JPS57100135A - Preparation of epoxy resin prepreg - Google Patents

Preparation of epoxy resin prepreg

Info

Publication number
JPS57100135A
JPS57100135A JP17610680A JP17610680A JPS57100135A JP S57100135 A JPS57100135 A JP S57100135A JP 17610680 A JP17610680 A JP 17610680A JP 17610680 A JP17610680 A JP 17610680A JP S57100135 A JPS57100135 A JP S57100135A
Authority
JP
Japan
Prior art keywords
solvent
epoxy resin
varnish
alkyl
boiling point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17610680A
Other languages
Japanese (ja)
Other versions
JPS6221370B2 (en
Inventor
Masaaki Otsu
Masahiro Matsumura
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP17610680A priority Critical patent/JPS57100135A/en
Priority to DE19813117960 priority patent/DE3117960A1/en
Priority to US06/261,908 priority patent/US4399257A/en
Publication of JPS57100135A publication Critical patent/JPS57100135A/en
Publication of JPS6221370B2 publication Critical patent/JPS6221370B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prepare a high-quality titled prepreg free from bubbles and residual solvent, by impregnating a substrate with an epoxy resin composition varnish containing a cure assistant such as an organic acid Sn salt and a curing agent such as poly-p-vinylphenol, etc., and drying the varnish.
CONSTITUTION: A substrate is impregnated with a varnish obtained by dissolving (A) an epoxy resin composition containing (i) one or more compounds selected from an organic acid Sn salt (e.g. di-n-butyltin dimalate, etc.), an aluminate of formulaI(R is alkyl or aryl; n is 1W5) (e.g. Al isopropoxide) and an alkoxy group-containing silane compound of formula II (R is alkyl; R' is alkyl or aryl; n is 0W4) (e.g. tetramethoxysilane, etc.) and (ii) a poly-p-vinylphenol (halide) in (B) a mixed solvent composed of 15W30pts.wt. of a ketone solvent having a boiling point of 50W90°C, 6W15pts.wt. of a cellosolve solvent having a boiling point of 110W140°C, and 2W6pts.wt. of a cellosolve acetate solvent having a boiling point of 140W160°C and/or a polar solvent. The varnish is dried to obtain the objective epoxy resin prepreg.
COPYRIGHT: (C)1982,JPO&Japio
JP17610680A 1980-05-10 1980-12-13 Preparation of epoxy resin prepreg Granted JPS57100135A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP17610680A JPS57100135A (en) 1980-12-13 1980-12-13 Preparation of epoxy resin prepreg
DE19813117960 DE3117960A1 (en) 1980-05-10 1981-05-07 EPOXY RESIN COMPOSITION
US06/261,908 US4399257A (en) 1980-05-10 1981-05-08 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17610680A JPS57100135A (en) 1980-12-13 1980-12-13 Preparation of epoxy resin prepreg

Publications (2)

Publication Number Publication Date
JPS57100135A true JPS57100135A (en) 1982-06-22
JPS6221370B2 JPS6221370B2 (en) 1987-05-12

Family

ID=16007790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17610680A Granted JPS57100135A (en) 1980-05-10 1980-12-13 Preparation of epoxy resin prepreg

Country Status (1)

Country Link
JP (1) JPS57100135A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786569A (en) * 1985-09-04 1988-11-22 Ciba-Geigy Corporation Adhesively bonded photostructurable polyimide film
WO1995035336A1 (en) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Thermosetting composition and method of forming topcoating film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786569A (en) * 1985-09-04 1988-11-22 Ciba-Geigy Corporation Adhesively bonded photostructurable polyimide film
US4935320A (en) * 1985-09-04 1990-06-19 Ciba-Geigy Corporation Adhesively bonded photostructurable polyimide film
WO1995035336A1 (en) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Thermosetting composition and method of forming topcoating film
US5821314A (en) * 1994-06-17 1998-10-13 Kansai Paint Company, Limited Thermosetting compositions and methods of forming a finish coat

Also Published As

Publication number Publication date
JPS6221370B2 (en) 1987-05-12

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