JPS567455A - Mounting method for multiple pin parts - Google Patents
Mounting method for multiple pin partsInfo
- Publication number
- JPS567455A JPS567455A JP8136979A JP8136979A JPS567455A JP S567455 A JPS567455 A JP S567455A JP 8136979 A JP8136979 A JP 8136979A JP 8136979 A JP8136979 A JP 8136979A JP S567455 A JPS567455 A JP S567455A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- substrate
- soldering
- noses
- multiple pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To arrange the noses of multiple pin parts on a printed substrate plane and remove faulty soldering completely by a method wherein the parts are pushed to the substrate prior to the fastening treatment of leads, such as soldering, etc. CONSTITUTION:An IC11 is pushed to a substrate 10 by means of a jig 13 prior to soldering, plastic deformation is given to leads 12A, the locations of the noses of the leads are arranged on a substrate plane, and positional slippage in the height direction is removed. Thus, the generation of faulty soldering can be prevented because the noses of the leads slightly slip in the horizontal direction and all leads contact with the corresponding wiring layers of the substrate 10.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8136979A JPS567455A (en) | 1979-06-29 | 1979-06-29 | Mounting method for multiple pin parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8136979A JPS567455A (en) | 1979-06-29 | 1979-06-29 | Mounting method for multiple pin parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS567455A true JPS567455A (en) | 1981-01-26 |
Family
ID=13744393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8136979A Pending JPS567455A (en) | 1979-06-29 | 1979-06-29 | Mounting method for multiple pin parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS567455A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158994A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Heat soldering method under point and device therefor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5279267A (en) * | 1975-12-25 | 1977-07-04 | Sony Corp | Method of mounting electronic element |
-
1979
- 1979-06-29 JP JP8136979A patent/JPS567455A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5279267A (en) * | 1975-12-25 | 1977-07-04 | Sony Corp | Method of mounting electronic element |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158994A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Heat soldering method under point and device therefor |
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