CN100338264C - Electroplating method and special electroplating device using said electroplating method - Google Patents
Electroplating method and special electroplating device using said electroplating method Download PDFInfo
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- CN100338264C CN100338264C CNB2004100150109A CN200410015010A CN100338264C CN 100338264 C CN100338264 C CN 100338264C CN B2004100150109 A CNB2004100150109 A CN B2004100150109A CN 200410015010 A CN200410015010 A CN 200410015010A CN 100338264 C CN100338264 C CN 100338264C
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Abstract
The present invention discloses an electroplating method which comprises the following steps: a container which is provided with an opening is offered, and the opening is aligned with the position to be electroplated on an electroplated component; electroplating solutions are injected to the container so that the electroplating solutions flow to the electroplated components from the opening. The special electroplating device for the electroplating method of the present invention comprises a container used for accommodating the electroplating solutions, wherein the container is provided with an opening; the size of the opening is approximately equal to that of the position to be electroplated of the electroplated components. Compared with the existing electroplating technique, the electroplating method of the present invention adopts a way that the electroplating solutions directly come into contact with the electroplated components without the aid of other substances; therefore, the possibility of damaging the electroplated components does not exist, small electroplating area ranges are defined, no material waste exists, and thus, the cost is reduced.
Description
[technical field]
The invention relates to a kind of electro-plating method and be exclusively used in the electroplanting device of this electro-plating method.
[background technology]
Plating is the common technology in the many tasks industry department, can make parts have for example chromium plating, titanizing or gold-plated appearance, it mainly is the electrolytic deposition reaction of a kind of metal-salt on certain metal, normally for the oxidation that prevents this metal, improve its performance (as conductivity) etc.Therefore, under normal conditions, to be electroplated parts.Sometimes, under many circumstances, certain part that need only parts has specific performance properties.Certainly, for convenience, the integral body of parts can be electroplated, method therefor is immersion plating etc. for example.Yet use parts integral body is carried out electric plating method, wasted plated material to a great extent, increase electroplating cost, and this method has certain limitation, for example, in the time of need electroplating different materials to the different sites of parts, just can not use this kind method.Therefore preferably only there is the position of requirement to electroplate to use properties.
At present, the method for employing brush plating also can reach the purpose of parcel plating.But, brush plating need galvanized parts to contact with brush plating cloth because of must making, when by brush plating position and strip not (as shown in Figure 1) at grade the time, just very easily deformed by the brush plating position, and, the scope of brush plating has certain restriction, can not be too small etc. as the brush plating area, to a certain extent also can waste material.
Therefore, just need a kind of new electro-plating method, can guarantee by the requirement of electroplating part use properties, defective component not again, and will reduce cost.
[summary of the invention]
The object of the present invention is to provide a kind of can the assurance, defective component not, and the electro-plating method that can reduce cost again and the electroplanting device that is exclusively used in this electro-plating method by the requirement of electroplating part use properties.
For achieving the above object, electro-plating method of the present invention may further comprise the steps: a container that is provided with opening is provided; One base that is provided with passage is provided; To be positioned between container and the base by electroplating part, and make and to aim at opening at the plating position, be positioned at directly over the passage; Electroplate liquid is injected in the said vesse, and make electroplate liquid flow out arrival by on the electroplating part, and flow out via passage from opening.
The electroplanting device that is exclusively used in electro-plating method of the present invention comprises that one is used for holding the container of electroplate liquid, this container is provided with opening, this opening size and the size of being electroplated the position by the need of electroplating part about equally, an and base that is provided with passage, described passage is positioned at the below of this opening.
Compare with existing electroplating technology, electro-plating method of the present invention adopts electroplating solution directly and by electroplating part is contacted, therebetween not by other material, thereby do not exist damage by the possibility of electroplating part, and, can limit galvanized areal extent very little, can waste material, thereby reduce cost.
[description of drawings]
Fig. 1 is by the stereographic map of electroplating part.
Fig. 2 is the synoptic diagram of first kind of embodiment of electro-plating method of the present invention.
Fig. 3 is the synoptic diagram of second kind of embodiment of electro-plating method of the present invention.
Fig. 4 is the synoptic diagram of the third embodiment of electro-plating method of the present invention.
[embodiment]
See also Fig. 2, in the present embodiment, electro-plating method of the present invention is the terminal 5 (as shown in Figure 1) that is used for electroplating in the electric connector, it may further comprise the steps: a container 10 is provided, and this container is provided with an opening 11, these opening 11 sizes and the size of being electroplated the position by the need of electroplating part will be placed at the container below by electroplating part 5 about equally, and the opening 11 of container 10 is aimed at by electroplating part 5 needs galvanized position 51; One base 2 that is provided with passage 20 is provided, and this base 2 is positioned over by electroplating part 5 belows, and these passage 20 corresponding openings 11, so that electroplate liquid 40 flows into returnable 30; Electroplating solution 40 is injected in the container 10, begin to electroplate.Electroplate liquid flows out from the opening 11 of container 10, flow to be positioned at opening 11 belows needed galvanized position 51 by electroplating part 5, electroplate, can fully electroplate needs galvanized position 51, satisfies by the plating requirement of electroplating part.Flow through by the electroplate liquid of electroplating part 5 through passage 20, in the inflow returnable 30, so that recycled.
See also Fig. 3, be second kind of implementation method of electro-plating method of the present invention, be with first kind of implementation method difference, in this implementation method, container 10 ' interior electroplate liquid of containing 40 ' above be applied with a directed force F, with controlling flow to by the flow of the electroplate liquid of electroplating part and speed.
See also Fig. 4, the third implementation method for electro-plating method of the present invention, with first kind of different being of implementation method, in this implementation method, base 2 " in passage 20 " is made up of the upper channel 21 that is connected " and lower passage 22 " two portions, and the radius of upper channel 21 " radius less than lower passage 22 "; One vacuum pump 60 " is put into lower passage 22 ", its intermediate pump 60 " upper end open 61 " and upper channel 21 " the lower end corresponding, vacuum pump 60 " lower ending opening 62 " is " corresponding with returnable 30.Open vacuum pump 60 " operating switch (not drawing among the figure); vacuum pump 60 " just can be positioned at the top electroplate liquid produce a downward suction, make in the upper channel 21 " in electroplate liquid quicken to flow into vacuum pump 60 ", in " flowing to returnable 30 " via vacuum pump 60 then, like this, directive is electroplated the speed at position 51 " electroplate liquid 40 " and also will be accelerated, thus this method also can controlling flow to by the flow of the electroplate liquid of electroplating part and speed.
Certainly, also can be not only to the electroplate liquid of being contained in the container apply a pressure but also be positioned at electroplated the position below passage be provided with vacuum pump, with flow and the speed of controlling flow to the electroplate liquid of being electroplated the position.
Certainly, also can adjust the size of the opening of container, to satisfy the requirement of being electroplated the position; Also can replace vacuum pump by other getter device, to reach same effect.
In the foregoing description, be after establishing with electroplanting device with by electroplating part placement group, again electroplating solution is placed in the container, begin to electroplate, certainly, those skilled in the art are easy to associate alternate manner, as the opening part with container switch knob are set, with the outflow and the flow of control electroplate liquid.
Compare with existing Way by Brush Plating Technique, electro-plating method of the present invention adopts electroplating solution directly and by electroplating part is contacted, therebetween not by other material, thereby do not exist damage by the possibility of electroplating part, and, can limit galvanized areal extent very little, can waste material, thereby reduce cost.
Certainly, those skilled in the art understand easily, and electro-plating method of the present invention also can be used for electroplating other part except that electric connector terminal.
Claims (8)
1. electro-plating method is characterized in that this electro-plating method may further comprise the steps: a container that is provided with opening is provided; One base that is provided with passage is provided; To be positioned between container and the base by electroplating part, and make and to aim at opening at the plating position, be positioned at directly over the passage; Electroplate liquid is injected in the said vesse, and make electroplate liquid flow out arrival by on the electroplating part, and flow out via passage from opening.
2. electro-plating method as claimed in claim 1 is characterized in that: this electro-plating method further may further comprise the steps: the electroplate liquid of being contained in the container is applied a pressure.
3. electro-plating method as claimed in claim 1 is characterized in that: this electro-plating method further may further comprise the steps: be provided with the getter device that can produce a downward suction to the electroplate liquid that is positioned at the top in this passage.
4. electro-plating method as claimed in claim 1, it is characterized in that: this electro-plating method further may further comprise the steps: the electroplate liquid of being contained in the container is applied a pressure, be provided with the getter device that can produce a downward suction to the electroplate liquid above being positioned at simultaneously in above-mentioned passage.
5. electro-plating method as claimed in claim 4 is characterized in that: this getter device is a vacuum pump.
6. electroplanting device that is exclusively used in the described electro-plating method of claim 1, it is used for plated metal by electroplating part, it is characterized in that: this electroplanting device comprises that one is used for holding the container of electroplate liquid, this container is provided with opening, this opening size and the size of being electroplated the position by the need of electroplating part are about equally, and a base that is provided with passage, described passage is positioned at the below of this opening.
7. electroplanting device as claimed in claim 6 is characterized in that: this electroplanting device further comprises the device for exerting that can exert pressure to the electroplate liquid of being contained in the container.
8. electroplanting device as claimed in claim 6 is characterized in that: be provided with the getter device that can produce a downward suction to the electroplate liquid that is positioned at the top in this passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100150109A CN100338264C (en) | 2004-01-05 | 2004-01-05 | Electroplating method and special electroplating device using said electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100150109A CN100338264C (en) | 2004-01-05 | 2004-01-05 | Electroplating method and special electroplating device using said electroplating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1556254A CN1556254A (en) | 2004-12-22 |
| CN100338264C true CN100338264C (en) | 2007-09-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100150109A Expired - Fee Related CN100338264C (en) | 2004-01-05 | 2004-01-05 | Electroplating method and special electroplating device using said electroplating method |
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| Country | Link |
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| CN (1) | CN100338264C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102851724A (en) * | 2011-06-30 | 2013-01-02 | 扬州市金杨电镀设备有限公司 | Electroplating solution recovery device |
| CN102330085B (en) * | 2011-09-13 | 2012-10-03 | 南京航空航天大学 | Composite processing method and device of multilayer film by chemical plating and jet electroplating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57114689A (en) * | 1981-01-06 | 1982-07-16 | Seiko Epson Corp | Partial plating method |
| JPS57174491A (en) * | 1981-04-21 | 1982-10-27 | Nippon Abionikusu Kk | Method and device for electroplating |
| US4367123A (en) * | 1980-07-09 | 1983-01-04 | Olin Corporation | Precision spot plating process and apparatus |
-
2004
- 2004-01-05 CN CNB2004100150109A patent/CN100338264C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4367123A (en) * | 1980-07-09 | 1983-01-04 | Olin Corporation | Precision spot plating process and apparatus |
| JPS57114689A (en) * | 1981-01-06 | 1982-07-16 | Seiko Epson Corp | Partial plating method |
| JPS57174491A (en) * | 1981-04-21 | 1982-10-27 | Nippon Abionikusu Kk | Method and device for electroplating |
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| Publication number | Publication date |
|---|---|
| CN1556254A (en) | 2004-12-22 |
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