JPS5655041A - Positioning exposure - Google Patents

Positioning exposure

Info

Publication number
JPS5655041A
JPS5655041A JP12998579A JP12998579A JPS5655041A JP S5655041 A JPS5655041 A JP S5655041A JP 12998579 A JP12998579 A JP 12998579A JP 12998579 A JP12998579 A JP 12998579A JP S5655041 A JPS5655041 A JP S5655041A
Authority
JP
Japan
Prior art keywords
wafer
pattern
mask
elongated
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12998579A
Other languages
Japanese (ja)
Other versions
JPS6214935B2 (en
Inventor
Sunao Ishihara
Eitaro Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP12998579A priority Critical patent/JPS5655041A/en
Publication of JPS5655041A publication Critical patent/JPS5655041A/en
Publication of JPS6214935B2 publication Critical patent/JPS6214935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE:To enable positioning over an entire wafer surface even if the wafer is elongated or contracted by executing trial exposure and development beforehand, measuring and correcting the displacements of the positions of patterns A and B at three positions on the wafer and exposing it. CONSTITUTION:In calcining a pattern 4 on a mask 2 on a wafer 3 using a radiant ray from a point light source 1, the pattern 4 is positioned on a pattern 5 already calcined on the wafer 3, and is then transferred onto the position of a pattern 4'. When an interval between the mask 2 and the wafer 3 is represented by S and a distance between a light source 1 and the wafer is represented by D, the pattern 4 on the mask 2 at the position of a radius R is projected on a position of the pattern 4' in the amount determined by the S, D and R in a radial direction by the light beam of radial type. Accordingly, the distance S or D is varied, and the pattern is radially positioned. The elongated or contacted amount of the wafer in the radial direction is corrected, and the entire wafer surface is thus positioned.
JP12998579A 1979-10-11 1979-10-11 Positioning exposure Granted JPS5655041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12998579A JPS5655041A (en) 1979-10-11 1979-10-11 Positioning exposure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12998579A JPS5655041A (en) 1979-10-11 1979-10-11 Positioning exposure

Publications (2)

Publication Number Publication Date
JPS5655041A true JPS5655041A (en) 1981-05-15
JPS6214935B2 JPS6214935B2 (en) 1987-04-04

Family

ID=15023299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12998579A Granted JPS5655041A (en) 1979-10-11 1979-10-11 Positioning exposure

Country Status (1)

Country Link
JP (1) JPS5655041A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134830A (en) * 1982-12-30 1984-08-02 トムソン−セ−エスエフ Method and apparatus for optically arraying pattern on two close-up plane
JPH07209876A (en) * 1995-01-30 1995-08-11 Canon Inc X-ray transfer device and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51140488A (en) * 1975-05-30 1976-12-03 Hitachi Ltd Mask alignment device
JPS524177A (en) * 1975-06-27 1977-01-13 Toshiba Corp Automatic mask aligning method
JPS5318970A (en) * 1976-08-05 1978-02-21 Siemens Ag Method of aligning relative position of substrate and photo mask
JPS5336998A (en) * 1976-09-15 1978-04-05 Fuaburitsuku Nat Erusutaru Sa Sport gun

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51140488A (en) * 1975-05-30 1976-12-03 Hitachi Ltd Mask alignment device
JPS524177A (en) * 1975-06-27 1977-01-13 Toshiba Corp Automatic mask aligning method
JPS5318970A (en) * 1976-08-05 1978-02-21 Siemens Ag Method of aligning relative position of substrate and photo mask
JPS5336998A (en) * 1976-09-15 1978-04-05 Fuaburitsuku Nat Erusutaru Sa Sport gun

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134830A (en) * 1982-12-30 1984-08-02 トムソン−セ−エスエフ Method and apparatus for optically arraying pattern on two close-up plane
JPS6352453B2 (en) * 1982-12-30 1988-10-19 Tomuson Sa
JPH07209876A (en) * 1995-01-30 1995-08-11 Canon Inc X-ray transfer device and method

Also Published As

Publication number Publication date
JPS6214935B2 (en) 1987-04-04

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