CN102268718B - Input equipment, electroplating device and electroplating method using electroplating device - Google Patents
Input equipment, electroplating device and electroplating method using electroplating device Download PDFInfo
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- CN102268718B CN102268718B CN 201110195405 CN201110195405A CN102268718B CN 102268718 B CN102268718 B CN 102268718B CN 201110195405 CN201110195405 CN 201110195405 CN 201110195405 A CN201110195405 A CN 201110195405A CN 102268718 B CN102268718 B CN 102268718B
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Abstract
The invention provides input equipment, an electroplating device and an electroplating method using the electroplating device. The electroplating device is used for electroplating a piece to be electroplated, and comprises an electroplating tank for storing an electroplating solution, at least one first input power supply for conducting the electroplating solution, input equipment located above the electroplating tank and at least one second input power supply for conducting a liquid metal, wherein the piece to be electroplated has at least one point to be electroplated; the point to be electroplated is immersed in the electroplating solution; the input equipment comprises a holding seat with a holding space, at least one probe fixed on the holding seat and the liquid metal stored in the holding space; the upper end of the probe conducts the liquid metal, and the lower end of the probe downwards conducts the point to be electroplated; the first input power supply and the second input power supply are used for separately providing a positive electrode current and a negative electrode current, thereby depositing the cation of the metal to be electroplated in the electroplating solution on the point to be electroplated to form a metal pad; and electroplating can be achieved without designing complicated circuits.
Description
Technical field
The present invention relates to a kind of input unit, electroplanting device and utilize this electroplanting device to carry out electric plating method, refer in particular to a kind of electroplanting device that utilizes in the method for the enterprising electroplating of circuit card.
Background technology
Continuous segmentation along with suitability for industrialized production, continuing to bring out of novel process novel material, the design effect that is applied in actual product is also maked rapid progress, plating is a kind of technology that we often will relate in design, plating refers to pass through electrolytic action, make the positively charged ion of desiring metallizing in the plating bath deposit out in base metal surface, form a kind of method of surface finish of coating, to increase its wear resistance, corrodibility, electroconductibility and protective etc., be to prolong product important assurance and the measure in work-ing life.
A common circuit card is all electroplated and is provided with a plurality of metal gaskets, because described circuit card all is multilayer, if desired with the disposable plating of a plurality of described metal gaskets, then need elder generation in the conducting wire of described circuit card indoor design complexity, make the conducting wire short circuit, certainly, described circuit card inside also is provided with complicated signal line, again described circuit card is positioned in the electroplating solution that contains the plating metal ion, connect the mode of power supply by electron ion displacement then and be plated on described circuit board surface with a plurality of described metal gaskets are disposable, cut off even cut away the conducting wire at last again, thereby make the signal line of described circuit card inside be able to works better, yet this plating mode is owing to need the complicated conducting wire of design, in advance must short circuit, occupied the limited space of described circuit card, be unfavorable for the development of product precise treatment, and complex procedures, cost is higher.
In addition, this kind plating mode can only carry out integral body to a plurality of described metal gasket of described circuit card to be electroplated, and can not satisfy the demand of the described metal gasket of client's parcel plating.
And, along with present communication, computer industry all develop to smart, little, light aspect, the spacing of per two described two metal gaskets of described circuit board surface also reduces thereupon, adopt this electro-plating method, then the design of conducting wire needs complicated more intensive, so cause the short circuit between the circuit probably, thereby influence the use of described circuit card.
Therefore, be necessary to design a kind of new input unit, electroplanting device and utilize this electroplanting device to carry out electric plating method, to overcome above-mentioned disappearance.
Summary of the invention
Creation purpose of the present invention is to provide a kind of and can carries out input unit, the electroplanting device of parcel plating and utilize this electroplanting device to carry out electric plating method on circuit card.
In order to achieve the above object, input unit of the present invention, electroplanting device and utilize this electroplanting device to carry out electric plating method and adopt following technical scheme:
A kind of electroplanting device, in order to electroplate an electroplated spare, described electroplated spare upper surface has at least one electroplated point, it comprises: a plating tank, in order to storE electroplate liquid, described electroplated spare is positioned at described plating tank, and described electroplated point is placed up, and described electroplated is selected and is dipped in the described electroplate liquid; At least one first input power supply is in order to the described electroplate liquid of conducting; One input unit, be positioned at the top of described plating tank, described input unit comprises a holding seat, described holding seat has a receiving space, at least one probe stationary is in described holding seat, and one liquid metal be stored in the described receiving space the described liquid metal of described probe upper end conducting, the described electroplated point of described probe lower ends downward conducting; At least one second input power supply is in order to the described liquid metal of conducting.
A kind of electroplanting device that utilizes carries out electric plating method, in order to electroplate an electroplated spare, described electroplated spare upper surface has at least one electroplated point, and it may further comprise the steps: a plating tank is provided, described electroplated spare is positioned in the described plating tank, and described electroplated point is placed up; Provide electroplate liquid to storE in described plating tank, described electroplated is selected and is dipped in the described electroplate liquid; Provide at least one first input power supply, the described electroplate liquid of the described first input power turn-on; At least one second input power supply is provided, conducting one input unit, described input unit is positioned at the top of described plating tank, described input unit comprises that a holding seat stores a liquid metal, at least one probe stationary is in described holding seat and the described liquid metal of conducting, and described probe lower end is dipped in the described electroplate liquid and the described electroplated point of conducting; The described first input power supply and the described second input power supply provide positive electrode current and a cathodal current respectively, thereby the cationic deposition of desire metallizing in the described electroplate liquid is formed a metal gasket to the described electroplated point upper surface of described electroplated spare.
A kind of input unit, it comprises a holding seat, described holding seat has a receiving space, at least one probe stationary is in described holding seat, and one liquid metal be stored in the described receiving space, the described liquid metal of described probe upper end conducting, described probe lower ends downward manifests described holding seat; At least one first input power supply, the described probe of described first input power turn-on lower end; At least one second input power supply is in order to the described liquid metal of conducting.
Compared with prior art, the present invention has the following advantages:
Utilize described probe to come described electroplated spare is electroplated, quantity and the position that need determine described probe according to quantity and the position of described electroplated point only, because the described liquid metal of described probe upper end conducting, the described electroplate liquid of described probe lower end conducting and described electroplated point, so when providing described anodal current lead-through the described second input power supply, when providing described cathodal current conducting described first to import power supply, thereby will desire the cationic deposition of metallizing in the described electroplate liquid to the described electroplated point of described electroplated spare, upper surface in described electroplated point forms described metal gasket, so do not need to design complicated circuit, do not need short circuit in advance can realize electroplating, be conducive to the precise treatment development of product, problem of short-circuit between the circuit can not appear because of plating, and operation is simple, and is with low cost.
In addition, the increase and decrease of the quantity of the described metal gasket that the quantity of described probe can be electroplated as required to reach the purpose of parcel plating, is satisfied many-sided demand of client, and development space is big.
Because described probe is to be arranged in the described holding seat, described probe contacts when described electroplated point is electroplated can produce the situation of upper and lower displacement, get off for a long time, described probe weares and teares easily, and utilize described liquid metal to do bridge between the upper end of probe described in the present invention and the described second input power supply, to reach the purpose of electric connection, because described liquid metal can play lubricated effect, thereby reduce the degree of injury of described probe, prolonged the work-ing life of product.
In addition, described input unit also can be used as to detect and uses.
[description of drawings]
Fig. 1 is the exploded sectional view of electroplanting device of the present invention;
Fig. 2 is the local assembled sectional view of electroplanting device of the present invention;
Fig. 3 is the frontview of Fig. 2;
Fig. 4 assembles input unit, electroplanting device and utilizes electroplanting device to carry out the schema of electric plating method for the present invention.
The drawing reference numeral explanation of embodiment:
Plating tank 1 electroplate liquid 2 first input power supplys 3 regulating blocks 4
Holding seat 5 through holes 51 perforation 52 probes 6
Oil sealing 7 liquid metals 8 elastic caoutchoucs 9 second input power supplys 10
[embodiment]
For ease of better understanding purpose of the present invention, structure, feature and effect etc., existing by reference to the accompanying drawings with embodiment to input unit of the present invention, electroplanting device and utilize this electroplanting device to carry out electric plating method to be described further.
Please refer to Fig. 1 to Fig. 3, be electroplanting device of the present invention, it comprises a plating tank 1, storE the electroplate liquid 2 in described plating tank 1, one first input power supply 3, the described electroplate liquid 2 of conducting, part is soaked and is located in the described electroplate liquid 2, one input unit (not label) is positioned at the top of described plating tank 1, and described input unit comprises a holding seat 5 and is fixed in a plurality of probes 6 of described holding seat 5, (quantity of described probe 6 also can be one in other embodiments), described probe 6 lower ends downward are revealed in described holding seat 5 and the described electroplate liquid 2 of conducting, the described first input power supply of the further conducting in described probe 6 lower ends 3, one liquid metals 8, be positioned at described holding seat 5, described liquid metal 8, the one second input power supplys 10 of described probe 6 upper end conductings, the described liquid metal 8 of conducting.
The material of described plating tank 1 can be insulation materials such as plastic cement, pottery, also can be conductive material, the described first input power supply 3 is fixed in the cell wall of described plating tank 1, the described first input power supply, 3 parts are soaked and are located in the described electroplate liquid 2, another part is revealed in outside the described electroplate liquid 2, and contains a plurality of metal ions (not label) in the described electroplate liquid 2.
One regulating block 4 also is set in the described plating tank 1, and described regulating block 4 is positioned at the bottom surface of described plating tank 1.
Described holding seat 5 has a receiving space (not label), described liquid metal 8 is stored in the described receiving space, described input unit also comprises an elastic caoutchouc 9, and described elastic caoutchouc 9 is located in the described receiving space and is positioned at described liquid metal 8 tops, in order to the described probe of butt 6 upper ends.
The corresponding a plurality of described probes 6 of the diapire of described holding seat 5 have provided a plurality of through holes 51, a plurality of described through holes 51 connect for a plurality of described probes 6 respectively, (in other embodiments the quantity of described through hole 51 also can for one with corresponding with described probe 6), the below that described through hole 51 is revealed in described holding seat 5 is passed in described probe 6 lower ends, described probe 6 upper ends are contact head (not label), in order to contact described liquid metal 8, and the external diameter of described contact head is greater than the internal diameter of described through hole 51, being provided with an oil sealing 7 in the described holding seat 5 passes through downwards for described probe 6, described oil sealing 7 is positioned at the diapire of described holding seat 5, be that described oil sealing 7 is positioned at described through hole 51, the external diameter of described oil sealing 7 is identical with the internal diameter of described through hole 51, in other embodiments, described oil sealing 7 also can be positioned at described receiving space and against the diapire of described holding seat 5, so, the external diameter of described oil sealing 7 can be greater than the internal diameter of described through hole 51, and is positioned at upper shed place of described through hole 51.The lower ends downward of described probe 6 is gradually-reducing shape.
The corresponding described second input power supply 10 of the roof of described holding seat 5 is provided with a perforation 52, and the described second input power supply 10 lower ends are passed described perforation 52 and are positioned at described receiving space.
Please refer to Fig. 1 to Fig. 4, described electroplanting device is in order to electroplate an electroplated spare, and in the present embodiment, described unplated piece is a circuit card 11 to be plated, also can be other electroplated spare in other embodiments, described circuit card 11 upper surfaces to be plated have a plurality of electroplated points 111.
At first, the described first input power supply 3 is fixed in the cell wall of described plating tank 1, again described regulating block 4 is positioned on the bottom surface of described plating tank 1, then described electroplate liquid 2 is storEd in described plating tank 1, make the described first input power supply, 3 parts be dipped in the described electroplate liquid 2, another part is revealed in outside the described electroplate liquid 2, and described regulating block 4 all is dipped in the described electroplate liquid 2.
Then, described circuit card 11 to be plated is positioned on the described regulating block 4 in the described plating tank 1, described electroplated point 111 is placed up, and described circuit card to be plated 11 all is dipped in the described electroplate liquid 2.
Thereupon, provide described input unit to be positioned at the top of described plating tank 1, the assembling process of described input unit is: earlier a plurality of described oil sealings 7 are sheathed on respectively outside a plurality of described probes 6 lower ends, again a plurality of described probes 6 are from top to bottom packed in a plurality of described through holes 51, then described liquid metal 8 is loaded in the described receiving space of described holding seat 5, and make described probe 6 upper end portions be dipped in and the described liquid metal 8 of conducting in, make described oil sealing 7 be positioned at described through hole 51, with the described liquid metal 8 of block by described through hole 51 seepages, described probe 6 lower ends downward manifest described holding seat 5, (also can be that described oil sealing 7 is positioned at described receiving space and against the diapire of described holding seat 5 in other embodiments, so, the external diameter of described oil sealing 7 can be greater than the internal diameter of described through hole 51, and be positioned at upper shed place of described through hole 51, with the described liquid metal 8 of block by described through hole 51 seepages), on described probe 6 upper ends, place described elastic caoutchouc 9 then, make the roof of the described holding seat 5 of described elastic caoutchouc 9 butts, at last, the described second input power supply 10 is entered described perforation 52 and part is dipped in and the described liquid metal 8 of conducting in.
At last, make end, a plurality of described probes 6 lower end locate a plurality of described electroplated points 111 of downward conducting respectively, provide an anodal current lead-through the described second input power supply 10, provide a cathodal current conducting the described first input power supply 3, (in other embodiments also can be for providing described anodal current lead-through the described first input power supply 3, provide described cathodal current conducting the described second input power supply 10), principle by the negative ions displacement, thereby will be in the described electroplate liquid 2 desire the cationic deposition of metallizing to the described electroplated point 111 of described circuit card 11 to be plated, form a metal gasket in the upper surface of described electroplated point 111.
Whether the performance that described input unit also can be applicable to testing electronic element is good etc., and specifically the principle of operation of the principle of how to operate and general testing electronic element is roughly the same, is not repeated at this.
In sum, input unit of the present invention, electroplanting device and utilize this electroplanting device to carry out electric plating method to have following advantage:
1. utilize described probe 6 to come described circuit card 11 to be plated is electroplated, quantity and the position that need determine described probe 6 according to quantity and the position of described electroplated point 111 only, because the described liquid metal 8 of described probe 6 upper end conductings, the described described electroplate liquid 2 of probe 6 lower end conductings and described electroplated point 111, so when providing described anodal current lead-through the described second input power supply 10, when providing described cathodal current conducting described first to import power supply 3, thereby will desire the cationic deposition of metallizing in the described electroplate liquid 2 to the described electroplated point 111 of described circuit card 11 to be plated, upper surface in described electroplated point 111 forms described metal gasket, so do not need to design complicated circuit, do not need short circuit in advance can realize electroplating, be conducive to the precise treatment development of product, problem of short-circuit between the circuit can not appear because of plating, and operation is simple, and is with low cost.
2. the quantity of the described metal gasket that can electroplate as required of the quantity of described probe 6 increase and decrease to reach the purpose of parcel plating, is satisfied many-sided demand of client, and development space is big.
3. because described probe 6 is to be arranged in the described holding seat 5, the described electroplated point 111 of described probe 6 contacts can produce the situation of upper and lower displacement when electroplating, get off for a long time, described probe 6 weares and teares easily, and utilize described liquid metal 8 to do bridge between 6 upper ends of probe described in the present invention and the described second input power supply 10, to reach the purpose of electric connection, because described liquid metal 8 can play lubricated effect, thereby reduce the degree of injury of described probe 6, prolonged the work-ing life of product.
4. a plurality of described oil sealings 7 are set to be sheathed on respectively outside a plurality of described probes 6 lower ends, make described oil sealing 7 be positioned at described through hole 51, the external diameter of described oil sealing 7 is identical with the internal diameter of described through hole 51, perhaps, described oil sealing 7 is positioned at described receiving space and against the diapire of described holding seat 5, the external diameter of described oil sealing 7 is greater than the external diameter of described through hole 51, so all can the described liquid metal 8 of block by described through hole 51 seepages.
5. described elastic caoutchouc 9 is positioned at the roof of described liquid metal 8 tops and the described holding seat 5 of butt, simultaneously described probe 6 is the described elastic caoutchouc 9 of butt upwards, the location that can guarantee described probe 6 is good, and, because described elastic caoutchouc 9 has elasticity, described probe 6 has can up and down space, so, can reduce the degree of injury of described probe 6.
Only more than describe the explanation for the present invention's preferred embodiment in detail, non-so limitation the present invention's claim is so all this creation of utilization specification sheetss and the equivalence techniques variation for it of diagramatic content institute all are contained in the claim of this creation.
Claims (10)
1. electroplanting device, in order to electroplate an electroplated spare, described electroplated spare upper surface has at least one electroplated point, it is characterized in that, comprising:
One plating tank, in order to storE electroplate liquid, described electroplated spare is positioned at described plating tank, and described electroplated point is placed up, and described electroplated is selected and is dipped in the described electroplate liquid;
At least one first input power supply is in order to the described electroplate liquid of conducting;
One input unit, be positioned at the top of described plating tank, described input unit comprises a holding seat, described holding seat has a receiving space, at least one probe stationary is in described holding seat, and one liquid metal be stored in the described receiving space the described liquid metal of described probe upper end conducting, the described electroplated point of described probe lower ends downward conducting;
At least one second input power supply is in order to the described liquid metal of conducting.
2. electroplanting device as claimed in claim 1 is characterized in that: an elastic caoutchouc is located in the described receiving space in order to the described probe of butt upper end.
3. electroplanting device as claimed in claim 2 is characterized in that: described elastic caoutchouc is positioned at described liquid metal top.
4. electroplanting device as claimed in claim 1 is characterized in that: the diapire of described holding seat has provided a through hole and has connected for described probe.
5. electroplanting device as claimed in claim 4 is characterized in that: described probe upper end is contact head, and in order to contacting described liquid metal, and the external diameter of described contact head is greater than the internal diameter of described through hole.
6. electroplanting device as claimed in claim 1 is characterized in that: be provided with an oil sealing in the described holding seat and pass through downwards for described probe.
7. electroplanting device as claimed in claim 6 is characterized in that: described oil sealing is positioned at described receiving space and against the diapire of described holding seat.
8. electroplanting device as claimed in claim 6, it is characterized in that: described oil sealing is positioned at the diapire of described holding seat.
9. one kind is utilized electroplanting device to carry out electric plating method, and in order to electroplate an electroplated spare, described electroplated spare upper surface has at least one electroplated point, it is characterized in that, may further comprise the steps:
One plating tank is provided, described electroplated spare is positioned in the described plating tank, described electroplated point is placed up;
Provide electroplate liquid to storE in described plating tank, described electroplated is selected and is dipped in the described electroplate liquid;
Provide at least one first input power supply, the described electroplate liquid of the described first input power turn-on;
At least one second input power supply is provided, conducting one input unit, described input unit is positioned at the top of described plating tank, described input unit comprises that a holding seat stores a liquid metal, at least one probe stationary is in described holding seat and the described liquid metal of conducting, and described probe lower end is dipped in the described electroplate liquid and the described electroplated point of conducting;
The described first input power supply and the described second input power supply provide positive electrode current and a cathodal current respectively, thereby the cationic deposition of desire metallizing in the described electroplate liquid is formed a metal gasket to the described electroplated point upper surface of described electroplated spare.
10. an input unit is characterized in that, comprising:
One holding seat, described holding seat has a receiving space, and at least one probe stationary is in described holding seat, and a liquid metal is stored in the described receiving space, the described liquid metal of described probe upper end conducting, described probe lower ends downward manifests described holding seat;
At least one first input power supply, the described probe of described first input power turn-on lower end;
At least one second input power supply is in order to the described liquid metal of conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110195405 CN102268718B (en) | 2011-07-13 | 2011-07-13 | Input equipment, electroplating device and electroplating method using electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110195405 CN102268718B (en) | 2011-07-13 | 2011-07-13 | Input equipment, electroplating device and electroplating method using electroplating device |
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| Publication Number | Publication Date |
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| CN102268718A CN102268718A (en) | 2011-12-07 |
| CN102268718B true CN102268718B (en) | 2013-07-10 |
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| CN 201110195405 Active CN102268718B (en) | 2011-07-13 | 2011-07-13 | Input equipment, electroplating device and electroplating method using electroplating device |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105350038B (en) * | 2014-08-22 | 2017-11-07 | 王元谷 | Local electroplating device and selective plating method |
| TW201720969A (en) * | 2015-12-14 | 2017-06-16 | 台灣先進系統股份有限公司 | Adjustable insoluable anode plate for cu-pillar electroplating and method thereof |
| CN108754593B (en) * | 2018-04-19 | 2020-06-19 | 肇庆远东工业电镀设备科技有限公司 | Electroplating roller |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1494369A (en) * | 2002-09-14 | 2004-05-05 | Lg电子株式会社 | Electroplating method of prited circuit board |
| CN1688753A (en) * | 2002-09-04 | 2005-10-26 | 埃托特克德国有限公司 | Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| CN201402860Y (en) * | 2009-01-05 | 2010-02-10 | 番禺得意精密电子工业有限公司 | Electrical connector |
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2011
- 2011-07-13 CN CN 201110195405 patent/CN102268718B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1688753A (en) * | 2002-09-04 | 2005-10-26 | 埃托特克德国有限公司 | Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| CN1494369A (en) * | 2002-09-14 | 2004-05-05 | Lg电子株式会社 | Electroplating method of prited circuit board |
| CN201402860Y (en) * | 2009-01-05 | 2010-02-10 | 番禺得意精密电子工业有限公司 | Electrical connector |
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| CN102268718A (en) | 2011-12-07 |
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