JPS5651848A - Condenser for boiling type cooling device - Google Patents

Condenser for boiling type cooling device

Info

Publication number
JPS5651848A
JPS5651848A JP12794379A JP12794379A JPS5651848A JP S5651848 A JPS5651848 A JP S5651848A JP 12794379 A JP12794379 A JP 12794379A JP 12794379 A JP12794379 A JP 12794379A JP S5651848 A JPS5651848 A JP S5651848A
Authority
JP
Japan
Prior art keywords
condenser
steam
tubes
tube
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12794379A
Other languages
Japanese (ja)
Other versions
JPS628036B2 (en
Inventor
Teigo Okada
Hisao Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12794379A priority Critical patent/JPS5651848A/en
Publication of JPS5651848A publication Critical patent/JPS5651848A/en
Publication of JPS628036B2 publication Critical patent/JPS628036B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To improve cooling capability, by connecting the headers of the condenser by condenser tubes having respectively different sectional area. CONSTITUTION:The headers 5 and 8 are connected by the condenser tubes 6a to 6c in such a manner that inner diameters of tubes become smaller toward upper stages. In this constitution, the tube 6c of the bottom stage is to be cooled most easily and flow rate of boiling steam 13 of a refrigerant 3 is the largest. The tube 6a on the top stage has the smallest heat dissipation and the smallest steam flow. As the resistance of the steam passage has been equalized by varying the sectional areas of the tube in this manner, the steam 13 is equally cooled in all the tubes, and therefore, the cooling capability is improved.
JP12794379A 1979-10-05 1979-10-05 Condenser for boiling type cooling device Granted JPS5651848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12794379A JPS5651848A (en) 1979-10-05 1979-10-05 Condenser for boiling type cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12794379A JPS5651848A (en) 1979-10-05 1979-10-05 Condenser for boiling type cooling device

Publications (2)

Publication Number Publication Date
JPS5651848A true JPS5651848A (en) 1981-05-09
JPS628036B2 JPS628036B2 (en) 1987-02-20

Family

ID=14972463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12794379A Granted JPS5651848A (en) 1979-10-05 1979-10-05 Condenser for boiling type cooling device

Country Status (1)

Country Link
JP (1) JPS5651848A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2746492A1 (en) * 1996-03-14 1997-09-26 Denso Corp DEVICE COOLING BY COOLING AND CONDENSING
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6357517B1 (en) 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US6967841B1 (en) 2004-05-07 2005-11-22 International Business Machines Corporation Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover
JP2016164478A (en) * 2015-03-06 2016-09-08 株式会社東芝 Cooling device
WO2020105323A1 (en) * 2018-11-22 2020-05-28 株式会社Ｓｏｋｅｎ Boiling cooling device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357517B1 (en) 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
FR2746492A1 (en) * 1996-03-14 1997-09-26 Denso Corp DEVICE COOLING BY COOLING AND CONDENSING
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6527045B1 (en) 1996-03-14 2003-03-04 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US7004239B2 (en) 1996-03-14 2006-02-28 Denso Corporation Cooling apparatus boiling and condensing refrigerant
US6967841B1 (en) 2004-05-07 2005-11-22 International Business Machines Corporation Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover
JP2016164478A (en) * 2015-03-06 2016-09-08 株式会社東芝 Cooling device
WO2020105323A1 (en) * 2018-11-22 2020-05-28 株式会社Ｓｏｋｅｎ Boiling cooling device

Also Published As

Publication number Publication date
JPS628036B2 (en) 1987-02-20

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