JPS568832A - Bonding plane height detector - Google Patents
Bonding plane height detectorInfo
- Publication number
- JPS568832A JPS568832A JP8304979A JP8304979A JPS568832A JP S568832 A JPS568832 A JP S568832A JP 8304979 A JP8304979 A JP 8304979A JP 8304979 A JP8304979 A JP 8304979A JP S568832 A JPS568832 A JP S568832A
- Authority
- JP
- Japan
- Prior art keywords
- contactors
- lever
- wire
- bonding
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To obtain an optimum tail length of a contactors made of sintered alloy of a bonding apparatus and stabilize the detection of a bonding plane height detector by forming the contactors of a bonding arm and a wire clamping lever forming the bonding apparatus and detecting the on or off of the contactors. CONSTITUTION:There are mounted a spool lever 40 having a spool 42 wound with a wire 41 at the end of an X-Y movable block 22 having a threaded member 25 and a female threaded block 26, and an elevationally movable block 13 having a wire clamp lever 44 and a bonding arm 10. In this manner, the wire 41 led out from the spool 42 is gripped by a clamper 46 at the end of lever 44, and is passed through a capillary 11 at the end of the arm 10 to bond the wire 41 to a pellet 52 on the specimen carrier base 50. In this configuration there are provided electric contactors 17, 19 made of silver-tungsten sintered alloy between the arm 10 and the lever 44, and the bonding plane height is detected by a rotary encoder 24 disposed on the block corresponding to the opening or closing of the contacts of the contactors.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54083049A JPS5855663B2 (en) | 1979-06-30 | 1979-06-30 | bonding equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54083049A JPS5855663B2 (en) | 1979-06-30 | 1979-06-30 | bonding equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS568832A true JPS568832A (en) | 1981-01-29 |
JPS5855663B2 JPS5855663B2 (en) | 1983-12-10 |
Family
ID=13791332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54083049A Expired JPS5855663B2 (en) | 1979-06-30 | 1979-06-30 | bonding equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5855663B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980939A (en) * | 1982-10-29 | 1984-05-10 | Matsushita Electric Ind Co Ltd | Full automatic wiring device |
JPH01144642A (en) * | 1988-07-08 | 1989-06-06 | Nec Corp | Wire bonding |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9960967B2 (en) | 2009-10-21 | 2018-05-01 | A10 Networks, Inc. | Determining an application delivery server based on geo-location information |
US9215275B2 (en) | 2010-09-30 | 2015-12-15 | A10 Networks, Inc. | System and method to balance servers based on server load status |
US9094364B2 (en) | 2011-12-23 | 2015-07-28 | A10 Networks, Inc. | Methods to manage services over a service gateway |
US10021174B2 (en) | 2012-09-25 | 2018-07-10 | A10 Networks, Inc. | Distributing service sessions |
US10002141B2 (en) | 2012-09-25 | 2018-06-19 | A10 Networks, Inc. | Distributed database in software driven networks |
US9900252B2 (en) | 2013-03-08 | 2018-02-20 | A10 Networks, Inc. | Application delivery controller and global server load balancer |
WO2014144837A1 (en) | 2013-03-15 | 2014-09-18 | A10 Networks, Inc. | Processing data packets using a policy based network path |
WO2014179753A2 (en) | 2013-05-03 | 2014-11-06 | A10 Networks, Inc. | Facilitating secure network traffic by an application delivery controller |
US9906422B2 (en) | 2014-05-16 | 2018-02-27 | A10 Networks, Inc. | Distributed system to determine a server's health |
US9986061B2 (en) | 2014-06-03 | 2018-05-29 | A10 Networks, Inc. | Programming a data network device using user defined scripts |
US9992229B2 (en) | 2014-06-03 | 2018-06-05 | A10 Networks, Inc. | Programming a data network device using user defined scripts with licenses |
-
1979
- 1979-06-30 JP JP54083049A patent/JPS5855663B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980939A (en) * | 1982-10-29 | 1984-05-10 | Matsushita Electric Ind Co Ltd | Full automatic wiring device |
JPH0210574B2 (en) * | 1982-10-29 | 1990-03-08 | Matsushita Electric Ind Co Ltd | |
JPH01144642A (en) * | 1988-07-08 | 1989-06-06 | Nec Corp | Wire bonding |
JPH05854B2 (en) * | 1988-07-08 | 1993-01-06 | Nippon Electric Co |
Also Published As
Publication number | Publication date |
---|---|
JPS5855663B2 (en) | 1983-12-10 |
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