JPS5684495A - Pure gold plating liquid - Google Patents
Pure gold plating liquidInfo
- Publication number
- JPS5684495A JPS5684495A JP16126779A JP16126779A JPS5684495A JP S5684495 A JPS5684495 A JP S5684495A JP 16126779 A JP16126779 A JP 16126779A JP 16126779 A JP16126779 A JP 16126779A JP S5684495 A JPS5684495 A JP S5684495A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- added
- plating liquid
- phosphate
- citrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 6
- 239000010931 gold Substances 0.000 title abstract 6
- 229910052737 gold Inorganic materials 0.000 title abstract 6
- 238000007747 plating Methods 0.000 title abstract 4
- 239000007788 liquid Substances 0.000 title abstract 3
- 229910019142 PO4 Inorganic materials 0.000 abstract 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 3
- 239000010452 phosphate Substances 0.000 abstract 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 abstract 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 2
- 150000002736 metal compounds Chemical class 0.000 abstract 2
- 229960003975 potassium Drugs 0.000 abstract 2
- 229910052700 potassium Inorganic materials 0.000 abstract 2
- 239000011591 potassium Substances 0.000 abstract 2
- -1 Ce Pb Inorganic materials 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 abstract 1
- 235000011130 ammonium sulphate Nutrition 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- 229910052785 arsenic Inorganic materials 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 150000002344 gold compounds Chemical class 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229960002635 potassium citrate Drugs 0.000 abstract 1
- 239000001508 potassium citrate Substances 0.000 abstract 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 abstract 1
- 235000011082 potassium citrates Nutrition 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 229910052714 tellurium Inorganic materials 0.000 abstract 1
- 229910052716 thallium Inorganic materials 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16126779A JPS5684495A (en) | 1979-12-12 | 1979-12-12 | Pure gold plating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16126779A JPS5684495A (en) | 1979-12-12 | 1979-12-12 | Pure gold plating liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5684495A true JPS5684495A (en) | 1981-07-09 |
| JPS6238435B2 JPS6238435B2 (enrdf_load_stackoverflow) | 1987-08-18 |
Family
ID=15731849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16126779A Granted JPS5684495A (en) | 1979-12-12 | 1979-12-12 | Pure gold plating liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5684495A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59143084A (ja) * | 1983-01-28 | 1984-08-16 | オ−エムアイ・インタ−ナシヨナル・コ−ポレ−シヨン | 改良金硫化物めつき浴 |
| CN101906649A (zh) * | 2010-08-11 | 2010-12-08 | 哈尔滨工业大学 | 无氰电镀金的镀液及采用无氰电镀金的镀液电镀金的方法 |
| WO2015190218A1 (ja) * | 2014-06-11 | 2015-12-17 | メタローテクノロジーズジャパン株式会社 | シアン系電解金めっき浴及びこれを用いるバンプ形成方法 |
| JP2016117946A (ja) * | 2014-11-21 | 2016-06-30 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | 環境に優しい金電気めっき組成物及び方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4923976A (enrdf_load_stackoverflow) * | 1972-07-03 | 1974-03-02 | ||
| JPS5212884A (en) * | 1975-07-21 | 1977-01-31 | Kawasaki Heavy Ind Ltd | Cylindrical abrasion tester for cylinders |
-
1979
- 1979-12-12 JP JP16126779A patent/JPS5684495A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4923976A (enrdf_load_stackoverflow) * | 1972-07-03 | 1974-03-02 | ||
| JPS5212884A (en) * | 1975-07-21 | 1977-01-31 | Kawasaki Heavy Ind Ltd | Cylindrical abrasion tester for cylinders |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59143084A (ja) * | 1983-01-28 | 1984-08-16 | オ−エムアイ・インタ−ナシヨナル・コ−ポレ−シヨン | 改良金硫化物めつき浴 |
| CN101906649A (zh) * | 2010-08-11 | 2010-12-08 | 哈尔滨工业大学 | 无氰电镀金的镀液及采用无氰电镀金的镀液电镀金的方法 |
| WO2015190218A1 (ja) * | 2014-06-11 | 2015-12-17 | メタローテクノロジーズジャパン株式会社 | シアン系電解金めっき浴及びこれを用いるバンプ形成方法 |
| JP2016000839A (ja) * | 2014-06-11 | 2016-01-07 | メタローテクノロジーズジャパン株式会社 | シアン系電解金めっき浴及びこれを用いるバンプ形成方法 |
| JP2016117946A (ja) * | 2014-11-21 | 2016-06-30 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | 環境に優しい金電気めっき組成物及び方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6238435B2 (enrdf_load_stackoverflow) | 1987-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1413494A (en) | Electrolytic treatment of copper foil | |
| JPS569386A (en) | Production of electro-zinc plated steel plate | |
| JPS5684495A (en) | Pure gold plating liquid | |
| JPS5726155A (en) | Production of zero spangle zinc plated steel plate of superior age plating peeling resistance | |
| JPS5638494A (en) | Surface-treated steel material with high corrosion resistance | |
| JPS5481777A (en) | Lead frame structure with intermediate layer | |
| JPS5767189A (en) | Zinc alloy electroplated steel plate high weldability and corrosion resistance and its manufacture | |
| JPS55104495A (en) | Gold plating liquid and gold plating method for using gold plating liquid | |
| JPS57140891A (en) | Pretreating solution for silver plating | |
| JPS5747891A (en) | Gold-palladium alloy plating bath | |
| US3562120A (en) | Plating of smooth,semibright gold deposits | |
| JPS5684432A (en) | Gold brazing material | |
| JPS56136994A (en) | Gold-tin-copper alloy plating bath | |
| JPS57110601A (en) | Zinc alloy powder for mechanical plating | |
| JPS572890A (en) | Gold alloy plating bath | |
| JPS5732346A (en) | Mother alloy for oxidation resistant lead-tin solder | |
| JPS5623294A (en) | Electroplating solution for forming zn-ti alloy plating film on iron and steel surface | |
| JPS5623293A (en) | Electroplating solution for forming zn-ti alloy plating film on iron and steel surface | |
| JPS5575893A (en) | Production of solder | |
| JPS5739190A (en) | Preparation of solder plated or tin plated wire | |
| JPS5474248A (en) | Clad solder | |
| US2968091A (en) | Method of applying solder to a joint | |
| JPS5380161A (en) | Electrode formation of semiconductor | |
| JPS57203786A (en) | Gold alloy plating liquid for thick plating | |
| JPS6220895A (ja) | Ｃｕ又はＣｕ合金母材にＳｎ又はＳｎ合金めつきを施す方法 |