JPS5434775A - Wafer handling device - Google Patents

Wafer handling device

Info

Publication number
JPS5434775A
JPS5434775A JP10049277A JP10049277A JPS5434775A JP S5434775 A JPS5434775 A JP S5434775A JP 10049277 A JP10049277 A JP 10049277A JP 10049277 A JP10049277 A JP 10049277A JP S5434775 A JPS5434775 A JP S5434775A
Authority
JP
Japan
Prior art keywords
wafer
handling device
wafer handling
edge
breakdown
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10049277A
Other languages
Japanese (ja)
Other versions
JPS613637B2 (en
Inventor
Masakuni Akiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10049277A priority Critical patent/JPS5434775A/en
Publication of JPS5434775A publication Critical patent/JPS5434775A/en
Publication of JPS613637B2 publication Critical patent/JPS613637B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To avoid the breakdown and contamination of a wafer by handling the wafer by the use of a plural number of arm units to which an edge sensor detecting the edge of the wafer and a vacuum tweezers absorbing the wafer are provided at a fixed interval.
COPYRIGHT: (C)1979,JPO&Japio
JP10049277A 1977-08-24 1977-08-24 Wafer handling device Granted JPS5434775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10049277A JPS5434775A (en) 1977-08-24 1977-08-24 Wafer handling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10049277A JPS5434775A (en) 1977-08-24 1977-08-24 Wafer handling device

Publications (2)

Publication Number Publication Date
JPS5434775A true JPS5434775A (en) 1979-03-14
JPS613637B2 JPS613637B2 (en) 1986-02-03

Family

ID=14275418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10049277A Granted JPS5434775A (en) 1977-08-24 1977-08-24 Wafer handling device

Country Status (1)

Country Link
JP (1) JPS5434775A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247821A (en) * 1989-02-24 1990-10-03 Corning Inc Disk for magnetic starage device
JPH0640572A (en) * 1982-05-24 1994-02-15 Proconics Internatl Inc Device for inserting wafer

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323639Y2 (en) * 1986-10-13 1991-05-23
JPH01112518U (en) * 1988-01-25 1989-07-28

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0640572A (en) * 1982-05-24 1994-02-15 Proconics Internatl Inc Device for inserting wafer
JPH0648575A (en) * 1982-05-24 1994-02-22 Proconics Internatl Inc Device for moving wafer
JPH02247821A (en) * 1989-02-24 1990-10-03 Corning Inc Disk for magnetic starage device

Also Published As

Publication number Publication date
JPS613637B2 (en) 1986-02-03

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