JPS5688347A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5688347A JPS5688347A JP16594479A JP16594479A JPS5688347A JP S5688347 A JPS5688347 A JP S5688347A JP 16594479 A JP16594479 A JP 16594479A JP 16594479 A JP16594479 A JP 16594479A JP S5688347 A JPS5688347 A JP S5688347A
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- shortcircuit
- lead
- lead wire
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/453—
-
- H10W72/0711—
-
- H10W70/682—
-
- H10W72/701—
-
- H10W72/877—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16594479A JPS5688347A (en) | 1979-12-20 | 1979-12-20 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16594479A JPS5688347A (en) | 1979-12-20 | 1979-12-20 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5688347A true JPS5688347A (en) | 1981-07-17 |
| JPS6343897B2 JPS6343897B2 (enExample) | 1988-09-01 |
Family
ID=15821977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16594479A Granted JPS5688347A (en) | 1979-12-20 | 1979-12-20 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5688347A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6050932A (ja) * | 1983-08-31 | 1985-03-22 | Oki Electric Ind Co Ltd | 半導体チップの実装方法 |
| JPH0394435A (ja) * | 1989-09-06 | 1991-04-19 | Toshiba Corp | 半導体装置 |
| CN111868809A (zh) * | 2018-03-28 | 2020-10-30 | 夏普株式会社 | 显示装置和显示装置的制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5339866A (en) * | 1976-09-24 | 1978-04-12 | Fujitsu Ltd | Packaging method of semiconductor device |
-
1979
- 1979-12-20 JP JP16594479A patent/JPS5688347A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5339866A (en) * | 1976-09-24 | 1978-04-12 | Fujitsu Ltd | Packaging method of semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6050932A (ja) * | 1983-08-31 | 1985-03-22 | Oki Electric Ind Co Ltd | 半導体チップの実装方法 |
| JPH0394435A (ja) * | 1989-09-06 | 1991-04-19 | Toshiba Corp | 半導体装置 |
| CN111868809A (zh) * | 2018-03-28 | 2020-10-30 | 夏普株式会社 | 显示装置和显示装置的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6343897B2 (enExample) | 1988-09-01 |
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