JPS57117260A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57117260A JPS57117260A JP56003391A JP339181A JPS57117260A JP S57117260 A JPS57117260 A JP S57117260A JP 56003391 A JP56003391 A JP 56003391A JP 339181 A JP339181 A JP 339181A JP S57117260 A JPS57117260 A JP S57117260A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- overhung
- patterns
- metal
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating processes for reflow soldering
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56003391A JPS57117260A (en) | 1981-01-13 | 1981-01-13 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56003391A JPS57117260A (en) | 1981-01-13 | 1981-01-13 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57117260A true JPS57117260A (en) | 1982-07-21 |
| JPH0312469B2 JPH0312469B2 (enFirst) | 1991-02-20 |
Family
ID=11556058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56003391A Granted JPS57117260A (en) | 1981-01-13 | 1981-01-13 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57117260A (enFirst) |
-
1981
- 1981-01-13 JP JP56003391A patent/JPS57117260A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312469B2 (enFirst) | 1991-02-20 |
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