JPS5673444A - Device for visual inspection - Google Patents

Device for visual inspection

Info

Publication number
JPS5673444A
JPS5673444A JP15031479A JP15031479A JPS5673444A JP S5673444 A JPS5673444 A JP S5673444A JP 15031479 A JP15031479 A JP 15031479A JP 15031479 A JP15031479 A JP 15031479A JP S5673444 A JPS5673444 A JP S5673444A
Authority
JP
Japan
Prior art keywords
defective chip
chip
stand
adhesive tape
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15031479A
Other languages
Japanese (ja)
Inventor
Tatsuo Saito
Koji Iizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15031479A priority Critical patent/JPS5673444A/en
Publication of JPS5673444A publication Critical patent/JPS5673444A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To easily remove a defective chip by a method wherein the defective chip found on an electron sheet by an inspection is transferred on an adhesive tape located between the chip and an object lens and it is wound up at the prescribed pitch. CONSTITUTION:The ring 3, whereon an electron sheet 2 having expanded and aligned chips 1 is set, is placed on the measuring stand 4 of a visual inspection device, an inspection is performed by shifting the stand 4, a signal is given when a defective chip is present, a stand 11 is shifted by the functioning of a motor 16, an adhesive tape 10 is inserted between the object lens of a microscope 5 and the defective chip, a needle 13 is thrusted up by a cam mechanism and the defective chip is transposed on the adhesive tape. Then the motor 3 functions and the tape 10 is wound around a reel 9 at a prescribed pitch, the stand 11 retreats and the tape 10 goes out of the visual field. In this constitution, the defective chip can be removed without giving damage to the adjoining chip, and the selecting efficiency and yield rate can be improved.
JP15031479A 1979-11-20 1979-11-20 Device for visual inspection Pending JPS5673444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15031479A JPS5673444A (en) 1979-11-20 1979-11-20 Device for visual inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15031479A JPS5673444A (en) 1979-11-20 1979-11-20 Device for visual inspection

Publications (1)

Publication Number Publication Date
JPS5673444A true JPS5673444A (en) 1981-06-18

Family

ID=15494306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15031479A Pending JPS5673444A (en) 1979-11-20 1979-11-20 Device for visual inspection

Country Status (1)

Country Link
JP (1) JPS5673444A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130437A (en) * 1983-01-17 1984-07-27 Nec Home Electronics Ltd Method for selecting semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130437A (en) * 1983-01-17 1984-07-27 Nec Home Electronics Ltd Method for selecting semiconductor devices

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