JPS5678135A - Position detecting device - Google Patents

Position detecting device

Info

Publication number
JPS5678135A
JPS5678135A JP15540279A JP15540279A JPS5678135A JP S5678135 A JPS5678135 A JP S5678135A JP 15540279 A JP15540279 A JP 15540279A JP 15540279 A JP15540279 A JP 15540279A JP S5678135 A JPS5678135 A JP S5678135A
Authority
JP
Japan
Prior art keywords
picture element
image
subtotal
row
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15540279A
Other languages
Japanese (ja)
Other versions
JPS5925375B2 (en
Inventor
Yoshiaki Arimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP54155402A priority Critical patent/JPS5925375B2/en
Publication of JPS5678135A publication Critical patent/JPS5678135A/en
Publication of JPS5925375B2 publication Critical patent/JPS5925375B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Position Or Direction (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To detect the positional deviation of a semiconductor chip by a method wherein a junction pad image is depicted from a photoelectrically converted image of the semiconductor chip, a correction is added based on the estabilished form and the positional information is given. CONSTITUTION:The picture of the chip 1 is detected and memorized 8 as a two-dimensionally arranged picture element signal. A computer 7 performs a feed-back control of an image pick-up sensitivity in such a manner that the average value of the high levels of an image signal is controlled below the saturation level. The computer first reads out a picture element signal successively and calcurates the total T of the signal, a subtotal (e) for each row and column, a reference point (1/2, 1/4 and 3/4 of T) and the dichotomized point of the row and column. The subtotal (e) for the row and column is cumulated and a cumulated value S and coordinates (x) and (y) are calculated at the time when passing the reference point. The average value K of the subtotal (e) is found using the 1/4 and 3/4 points. Then the deviation between the center of the mechanical division and the center determined by the picture element signal is found from the cumulated value of the picture element signal of the left half and the upper half of the picture. In addition, when consideration is given to the prescribed width of each picture element, the center position of the pad image can be calculated very accurately, cracks and the like are compensated by an arithmetic processing and an accurate position detection can be performed.
JP54155402A 1979-11-30 1979-11-30 position detection device Expired JPS5925375B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54155402A JPS5925375B2 (en) 1979-11-30 1979-11-30 position detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54155402A JPS5925375B2 (en) 1979-11-30 1979-11-30 position detection device

Publications (2)

Publication Number Publication Date
JPS5678135A true JPS5678135A (en) 1981-06-26
JPS5925375B2 JPS5925375B2 (en) 1984-06-16

Family

ID=15605178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54155402A Expired JPS5925375B2 (en) 1979-11-30 1979-11-30 position detection device

Country Status (1)

Country Link
JP (1) JPS5925375B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144918A (en) * 1982-12-08 1984-08-20 テキサス・インスツルメンツ・インコ−ポレイテツド Method and apparatus for positioning specified pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144918A (en) * 1982-12-08 1984-08-20 テキサス・インスツルメンツ・インコ−ポレイテツド Method and apparatus for positioning specified pattern

Also Published As

Publication number Publication date
JPS5925375B2 (en) 1984-06-16

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