JPS568823A - Automatic continuous centrifugal drying apparatus for wafer - Google Patents

Automatic continuous centrifugal drying apparatus for wafer

Info

Publication number
JPS568823A
JPS568823A JP8468079A JP8468079A JPS568823A JP S568823 A JPS568823 A JP S568823A JP 8468079 A JP8468079 A JP 8468079A JP 8468079 A JP8468079 A JP 8468079A JP S568823 A JPS568823 A JP S568823A
Authority
JP
Japan
Prior art keywords
turntable
cradles
attitude
container
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8468079A
Other languages
Japanese (ja)
Inventor
Toshio Kanai
Tadayasu Osawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Original Assignee
NEC Corp
Kaijo Denki Co Ltd
Nippon Electric Co Ltd
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Kaijo Denki Co Ltd, Nippon Electric Co Ltd, Marine Instr Co Ltd filed Critical NEC Corp
Priority to JP8468079A priority Critical patent/JPS568823A/en
Publication of JPS568823A publication Critical patent/JPS568823A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To fully automate the wafer drying process by arranging a turntable having a plurality of cradles capable of converting between vertical attitude and horizontal attitude within a circular container, and employing a plurality of air cylinders to control the rotations of the turntable and the attitudes of the cradles. CONSTITUTION:A turntable 2 stood with supporting frames 14 corresponding in number to a plurality of sawtooth-like positioning grooves 6 is contained in a circular container 1 having the grooves 6 on the inner peripheral surface thereof. A plurality of cradles 15 capable of converting between vertical attitude and horizontal attitude via a fulcrum 15 are mounted at the upper ends of the frames 14, and are converted in attitude through a circular arm 4 projected externally of the container 1, a swinging arm 4A, a pin 4B, and an air cylinder 5 and the like. When the turntable 2 thus composed is rotated via motors 9, 13 provided under the container 1, the cradles are converted to the horizontal attitude, wafers are dropped thereto, and the arm 7 connected to the air cylinder 8 is disengaged to start the turntable 2.
JP8468079A 1979-07-04 1979-07-04 Automatic continuous centrifugal drying apparatus for wafer Pending JPS568823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8468079A JPS568823A (en) 1979-07-04 1979-07-04 Automatic continuous centrifugal drying apparatus for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8468079A JPS568823A (en) 1979-07-04 1979-07-04 Automatic continuous centrifugal drying apparatus for wafer

Publications (1)

Publication Number Publication Date
JPS568823A true JPS568823A (en) 1981-01-29

Family

ID=13837401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8468079A Pending JPS568823A (en) 1979-07-04 1979-07-04 Automatic continuous centrifugal drying apparatus for wafer

Country Status (1)

Country Link
JP (1) JPS568823A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171337U (en) * 1983-04-30 1984-11-16 東京エレクトロン株式会社 Semiconductor wafer cleaning equipment
FR2584483A1 (en) * 1985-07-08 1987-01-09 Oki Electric Ind Co Ltd ROTATING DRYER APPARATUS FOR SEMICONDUCTOR PADS.
FR2606498A1 (en) * 1986-06-12 1988-05-13 Oki Electric Ind Co Ltd METHOD AND APPARATUS FOR DRYING WAFERS BY CENTRIFUGATION

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171337U (en) * 1983-04-30 1984-11-16 東京エレクトロン株式会社 Semiconductor wafer cleaning equipment
FR2584483A1 (en) * 1985-07-08 1987-01-09 Oki Electric Ind Co Ltd ROTATING DRYER APPARATUS FOR SEMICONDUCTOR PADS.
FR2606498A1 (en) * 1986-06-12 1988-05-13 Oki Electric Ind Co Ltd METHOD AND APPARATUS FOR DRYING WAFERS BY CENTRIFUGATION
US4777732A (en) * 1986-06-12 1988-10-18 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
USRE37627E1 (en) 1986-06-12 2002-04-09 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus

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