JPS57109345A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57109345A
JPS57109345A JP55185917A JP18591780A JPS57109345A JP S57109345 A JPS57109345 A JP S57109345A JP 55185917 A JP55185917 A JP 55185917A JP 18591780 A JP18591780 A JP 18591780A JP S57109345 A JPS57109345 A JP S57109345A
Authority
JP
Japan
Prior art keywords
nickel
junction
layer
region
solid solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55185917A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6124820B2 (enrdf_load_stackoverflow
Inventor
Yoshio Ito
Mitsuo Kobayashi
Toshio Tetsuya
Osamu Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55185917A priority Critical patent/JPS57109345A/ja
Publication of JPS57109345A publication Critical patent/JPS57109345A/ja
Publication of JPS6124820B2 publication Critical patent/JPS6124820B2/ja
Granted legal-status Critical Current

Links

Classifications

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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP55185917A 1980-12-26 1980-12-26 Semiconductor device Granted JPS57109345A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55185917A JPS57109345A (en) 1980-12-26 1980-12-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55185917A JPS57109345A (en) 1980-12-26 1980-12-26 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57109345A true JPS57109345A (en) 1982-07-07
JPS6124820B2 JPS6124820B2 (enrdf_load_stackoverflow) 1986-06-12

Family

ID=16179133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55185917A Granted JPS57109345A (en) 1980-12-26 1980-12-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57109345A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6124820B2 (enrdf_load_stackoverflow) 1986-06-12

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