JPS5710952A - Resin sealed type semiconductor device - Google Patents

Resin sealed type semiconductor device

Info

Publication number
JPS5710952A
JPS5710952A JP8700280A JP8700280A JPS5710952A JP S5710952 A JPS5710952 A JP S5710952A JP 8700280 A JP8700280 A JP 8700280A JP 8700280 A JP8700280 A JP 8700280A JP S5710952 A JPS5710952 A JP S5710952A
Authority
JP
Japan
Prior art keywords
resin
nut
bolt
lead terminals
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8700280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130747B2 (enrdf_load_stackoverflow
Inventor
Hajime Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8700280A priority Critical patent/JPS5710952A/ja
Publication of JPS5710952A publication Critical patent/JPS5710952A/ja
Publication of JPS6130747B2 publication Critical patent/JPS6130747B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP8700280A 1980-06-23 1980-06-23 Resin sealed type semiconductor device Granted JPS5710952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8700280A JPS5710952A (en) 1980-06-23 1980-06-23 Resin sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8700280A JPS5710952A (en) 1980-06-23 1980-06-23 Resin sealed type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5710952A true JPS5710952A (en) 1982-01-20
JPS6130747B2 JPS6130747B2 (enrdf_load_stackoverflow) 1986-07-15

Family

ID=13902671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8700280A Granted JPS5710952A (en) 1980-06-23 1980-06-23 Resin sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5710952A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0591900A3 (en) * 1992-10-05 1994-11-23 Fuji Electric Co Ltd Resin-sealed semiconductor device.
US5825085A (en) * 1995-09-01 1998-10-20 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device, armoring case thereof and method for manufacturing the same
JP2012178528A (ja) * 2011-02-28 2012-09-13 Sansha Electric Mfg Co Ltd 半導体装置
JP2013102242A (ja) * 2013-03-05 2013-05-23 Mitsubishi Electric Corp パワー半導体装置
JP2013219110A (ja) * 2012-04-05 2013-10-24 Shizuki Electric Co Inc コンデンサ
JP2014017446A (ja) * 2012-07-11 2014-01-30 Toyota Industries Corp 電子部品モジュール、及び電子部品モジュールの製造方法
DE102011076235B4 (de) * 2010-06-01 2014-07-10 Mitsubishi Electric Corp. Leistungshalbleitervorrichtung
JP2019145738A (ja) * 2018-02-23 2019-08-29 パナソニックＩｐマネジメント株式会社 コンデンサ

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0591900A3 (en) * 1992-10-05 1994-11-23 Fuji Electric Co Ltd Resin-sealed semiconductor device.
US5825085A (en) * 1995-09-01 1998-10-20 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device, armoring case thereof and method for manufacturing the same
DE102011076235B4 (de) * 2010-06-01 2014-07-10 Mitsubishi Electric Corp. Leistungshalbleitervorrichtung
US8829534B2 (en) 2010-06-01 2014-09-09 Mitsubishi Electric Corporation Power semiconductor device
JP2012178528A (ja) * 2011-02-28 2012-09-13 Sansha Electric Mfg Co Ltd 半導体装置
JP2013219110A (ja) * 2012-04-05 2013-10-24 Shizuki Electric Co Inc コンデンサ
JP2014017446A (ja) * 2012-07-11 2014-01-30 Toyota Industries Corp 電子部品モジュール、及び電子部品モジュールの製造方法
JP2013102242A (ja) * 2013-03-05 2013-05-23 Mitsubishi Electric Corp パワー半導体装置
JP2019145738A (ja) * 2018-02-23 2019-08-29 パナソニックＩｐマネジメント株式会社 コンデンサ

Also Published As

Publication number Publication date
JPS6130747B2 (enrdf_load_stackoverflow) 1986-07-15

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