JPS5681945A - Assembling device - Google Patents
Assembling deviceInfo
- Publication number
- JPS5681945A JPS5681945A JP15800679A JP15800679A JPS5681945A JP S5681945 A JPS5681945 A JP S5681945A JP 15800679 A JP15800679 A JP 15800679A JP 15800679 A JP15800679 A JP 15800679A JP S5681945 A JPS5681945 A JP S5681945A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- lead frame
- frame
- pawl
- curtain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W99/00—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15800679A JPS5681945A (en) | 1979-12-07 | 1979-12-07 | Assembling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15800679A JPS5681945A (en) | 1979-12-07 | 1979-12-07 | Assembling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5681945A true JPS5681945A (en) | 1981-07-04 |
| JPS6250976B2 JPS6250976B2 (cg-RX-API-DMAC10.html) | 1987-10-28 |
Family
ID=15662188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15800679A Granted JPS5681945A (en) | 1979-12-07 | 1979-12-07 | Assembling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5681945A (cg-RX-API-DMAC10.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925232A (ja) * | 1982-07-31 | 1984-02-09 | Shinkawa Ltd | ワイヤボンディング装置 |
| JPS5958830A (ja) * | 1982-09-28 | 1984-04-04 | Shinkawa Ltd | ボンダ−用ワ−ク加熱装置 |
| JPS60125734U (ja) * | 1984-01-31 | 1985-08-24 | 関西日本電気株式会社 | ポンデイング装置 |
| JPS61212029A (ja) * | 1985-03-18 | 1986-09-20 | San Yakin Kogyo Kk | 半導体装置のボンデイング |
| JPH0237733A (ja) * | 1988-07-27 | 1990-02-07 | Toshiba Corp | ワイヤボンディング装置 |
| WO2010044287A1 (ja) * | 2008-10-16 | 2010-04-22 | 株式会社新川 | 基板搬送装置及び基板搬送方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4694381B2 (ja) * | 2006-02-10 | 2011-06-08 | 日本電産トーソク株式会社 | ワーククランプ装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5051261A (cg-RX-API-DMAC10.html) * | 1973-09-07 | 1975-05-08 |
-
1979
- 1979-12-07 JP JP15800679A patent/JPS5681945A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5051261A (cg-RX-API-DMAC10.html) * | 1973-09-07 | 1975-05-08 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925232A (ja) * | 1982-07-31 | 1984-02-09 | Shinkawa Ltd | ワイヤボンディング装置 |
| JPS5958830A (ja) * | 1982-09-28 | 1984-04-04 | Shinkawa Ltd | ボンダ−用ワ−ク加熱装置 |
| JPS60125734U (ja) * | 1984-01-31 | 1985-08-24 | 関西日本電気株式会社 | ポンデイング装置 |
| JPS61212029A (ja) * | 1985-03-18 | 1986-09-20 | San Yakin Kogyo Kk | 半導体装置のボンデイング |
| JPH0237733A (ja) * | 1988-07-27 | 1990-02-07 | Toshiba Corp | ワイヤボンディング装置 |
| WO2010044287A1 (ja) * | 2008-10-16 | 2010-04-22 | 株式会社新川 | 基板搬送装置及び基板搬送方法 |
| CN102177574A (zh) * | 2008-10-16 | 2011-09-07 | 株式会社新川 | 基板运送装置及基板运送方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6250976B2 (cg-RX-API-DMAC10.html) | 1987-10-28 |
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