JPS57112043A - Pick up apparatus for object - Google Patents

Pick up apparatus for object

Info

Publication number
JPS57112043A
JPS57112043A JP18783080A JP18783080A JPS57112043A JP S57112043 A JPS57112043 A JP S57112043A JP 18783080 A JP18783080 A JP 18783080A JP 18783080 A JP18783080 A JP 18783080A JP S57112043 A JPS57112043 A JP S57112043A
Authority
JP
Japan
Prior art keywords
pincette
chip
main part
tape
pick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18783080A
Other languages
Japanese (ja)
Inventor
Kyohei Tamaki
Naoki Sugao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18783080A priority Critical patent/JPS57112043A/en
Publication of JPS57112043A publication Critical patent/JPS57112043A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)

Abstract

PURPOSE:To perform reliable picking up without break in a chip by a method wherein when the semiconductor chip which is placed and attached on a tape with a proper spacing is picked up, on a pair of arms of a pincette which bring the chip between, a driving device to close them is provided. CONSTITUTION:Dicing is performed after a semiconductor wafer is attached on an extendable tape 13, and by extending the tape 13, semiconductor chips 14 which is formed by dicing are separated to have a specified distance individually, and they are fixed on an extending ring 11. Next to pick up each chip 14 by bringing them between a main part 22 of a pincette which constitutes a pick-up mechanism 18, narrowed parts are provided in the midway on a pair of arms in the main part 22 of the pincette, and spring action is given, a driving mechanism 23 is installed below them, and arm is opened and closed by means of pneumatic cylinder. And the main part 18 of the pincette is supported by arm 21 at its upper side.
JP18783080A 1980-12-29 1980-12-29 Pick up apparatus for object Pending JPS57112043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18783080A JPS57112043A (en) 1980-12-29 1980-12-29 Pick up apparatus for object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18783080A JPS57112043A (en) 1980-12-29 1980-12-29 Pick up apparatus for object

Publications (1)

Publication Number Publication Date
JPS57112043A true JPS57112043A (en) 1982-07-12

Family

ID=16212975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18783080A Pending JPS57112043A (en) 1980-12-29 1980-12-29 Pick up apparatus for object

Country Status (1)

Country Link
JP (1) JPS57112043A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62245644A (en) * 1986-04-18 1987-10-26 Toshiba Seiki Kk Semiconductor pellet pickup method
JPS6379644U (en) * 1986-11-12 1988-05-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62245644A (en) * 1986-04-18 1987-10-26 Toshiba Seiki Kk Semiconductor pellet pickup method
JPS6379644U (en) * 1986-11-12 1988-05-26

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