JPS57100135A - Preparation of epoxy resin prepreg - Google Patents
Preparation of epoxy resin prepregInfo
- Publication number
- JPS57100135A JPS57100135A JP17610680A JP17610680A JPS57100135A JP S57100135 A JPS57100135 A JP S57100135A JP 17610680 A JP17610680 A JP 17610680A JP 17610680 A JP17610680 A JP 17610680A JP S57100135 A JPS57100135 A JP S57100135A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- epoxy resin
- varnish
- alkyl
- boiling point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prepare a high-quality titled prepreg free from bubbles and residual solvent, by impregnating a substrate with an epoxy resin composition varnish containing a cure assistant such as an organic acid Sn salt and a curing agent such as poly-p-vinylphenol, etc., and drying the varnish.
CONSTITUTION: A substrate is impregnated with a varnish obtained by dissolving (A) an epoxy resin composition containing (i) one or more compounds selected from an organic acid Sn salt (e.g. di-n-butyltin dimalate, etc.), an aluminate of formulaI(R is alkyl or aryl; n is 1W5) (e.g. Al isopropoxide) and an alkoxy group-containing silane compound of formula II (R is alkyl; R' is alkyl or aryl; n is 0W4) (e.g. tetramethoxysilane, etc.) and (ii) a poly-p-vinylphenol (halide) in (B) a mixed solvent composed of 15W30pts.wt. of a ketone solvent having a boiling point of 50W90°C, 6W15pts.wt. of a cellosolve solvent having a boiling point of 110W140°C, and 2W6pts.wt. of a cellosolve acetate solvent having a boiling point of 140W160°C and/or a polar solvent. The varnish is dried to obtain the objective epoxy resin prepreg.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17610680A JPS57100135A (en) | 1980-12-13 | 1980-12-13 | Preparation of epoxy resin prepreg |
DE19813117960 DE3117960A1 (en) | 1980-05-10 | 1981-05-07 | EPOXY RESIN COMPOSITION |
US06/261,908 US4399257A (en) | 1980-05-10 | 1981-05-08 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17610680A JPS57100135A (en) | 1980-12-13 | 1980-12-13 | Preparation of epoxy resin prepreg |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57100135A true JPS57100135A (en) | 1982-06-22 |
JPS6221370B2 JPS6221370B2 (en) | 1987-05-12 |
Family
ID=16007790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17610680A Granted JPS57100135A (en) | 1980-05-10 | 1980-12-13 | Preparation of epoxy resin prepreg |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57100135A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4786569A (en) * | 1985-09-04 | 1988-11-22 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
WO1995035336A1 (en) * | 1994-06-17 | 1995-12-28 | Kansai Paint Company, Limited | Thermosetting composition and method of forming topcoating film |
-
1980
- 1980-12-13 JP JP17610680A patent/JPS57100135A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4786569A (en) * | 1985-09-04 | 1988-11-22 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
US4935320A (en) * | 1985-09-04 | 1990-06-19 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
WO1995035336A1 (en) * | 1994-06-17 | 1995-12-28 | Kansai Paint Company, Limited | Thermosetting composition and method of forming topcoating film |
US5821314A (en) * | 1994-06-17 | 1998-10-13 | Kansai Paint Company, Limited | Thermosetting compositions and methods of forming a finish coat |
Also Published As
Publication number | Publication date |
---|---|
JPS6221370B2 (en) | 1987-05-12 |
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