JPS568832A - Bonding plane height detector - Google Patents

Bonding plane height detector

Info

Publication number
JPS568832A
JPS568832A JP8304979A JP8304979A JPS568832A JP S568832 A JPS568832 A JP S568832A JP 8304979 A JP8304979 A JP 8304979A JP 8304979 A JP8304979 A JP 8304979A JP S568832 A JPS568832 A JP S568832A
Authority
JP
Japan
Prior art keywords
contactors
lever
wire
bonding
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8304979A
Other languages
Japanese (ja)
Other versions
JPS5855663B2 (en
Inventor
Kazuo Sugiura
Nobuhito Yamazaki
Tsutomu Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP54083049A priority Critical patent/JPS5855663B2/en
Publication of JPS568832A publication Critical patent/JPS568832A/en
Publication of JPS5855663B2 publication Critical patent/JPS5855663B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain an optimum tail length of a contactors made of sintered alloy of a bonding apparatus and stabilize the detection of a bonding plane height detector by forming the contactors of a bonding arm and a wire clamping lever forming the bonding apparatus and detecting the on or off of the contactors. CONSTITUTION:There are mounted a spool lever 40 having a spool 42 wound with a wire 41 at the end of an X-Y movable block 22 having a threaded member 25 and a female threaded block 26, and an elevationally movable block 13 having a wire clamp lever 44 and a bonding arm 10. In this manner, the wire 41 led out from the spool 42 is gripped by a clamper 46 at the end of lever 44, and is passed through a capillary 11 at the end of the arm 10 to bond the wire 41 to a pellet 52 on the specimen carrier base 50. In this configuration there are provided electric contactors 17, 19 made of silver-tungsten sintered alloy between the arm 10 and the lever 44, and the bonding plane height is detected by a rotary encoder 24 disposed on the block corresponding to the opening or closing of the contacts of the contactors.
JP54083049A 1979-06-30 1979-06-30 bonding equipment Expired JPS5855663B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54083049A JPS5855663B2 (en) 1979-06-30 1979-06-30 bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54083049A JPS5855663B2 (en) 1979-06-30 1979-06-30 bonding equipment

Publications (2)

Publication Number Publication Date
JPS568832A true JPS568832A (en) 1981-01-29
JPS5855663B2 JPS5855663B2 (en) 1983-12-10

Family

ID=13791332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54083049A Expired JPS5855663B2 (en) 1979-06-30 1979-06-30 bonding equipment

Country Status (1)

Country Link
JP (1) JPS5855663B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980939A (en) * 1982-10-29 1984-05-10 Matsushita Electric Ind Co Ltd Full automatic wiring device
JPH01144642A (en) * 1988-07-08 1989-06-06 Nec Corp Wire bonding

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9960967B2 (en) 2009-10-21 2018-05-01 A10 Networks, Inc. Determining an application delivery server based on geo-location information
US9215275B2 (en) 2010-09-30 2015-12-15 A10 Networks, Inc. System and method to balance servers based on server load status
US9094364B2 (en) 2011-12-23 2015-07-28 A10 Networks, Inc. Methods to manage services over a service gateway
US10021174B2 (en) 2012-09-25 2018-07-10 A10 Networks, Inc. Distributing service sessions
US10002141B2 (en) 2012-09-25 2018-06-19 A10 Networks, Inc. Distributed database in software driven networks
US9900252B2 (en) 2013-03-08 2018-02-20 A10 Networks, Inc. Application delivery controller and global server load balancer
WO2014144837A1 (en) 2013-03-15 2014-09-18 A10 Networks, Inc. Processing data packets using a policy based network path
WO2014179753A2 (en) 2013-05-03 2014-11-06 A10 Networks, Inc. Facilitating secure network traffic by an application delivery controller
US9906422B2 (en) 2014-05-16 2018-02-27 A10 Networks, Inc. Distributed system to determine a server's health
US9986061B2 (en) 2014-06-03 2018-05-29 A10 Networks, Inc. Programming a data network device using user defined scripts
US9992229B2 (en) 2014-06-03 2018-06-05 A10 Networks, Inc. Programming a data network device using user defined scripts with licenses

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980939A (en) * 1982-10-29 1984-05-10 Matsushita Electric Ind Co Ltd Full automatic wiring device
JPH0210574B2 (en) * 1982-10-29 1990-03-08 Matsushita Electric Ind Co Ltd
JPH01144642A (en) * 1988-07-08 1989-06-06 Nec Corp Wire bonding
JPH05854B2 (en) * 1988-07-08 1993-01-06 Nippon Electric Co

Also Published As

Publication number Publication date
JPS5855663B2 (en) 1983-12-10

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