JPS57118881A - Laser scanning device - Google Patents

Laser scanning device

Info

Publication number
JPS57118881A
JPS57118881A JP56005497A JP549781A JPS57118881A JP S57118881 A JPS57118881 A JP S57118881A JP 56005497 A JP56005497 A JP 56005497A JP 549781 A JP549781 A JP 549781A JP S57118881 A JPS57118881 A JP S57118881A
Authority
JP
Japan
Prior art keywords
laser
reflecting mirrors
laser beam
scanning
spot diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56005497A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6229152B2 (enrdf_load_stackoverflow
Inventor
Shogo Yoshikawa
Ryuji Tatsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56005497A priority Critical patent/JPS57118881A/ja
Publication of JPS57118881A publication Critical patent/JPS57118881A/ja
Publication of JPS6229152B2 publication Critical patent/JPS6229152B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Laser Beam Processing (AREA)
JP56005497A 1981-01-16 1981-01-16 Laser scanning device Granted JPS57118881A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56005497A JPS57118881A (en) 1981-01-16 1981-01-16 Laser scanning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56005497A JPS57118881A (en) 1981-01-16 1981-01-16 Laser scanning device

Publications (2)

Publication Number Publication Date
JPS57118881A true JPS57118881A (en) 1982-07-23
JPS6229152B2 JPS6229152B2 (enrdf_load_stackoverflow) 1987-06-24

Family

ID=11612857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56005497A Granted JPS57118881A (en) 1981-01-16 1981-01-16 Laser scanning device

Country Status (1)

Country Link
JP (1) JPS57118881A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994596A (ja) * 1982-11-22 1984-05-31 Toshiba Corp レ−ザによるヒユ−ズ溶断装置
JPS6037287A (ja) * 1983-08-09 1985-02-26 Mitsubishi Electric Corp ビ−ム移動型レ−ザ加工装置
JPS60240396A (ja) * 1984-05-15 1985-11-29 Matsushita Electric Ind Co Ltd パルス発振レ−ザ溶接装置
JPH01126619A (ja) * 1987-11-11 1989-05-18 Matsushita Electric Ind Co Ltd 光走査装置
JPH01129226A (ja) * 1987-11-13 1989-05-22 Matsushita Electric Ind Co Ltd 光走査装置
DE102010004084A1 (de) * 2010-01-06 2011-07-07 Held Systems Ag Laserbearbeitungsvorrichtung für groß dimensionierte Bauteile
CN102176085A (zh) * 2011-03-09 2011-09-07 清华大学 使激光光束做大范围移动及扫描动作的机构

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994596A (ja) * 1982-11-22 1984-05-31 Toshiba Corp レ−ザによるヒユ−ズ溶断装置
JPS6037287A (ja) * 1983-08-09 1985-02-26 Mitsubishi Electric Corp ビ−ム移動型レ−ザ加工装置
JPS60240396A (ja) * 1984-05-15 1985-11-29 Matsushita Electric Ind Co Ltd パルス発振レ−ザ溶接装置
JPH01126619A (ja) * 1987-11-11 1989-05-18 Matsushita Electric Ind Co Ltd 光走査装置
JPH01129226A (ja) * 1987-11-13 1989-05-22 Matsushita Electric Ind Co Ltd 光走査装置
DE102010004084A1 (de) * 2010-01-06 2011-07-07 Held Systems Ag Laserbearbeitungsvorrichtung für groß dimensionierte Bauteile
DE102010004084B4 (de) 2010-01-06 2023-08-03 Gunnar Held Laserbearbeitungsvorrichtung für groß dimensionierte Bauteile
CN102176085A (zh) * 2011-03-09 2011-09-07 清华大学 使激光光束做大范围移动及扫描动作的机构

Also Published As

Publication number Publication date
JPS6229152B2 (enrdf_load_stackoverflow) 1987-06-24

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