|
US3778686A
(en)
*
|
1972-08-18 |
1973-12-11 |
Motorola Inc |
Carrier for beam lead integrated circuits
|
|
GB1490978A
(en)
*
|
1973-12-21 |
1977-11-09 |
Marconi Co Ltd |
Light emitting diode(led)arrays
|
|
JPS5543110Y2
(enExample)
*
|
1975-02-27 |
1980-10-09 |
|
|
|
US4326214A
(en)
*
|
1976-11-01 |
1982-04-20 |
National Semiconductor Corporation |
Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip
|
|
JPS5936824B2
(ja)
*
|
1976-12-15 |
1984-09-06 |
株式会社日立製作所 |
半導体装置
|
|
JPS598358Y2
(ja)
*
|
1978-02-08 |
1984-03-15 |
京セラ株式会社 |
半導体素子パツケ−ジ
|
|
US4262300A
(en)
*
|
1978-11-03 |
1981-04-14 |
Isotronics, Inc. |
Microcircuit package formed of multi-components
|
|
JPS5588356A
(en)
*
|
1978-12-27 |
1980-07-04 |
Hitachi Ltd |
Semiconductor device
|
|
JPS5599153U
(enExample)
*
|
1978-12-28 |
1980-07-10 |
|
|
|
JPS5683050A
(en)
*
|
1979-12-12 |
1981-07-07 |
Toshiba Corp |
Semiconductor device
|
|
US4298769A
(en)
*
|
1979-12-14 |
1981-11-03 |
Standard Microsystems Corp. |
Hermetic plastic dual-in-line package for a semiconductor integrated circuit
|
|
USD265447S
(en)
|
1980-02-08 |
1982-07-20 |
Jedseth Products |
Storage unit for locker or the like
|
|
JPS5873563A
(ja)
*
|
1981-10-16 |
1983-05-02 |
株式会社日立製作所 |
作動液収容体
|
|
US4451845A
(en)
*
|
1981-12-22 |
1984-05-29 |
Avx Corporation |
Lead frame device including ceramic encapsulated capacitor and IC chip
|
|
JPS5936947A
(ja)
*
|
1982-08-25 |
1984-02-29 |
Mitsubishi Electric Corp |
半導体装置
|
|
US4567545A
(en)
*
|
1983-05-18 |
1986-01-28 |
Mettler Rollin W Jun |
Integrated circuit module and method of making same
|
|
FR2547113B1
(fr)
*
|
1983-06-03 |
1986-11-07 |
Inf Milit Spatiale Aeronaut |
Boitier d'encapsulation de composant electronique, durci vis-a-vis des radiations
|
|
JPS60156756U
(ja)
*
|
1984-03-28 |
1985-10-18 |
株式会社 フジ電科 |
気密端子
|
|
US4622433A
(en)
*
|
1984-03-30 |
1986-11-11 |
Diacon, Inc. |
Ceramic package system using low temperature sealing glasses
|
|
US4651415A
(en)
*
|
1985-03-22 |
1987-03-24 |
Diacon, Inc. |
Leaded chip carrier
|
|
US5071712A
(en)
*
|
1985-03-22 |
1991-12-10 |
Diacon, Inc. |
Leaded chip carrier
|
|
US4701573A
(en)
*
|
1985-09-26 |
1987-10-20 |
Itt Gallium Arsenide Technology Center |
Semiconductor chip housing
|
|
JPS62271842A
(ja)
*
|
1986-05-16 |
1987-11-26 |
笹岡 信彦 |
包装箱
|
|
US4888449A
(en)
*
|
1988-01-04 |
1989-12-19 |
Olin Corporation |
Semiconductor package
|
|
JPH01226550A
(ja)
*
|
1988-03-02 |
1989-09-11 |
Toyo Seikan Kaisha Ltd |
容器胴体
|
|
JPH02174144A
(ja)
*
|
1988-12-26 |
1990-07-05 |
Sumitomo Electric Ind Ltd |
半導体装置用パッケージ
|
|
JPH03129862A
(ja)
*
|
1989-10-16 |
1991-06-03 |
Nec Corp |
ガラス封止型半導体装置
|
|
DE19727913A1
(de)
*
|
1997-07-01 |
1999-01-07 |
Daimler Benz Ag |
Keramikgehäuse und Verfahren zu seiner Herstellung
|
|
US6084297A
(en)
|
1998-09-03 |
2000-07-04 |
Micron Technology, Inc. |
Cavity ball grid array apparatus
|
|
US10014189B2
(en)
*
|
2015-06-02 |
2018-07-03 |
Ngk Spark Plug Co., Ltd. |
Ceramic package with brazing material near seal member
|