JPS57114689A - Partial plating method - Google Patents

Partial plating method

Info

Publication number
JPS57114689A
JPS57114689A JP94481A JP94481A JPS57114689A JP S57114689 A JPS57114689 A JP S57114689A JP 94481 A JP94481 A JP 94481A JP 94481 A JP94481 A JP 94481A JP S57114689 A JPS57114689 A JP S57114689A
Authority
JP
Japan
Prior art keywords
pipe
plating
plating soln
soln
bottom end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP94481A
Other languages
Japanese (ja)
Other versions
JPS6128037B2 (en
Inventor
Masao Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP94481A priority Critical patent/JPS57114689A/en
Publication of JPS57114689A publication Critical patent/JPS57114689A/en
Publication of JPS6128037B2 publication Critical patent/JPS6128037B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To apply partial plating easily on desired parts without using any auxiliary material by performing flowing and recovering of a plating soln. by using plural pipes within the same plane, and bringing the plating soln. in wet contact with the object to be plated located at the leading ends of the pipes.
CONSTITUTION: An outer pipe 31 connected via an intermediate joint 32 to a pipe 33. A plating soln. is fed through a pipe 37 connected to the joint 32, and is gushed from the bottom end of a central pipe 34 provided in the pipe 31; at the same time, the plating soln. is sucked and recovered through the pipe 33. With an object 40 to be plated as cathode, it is brought closer to the bottom end part of the pipe 31, and the plating soln, is acted as anode by an electrode 39. Thereby, the plating soln. part 30 drooping from the pipe 31 and the object 40 are touched and conducted. When the object 40 is detached from the pipe 31 after a prescribed time, the plating of the same shape as the shape of the inside section of the pipe 31 applied.
COPYRIGHT: (C)1982,JPO&Japio
JP94481A 1981-01-06 1981-01-06 Partial plating method Granted JPS57114689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP94481A JPS57114689A (en) 1981-01-06 1981-01-06 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP94481A JPS57114689A (en) 1981-01-06 1981-01-06 Partial plating method

Publications (2)

Publication Number Publication Date
JPS57114689A true JPS57114689A (en) 1982-07-16
JPS6128037B2 JPS6128037B2 (en) 1986-06-28

Family

ID=11487778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP94481A Granted JPS57114689A (en) 1981-01-06 1981-01-06 Partial plating method

Country Status (1)

Country Link
JP (1) JPS57114689A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100338264C (en) * 2004-01-05 2007-09-19 番禺得意精密电子工业有限公司 Electroplating method and special electroplating device using said electroplating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100338264C (en) * 2004-01-05 2007-09-19 番禺得意精密电子工业有限公司 Electroplating method and special electroplating device using said electroplating method

Also Published As

Publication number Publication date
JPS6128037B2 (en) 1986-06-28

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