JPS5698016A - Lead wire connecting method for quartz oscillator - Google Patents
Lead wire connecting method for quartz oscillatorInfo
- Publication number
- JPS5698016A JPS5698016A JP17267379A JP17267379A JPS5698016A JP S5698016 A JPS5698016 A JP S5698016A JP 17267379 A JP17267379 A JP 17267379A JP 17267379 A JP17267379 A JP 17267379A JP S5698016 A JPS5698016 A JP S5698016A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- wires
- quartz oscillator
- pads
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 4
- 239000010453 quartz Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 229920006332 epoxy adhesive Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
PURPOSE:To facilitate the lead-out of the lead wire, by fixing the lead wire to a quartz oscillator by an insulating adhesive while holding a contact between the connection pad and the lead wire. CONSTITUTION:The lead wires 7 and 8 are put on the connection pads 5 and 6, and the pressure P is applied onto the wires 7 and 8. Thus the wires 7 and 8 are pressed to the pads 5 and 6 to secure a strong contact between them, thus obtaining an assured electrical conduction. Under these conditions, the epoxy adhesive 9 is applied to the periphery of the wires 7 and 8 as well as the pads 5 and 6 to be hardened. The pressure P is removed after hardening the adhesive 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17267379A JPS5698016A (en) | 1979-12-31 | 1979-12-31 | Lead wire connecting method for quartz oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17267379A JPS5698016A (en) | 1979-12-31 | 1979-12-31 | Lead wire connecting method for quartz oscillator |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5698016A true JPS5698016A (en) | 1981-08-07 |
JPS6360564B2 JPS6360564B2 (en) | 1988-11-24 |
Family
ID=15946242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17267379A Granted JPS5698016A (en) | 1979-12-31 | 1979-12-31 | Lead wire connecting method for quartz oscillator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5698016A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117194A (en) * | 1982-12-23 | 1984-07-06 | 松下電器産業株式会社 | Lead wire mounting structure for electronic part |
US7534320B2 (en) * | 2005-11-15 | 2009-05-19 | Northrop Grumman Corporation | Lamination press pad |
-
1979
- 1979-12-31 JP JP17267379A patent/JPS5698016A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117194A (en) * | 1982-12-23 | 1984-07-06 | 松下電器産業株式会社 | Lead wire mounting structure for electronic part |
US7534320B2 (en) * | 2005-11-15 | 2009-05-19 | Northrop Grumman Corporation | Lamination press pad |
Also Published As
Publication number | Publication date |
---|---|
JPS6360564B2 (en) | 1988-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2090071B (en) | Bonding with a conductive adhesive | |
JPS5519900A (en) | Method of manufacturing composite tape with bump for automatically bonding semiconductor device | |
DE3173587D1 (en) | A semiconductor device having electrodes and conducting members bonded to the electrodes, and a method of manufacturing the same | |
JPS5698016A (en) | Lead wire connecting method for quartz oscillator | |
JPS6480051A (en) | Electric device | |
JPS5548943A (en) | Composite integrated circuit | |
JPS55138246A (en) | Manufacture of semicondoctor device | |
JPS52106683A (en) | Method of bonding semiconductor disk | |
JPS51126063A (en) | Wire bonding method | |
JPS57194539A (en) | Pressing structure for lead frame | |
JPS5698020A (en) | Lead wire connection method for tuning fork type quartz oscillator | |
JPS54129880A (en) | Manufacture for semiconductor device | |
JPS55130134A (en) | Bonding method of semiconductor pellet | |
JPS5698018A (en) | Lead wire connecting method for quartz oscillator | |
JPS6473754A (en) | Manufacture of lead frame for semiconductor device | |
JPS51141580A (en) | Method for drawing a lead wire of a semiconductor element | |
JPS5718348A (en) | Integrated circuit device | |
JPS5698019A (en) | Lead wire connecting method for tuning fork type quartz oscillator | |
JPS54149582A (en) | Manufacture of resin-sealed semiconductor device | |
JPS5698017A (en) | Lead wire connecting method for quartz oscillator | |
JPS5512712A (en) | Wire bonding method for semiconductor element | |
JPS51151070A (en) | Connection method of a semiconductor apparatus | |
JPS54114976A (en) | Semiconductor device | |
JPS5635448A (en) | Semiconductor device | |
JPS5333060A (en) | Electrode lead-out method |