JPS5698834A - Supporting electrode of semiconductor - Google Patents

Supporting electrode of semiconductor

Info

Publication number
JPS5698834A
JPS5698834A JP11080A JP11080A JPS5698834A JP S5698834 A JPS5698834 A JP S5698834A JP 11080 A JP11080 A JP 11080A JP 11080 A JP11080 A JP 11080A JP S5698834 A JPS5698834 A JP S5698834A
Authority
JP
Japan
Prior art keywords
carbon
ring
arrangement
outer ring
60vol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11080A
Other languages
Japanese (ja)
Other versions
JPS5916406B2 (en
Inventor
Hideo Arakawa
Keiichi Kuniya
Takashi Namekawa
Masabumi Ohashi
Masahiro Aida
Tsuneo Yoshinari
Hitoshi Onuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11080A priority Critical patent/JPS5916406B2/en
Publication of JPS5698834A publication Critical patent/JPS5698834A/en
Publication of JPS5916406B2 publication Critical patent/JPS5916406B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H01L23/4928—Bases or plates or solder therefor characterised by the materials the materials containing carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To control the distribution of a thermal expansion coefficient in the radius direction by arranging rings of carbon fiber in a cupper or its alloys and raising the carbon concentration of the most outer ring higher than that of the most inner ring. CONSTITUTION:The ring of carbon fiber bundle is made to increase the amount of carbon continuously or discontinuously toward the outer ring from the inner ring. By this constitution, since the disorder of the ring arrangement becomes gradually a little towards the outer ring, an effect of controlling the anisotropy of the thermal expansion coefficient of a supporting electrode plate in the radius direction is increased. The arrangement of a cupper covered carbon fiber in spiral state and the winding a fiber bundle having 45-60vol% of carbon in the most outer wire are effective. When the carbon amount is more than 60vol%, a hot press working is difficult. The voids occur among the fiber bundles, and the heat conductivity and the current conductivity deteriorate. In less than 45vol%, the arrangement of wiring is in disorder and its shape forms waves.
JP11080A 1980-01-07 1980-01-07 Semiconductor supporting electrode plate Expired JPS5916406B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11080A JPS5916406B2 (en) 1980-01-07 1980-01-07 Semiconductor supporting electrode plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11080A JPS5916406B2 (en) 1980-01-07 1980-01-07 Semiconductor supporting electrode plate

Publications (2)

Publication Number Publication Date
JPS5698834A true JPS5698834A (en) 1981-08-08
JPS5916406B2 JPS5916406B2 (en) 1984-04-16

Family

ID=11464928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11080A Expired JPS5916406B2 (en) 1980-01-07 1980-01-07 Semiconductor supporting electrode plate

Country Status (1)

Country Link
JP (1) JPS5916406B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008518806A (en) * 2004-11-02 2008-06-05 ソリユテイア・インコーポレイテツド Refractory polymer sheet

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395808U (en) * 1986-12-12 1988-06-21
JPH04367602A (en) * 1991-06-14 1992-12-18 Asahi Corp Lacing-up part structure of string shoe
JPH0560304U (en) * 1992-01-28 1993-08-10 株式会社アスティコ shoes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008518806A (en) * 2004-11-02 2008-06-05 ソリユテイア・インコーポレイテツド Refractory polymer sheet

Also Published As

Publication number Publication date
JPS5916406B2 (en) 1984-04-16

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