja) * | 1993-06-14 | 1994-03-11 | Nitto Denko Corp | 半導体封止用樹脂タブレツト |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165946A (en) * | 1979-06-14 | 1980-12-24 | Hitachi Chem Co Ltd | Production of epoxy resin composition |
-
1980
- 1980-06-25 JP JP8514280A patent/JPS5712025A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165946A (en) * | 1979-06-14 | 1980-12-24 | Hitachi Chem Co Ltd | Production of epoxy resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58186166U (ja) * | 1982-06-04 | 1983-12-10 | ヤンマーディーゼル株式会社 | 列形燃料噴射ポンプ |
| JPS6151949A (ja) * | 1984-08-22 | 1986-03-14 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
| JPH0669259A (ja) * | 1993-06-14 | 1994-03-11 | Nitto Denko Corp | 半導体封止用樹脂タブレツト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS626572B2 (enrdf_load_stackoverflow) | 1987-02-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5717153A (en) | Sealing method of electronic parts | |
| JPS5227436A (en) | Polyester resin composition for powder coating | |
| AU463479B2 (en) | Process for producing solid epoxy resin compositions | |
| EP0385736A3 (en) | Epoxy encapsulant compositions and low stress additives therefor | |
| ES426094A1 (es) | Procedimiento para la obtencion de elementos de construc- cion. | |
| JPS5712025A (en) | Production of molding resin | |
| JPS56135584A (en) | Molded sealing material | |
| JPS56133856A (en) | Epoxy resin composition for sealing semiconductor | |
| GB1349709A (en) | Hardening epoxy resins | |
| JPS51135999A (en) | Epoxy res in composition | |
| ES8605843A1 (es) | Procedimiento para la preparacion de productos de endureci- miento resistentes a los acidos | |
| JPS5380000A (en) | Process for curing epoxy compound | |
| JPS55156341A (en) | Resin composition for realing electronic parts | |
| JPS5228538A (en) | Process for preparing thermoplastic resin compositions containing inor ganic fillers | |
| JPS53123457A (en) | Molding resin composition | |
| JPS51144453A (en) | Preparation of polyamide resin chips | |
| JPS5226554A (en) | Process for producing powdered molding materials based on thermosettin g resins | |
| JPS57187325A (en) | Production of epoxy resin laminated sheet | |
| JPS57174314A (en) | Epoxy resin composition | |
| JPS53129292A (en) | Curing of caking agent | |
| JPS5537351A (en) | Method of forming fiber reinforced plastic | |
| JPS5325698A (en) | Non-crystallizing epoxy resin composition | |
| JPS56104926A (en) | Epoxy resin composition for sealing electronic parts | |
| JPS5317698A (en) | Preparation of epoxy resin varnishes | |
| JPS52127927A (en) | Thermosetting coating compositions |