JPS5664483A - Led device - Google Patents

Led device

Info

Publication number
JPS5664483A
JPS5664483A JP14031079A JP14031079A JPS5664483A JP S5664483 A JPS5664483 A JP S5664483A JP 14031079 A JP14031079 A JP 14031079A JP 14031079 A JP14031079 A JP 14031079A JP S5664483 A JPS5664483 A JP S5664483A
Authority
JP
Japan
Prior art keywords
pellets
sections
led
conductive
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14031079A
Other languages
English (en)
Inventor
Tatsuro Beppu
Osamu Ichikawa
Tetsuo Sadamasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14031079A priority Critical patent/JPS5664483A/ja
Publication of JPS5664483A publication Critical patent/JPS5664483A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP14031079A 1979-10-30 1979-10-30 Led device Pending JPS5664483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14031079A JPS5664483A (en) 1979-10-30 1979-10-30 Led device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14031079A JPS5664483A (en) 1979-10-30 1979-10-30 Led device

Publications (1)

Publication Number Publication Date
JPS5664483A true JPS5664483A (en) 1981-06-01

Family

ID=15265815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14031079A Pending JPS5664483A (en) 1979-10-30 1979-10-30 Led device

Country Status (1)

Country Link
JP (1) JPS5664483A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635651U (ja) * 1986-06-28 1988-01-14
EP0746045A3 (de) * 1995-05-27 1997-05-07 Bosch Gmbh Robert Anordnung zur Montage eines optoelektronischen Bauelementes auf einem Träger
JP2007287896A (ja) * 2006-04-17 2007-11-01 Nichia Chem Ind Ltd 半導体装置及びその製造方法
JP2010245481A (ja) * 2009-04-10 2010-10-28 Sharp Corp 発光装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635651U (ja) * 1986-06-28 1988-01-14
EP0746045A3 (de) * 1995-05-27 1997-05-07 Bosch Gmbh Robert Anordnung zur Montage eines optoelektronischen Bauelementes auf einem Träger
JP2007287896A (ja) * 2006-04-17 2007-11-01 Nichia Chem Ind Ltd 半導体装置及びその製造方法
JP2010245481A (ja) * 2009-04-10 2010-10-28 Sharp Corp 発光装置

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