JPS57107065A - Method for mounting of integrated circuit - Google Patents
Method for mounting of integrated circuitInfo
- Publication number
- JPS57107065A JPS57107065A JP55184341A JP18434180A JPS57107065A JP S57107065 A JPS57107065 A JP S57107065A JP 55184341 A JP55184341 A JP 55184341A JP 18434180 A JP18434180 A JP 18434180A JP S57107065 A JPS57107065 A JP S57107065A
- Authority
- JP
- Japan
- Prior art keywords
- tape carrier
- ics
- mounting
- longitudinal axis
- right angles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55184341A JPS57107065A (en) | 1980-12-25 | 1980-12-25 | Method for mounting of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55184341A JPS57107065A (en) | 1980-12-25 | 1980-12-25 | Method for mounting of integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57107065A true JPS57107065A (en) | 1982-07-03 |
Family
ID=16151595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55184341A Pending JPS57107065A (en) | 1980-12-25 | 1980-12-25 | Method for mounting of integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57107065A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9535428B2 (en) | 2013-05-20 | 2017-01-03 | Proportion-Air, Inc. | Spring controlled valve |
-
1980
- 1980-12-25 JP JP55184341A patent/JPS57107065A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9535428B2 (en) | 2013-05-20 | 2017-01-03 | Proportion-Air, Inc. | Spring controlled valve |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0083405A3 (en) | Chip carrier for large scale integrated circuits and a method for the fabrication of the carrier | |
DE3470362D1 (en) | Alumina interconnection substrate for an electronic component, and method for its production | |
DE3166926D1 (en) | Batch placement system for electronic components or chips | |
DE3368349D1 (en) | Apparatus for inspecting a circuit pattern drawn on a photomask used in manufacturing large scale integrated circuits | |
GB2140716B (en) | Mounting apparatus for chip type electronic parts on circuit boards | |
DE3062975D1 (en) | Method and apparatus for removing a semiconductor chip from a substrate | |
GB2163901B (en) | A semiconductor integrated circuit device and a process for manufacturing such a device | |
FR2549677B1 (fr) | Procede d'inspection de plaquettes de circuits electroniques | |
GB1541326A (en) | Machine for automatically affixing electronic circuit elements of printed circuits to the substrate thereof | |
FR2553576B1 (fr) | Dispositif a circuits integres a semi-conducteurs et procede de fabrication d'un tel dispositif | |
DE3366774D1 (en) | Method for forming conductive lines and via studs on lsi carrier substrates | |
HK44686A (en) | Semiconductor integrated circuit devices and a process for producing the same | |
EP0164449A3 (en) | Process for producing a semiconductor intergrated circuit device including a misfet | |
EP0182332A3 (en) | Method of processing integrated circuits by photolithography | |
DE3377685D1 (en) | Process and apparatus for unsoldering solder bonded semiconductor devices | |
EP0143004A3 (en) | Apparatus for inspecting mask used for manufacturing integrated circuits | |
FR2299725A1 (fr) | Composant de circuit integre et procede de fabrication d'un tel composant | |
FR2555362B1 (fr) | Procede et dispositif de traitement d'un materiau semi-conducteur, par plasma | |
FR2589279B1 (fr) | Dispositif semi-conducteur electronique pour proteger des circuits integres contre des decharges electrostatiques et procede pour le fabriquer | |
EP0180457A3 (en) | Semiconductor integrated circuit device and method for producing same | |
JPS57107065A (en) | Method for mounting of integrated circuit | |
GB2148593B (en) | Process for manufacturing the isolating regions of a semiconductor integrated circuit device | |
JPS55121669A (en) | Method of forming inactive layer on integrated circuit device having substrate of semiconductor material | |
DE3372432D1 (en) | Monolithic integrated transistor high-frequency quartz oscillator circuit | |
JPS57196557A (en) | Semiconductor device |