JPS567455A - Mounting method for multiple pin parts - Google Patents

Mounting method for multiple pin parts

Info

Publication number
JPS567455A
JPS567455A JP8136979A JP8136979A JPS567455A JP S567455 A JPS567455 A JP S567455A JP 8136979 A JP8136979 A JP 8136979A JP 8136979 A JP8136979 A JP 8136979A JP S567455 A JPS567455 A JP S567455A
Authority
JP
Japan
Prior art keywords
leads
substrate
soldering
noses
multiple pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8136979A
Other languages
Japanese (ja)
Inventor
Fumihito Inoue
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8136979A priority Critical patent/JPS567455A/en
Publication of JPS567455A publication Critical patent/JPS567455A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To arrange the noses of multiple pin parts on a printed substrate plane and remove faulty soldering completely by a method wherein the parts are pushed to the substrate prior to the fastening treatment of leads, such as soldering, etc. CONSTITUTION:An IC11 is pushed to a substrate 10 by means of a jig 13 prior to soldering, plastic deformation is given to leads 12A, the locations of the noses of the leads are arranged on a substrate plane, and positional slippage in the height direction is removed. Thus, the generation of faulty soldering can be prevented because the noses of the leads slightly slip in the horizontal direction and all leads contact with the corresponding wiring layers of the substrate 10.
JP8136979A 1979-06-29 1979-06-29 Mounting method for multiple pin parts Pending JPS567455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8136979A JPS567455A (en) 1979-06-29 1979-06-29 Mounting method for multiple pin parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8136979A JPS567455A (en) 1979-06-29 1979-06-29 Mounting method for multiple pin parts

Publications (1)

Publication Number Publication Date
JPS567455A true JPS567455A (en) 1981-01-26

Family

ID=13744393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8136979A Pending JPS567455A (en) 1979-06-29 1979-06-29 Mounting method for multiple pin parts

Country Status (1)

Country Link
JP (1) JPS567455A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158994A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Heat soldering method under point and device therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279267A (en) * 1975-12-25 1977-07-04 Sony Corp Method of mounting electronic element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279267A (en) * 1975-12-25 1977-07-04 Sony Corp Method of mounting electronic element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158994A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Heat soldering method under point and device therefor

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