JPS57110641A - Electrical contact material for sealing - Google Patents

Electrical contact material for sealing

Info

Publication number
JPS57110641A
JPS57110641A JP55186406A JP18640680A JPS57110641A JP S57110641 A JPS57110641 A JP S57110641A JP 55186406 A JP55186406 A JP 55186406A JP 18640680 A JP18640680 A JP 18640680A JP S57110641 A JPS57110641 A JP S57110641A
Authority
JP
Japan
Prior art keywords
electrical contact
sealing
superior
contact material
zno
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55186406A
Other languages
Japanese (ja)
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP55186406A priority Critical patent/JPS57110641A/en
Publication of JPS57110641A publication Critical patent/JPS57110641A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain an inexpensive electrical contact material for sealing provided with superior melt sticking resistance and a superior hardly dissipative property equivalent to those of an Ag-CdO material by adding a specified amount of ZnO to Cu.
CONSTITUTION: This electrical contact material for sealing consists of 0.5W 25wt% ZnO and the balance Cu. By the restricted composition the number of repetitions of melt sticking is reduced as compared to a conventional Cu-CdO contact, and a superior hardly dissipative property is provided. Since no noble metal is used, this material has characteristics such as a low cost.
COPYRIGHT: (C)1982,JPO&Japio
JP55186406A 1980-12-26 1980-12-26 Electrical contact material for sealing Pending JPS57110641A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55186406A JPS57110641A (en) 1980-12-26 1980-12-26 Electrical contact material for sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55186406A JPS57110641A (en) 1980-12-26 1980-12-26 Electrical contact material for sealing

Publications (1)

Publication Number Publication Date
JPS57110641A true JPS57110641A (en) 1982-07-09

Family

ID=16187846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55186406A Pending JPS57110641A (en) 1980-12-26 1980-12-26 Electrical contact material for sealing

Country Status (1)

Country Link
JP (1) JPS57110641A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104650857A (en) * 2015-01-30 2015-05-27 长安大学 Application of copper ions for enhancing visible light emission intensity of ZnO nanometer material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522113A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Telephone current suplying system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522113A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Telephone current suplying system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104650857A (en) * 2015-01-30 2015-05-27 长安大学 Application of copper ions for enhancing visible light emission intensity of ZnO nanometer material

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