JPS5660209A - Metal mold device for molding semiconductor element with resin sealing member - Google Patents

Metal mold device for molding semiconductor element with resin sealing member

Info

Publication number
JPS5660209A
JPS5660209A JP13714779A JP13714779A JPS5660209A JP S5660209 A JPS5660209 A JP S5660209A JP 13714779 A JP13714779 A JP 13714779A JP 13714779 A JP13714779 A JP 13714779A JP S5660209 A JPS5660209 A JP S5660209A
Authority
JP
Japan
Prior art keywords
resin
block
bored
spot facing
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13714779A
Other languages
Japanese (ja)
Other versions
JPS6124971B2 (en
Inventor
Seiji Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13714779A priority Critical patent/JPS5660209A/en
Publication of JPS5660209A publication Critical patent/JPS5660209A/en
Publication of JPS6124971B2 publication Critical patent/JPS6124971B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent resin from flowing in a bored spot facing by putting removably a blocking member made of heat-resisting synthetic resin in the bored spot facing for a fitting bolt which fits a cavity block and a center block to a heating block. CONSTITUTION:A lower die part 1 is constituted by fitting the cavity block 2 and the center block 3 to the heating block 4 by the fitting bolt 12. And for this fitting bolt 12, the liquefied heat-resisting resin such as silicone resin is directly injected and set in the bored spot facing 11 formed in the cavity block 2 and the center block 3 to provided the blocking member 20 assuming the rubberlike elasticity and formed removably, whereby the resin which is injected and leaks out and the resin which is removed in cleansing are prevented from flowing in the bored spot facing 11 and also the disassembling of the upper and lower die parts of the mold is facilitated.
JP13714779A 1979-10-23 1979-10-23 Metal mold device for molding semiconductor element with resin sealing member Granted JPS5660209A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13714779A JPS5660209A (en) 1979-10-23 1979-10-23 Metal mold device for molding semiconductor element with resin sealing member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13714779A JPS5660209A (en) 1979-10-23 1979-10-23 Metal mold device for molding semiconductor element with resin sealing member

Publications (2)

Publication Number Publication Date
JPS5660209A true JPS5660209A (en) 1981-05-25
JPS6124971B2 JPS6124971B2 (en) 1986-06-13

Family

ID=15191909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13714779A Granted JPS5660209A (en) 1979-10-23 1979-10-23 Metal mold device for molding semiconductor element with resin sealing member

Country Status (1)

Country Link
JP (1) JPS5660209A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005123358A1 (en) * 2004-06-21 2005-12-29 Mamada Sangyo Mold, method of manufacturing the same, injection molding device, and injection molding method
JP2006035843A (en) * 2004-06-21 2006-02-09 Mamada Sangyo:Kk Mold and its manufacturing method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4380775B1 (en) 2008-05-29 2009-12-09 トヨタ自動車株式会社 FRP member manufacturing method and FRP member
JP4775411B2 (en) * 2008-06-23 2011-09-21 トヨタ自動車株式会社 Screw hole sealing structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005123358A1 (en) * 2004-06-21 2005-12-29 Mamada Sangyo Mold, method of manufacturing the same, injection molding device, and injection molding method
JP2006035843A (en) * 2004-06-21 2006-02-09 Mamada Sangyo:Kk Mold and its manufacturing method
EP1759823A1 (en) * 2004-06-21 2007-03-07 Mamada sangyo Mold, method of manufacturing the same, injection molding device, and injection molding method
US7497679B2 (en) 2004-06-21 2009-03-03 Mamada Sangyo Injection mold having a switching valve
EP1759823A4 (en) * 2004-06-21 2010-01-27 Mamada Sangyo Mold, method of manufacturing the same, injection molding device, and injection molding method

Also Published As

Publication number Publication date
JPS6124971B2 (en) 1986-06-13

Similar Documents

Publication Publication Date Title
DK124485D0 (en) SPRAY SPRAY FORM
DK208980A (en) PRESSURE MAKING MECHANISM AND USE OF THIS
JPS5660209A (en) Metal mold device for molding semiconductor element with resin sealing member
ES481317A1 (en) Nozzle for a plastics injection molding machine, an extruder orifice, or a hot-chamber tool
GB1067285A (en) Squeeze-type dispensing head
JPS6485724A (en) Method for injection molding cylindrical molded item
JPS5753334A (en) Polyestel resin injection molding machine and polyestel resin molding by said machine
JPS57191032A (en) Hot runner mold device
JPS55121044A (en) Transfer molding equipment capable of continuous molding
DK280784D0 (en) Nozzle for spray molds
JPS5387173A (en) Molding mold
JPS57205120A (en) Molding of aspherical lens
JPS56144136A (en) Injection molding device for polyester resin
JPS56130332A (en) Shrinkage dent preventive molding
JPS57207050A (en) Transfer mold
JPS5619733A (en) Fitting mechanism of steam orifice in foamed forming device
JPS57135401A (en) Parts block molding method to substrate
JPS55148141A (en) Securing method of rotary body and lug arbor or the like to each other
JPS57137130A (en) Method for resin sealing
GB1046854A (en) Improvements in bowling pins
JPS5669123A (en) Method of manufacturing prism
JPS6467323A (en) Evaluation method for fluid analysis in molding of molten material
JPS6467322A (en) Evaluation method for fluid analysis in molding of molten material
JPS5759734A (en) Method of molding indicating part such as character and pattern in one body on surface of molded article
JPS6475213A (en) Insert molding mold