JPS5651848A - Condenser for boiling type cooling device - Google Patents
Condenser for boiling type cooling deviceInfo
- Publication number
- JPS5651848A JPS5651848A JP12794379A JP12794379A JPS5651848A JP S5651848 A JPS5651848 A JP S5651848A JP 12794379 A JP12794379 A JP 12794379A JP 12794379 A JP12794379 A JP 12794379A JP S5651848 A JPS5651848 A JP S5651848A
- Authority
- JP
- Japan
- Prior art keywords
- condenser
- steam
- tubes
- tube
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve cooling capability, by connecting the headers of the condenser by condenser tubes having respectively different sectional area. CONSTITUTION:The headers 5 and 8 are connected by the condenser tubes 6a to 6c in such a manner that inner diameters of tubes become smaller toward upper stages. In this constitution, the tube 6c of the bottom stage is to be cooled most easily and flow rate of boiling steam 13 of a refrigerant 3 is the largest. The tube 6a on the top stage has the smallest heat dissipation and the smallest steam flow. As the resistance of the steam passage has been equalized by varying the sectional areas of the tube in this manner, the steam 13 is equally cooled in all the tubes, and therefore, the cooling capability is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12794379A JPS5651848A (en) | 1979-10-05 | 1979-10-05 | Condenser for boiling type cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12794379A JPS5651848A (en) | 1979-10-05 | 1979-10-05 | Condenser for boiling type cooling device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5651848A true JPS5651848A (en) | 1981-05-09 |
JPS628036B2 JPS628036B2 (en) | 1987-02-20 |
Family
ID=14972463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12794379A Granted JPS5651848A (en) | 1979-10-05 | 1979-10-05 | Condenser for boiling type cooling device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5651848A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2746492A1 (en) * | 1996-03-14 | 1997-09-26 | Denso Corp | DEVICE COOLING BY COOLING AND CONDENSING |
US6076596A (en) * | 1996-03-14 | 2000-06-20 | Denso Corporation | Cooling apparatus for high-temperature medium by boiling and condensing refrigerant |
US6357517B1 (en) | 1994-07-04 | 2002-03-19 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
US6967841B1 (en) | 2004-05-07 | 2005-11-22 | International Business Machines Corporation | Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover |
JP2016164478A (en) * | 2015-03-06 | 2016-09-08 | 株式会社東芝 | Cooling device |
WO2020105323A1 (en) * | 2018-11-22 | 2020-05-28 | 株式会社Soken | Boiling cooling device |
-
1979
- 1979-10-05 JP JP12794379A patent/JPS5651848A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6357517B1 (en) | 1994-07-04 | 2002-03-19 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
FR2746492A1 (en) * | 1996-03-14 | 1997-09-26 | Denso Corp | DEVICE COOLING BY COOLING AND CONDENSING |
US6076596A (en) * | 1996-03-14 | 2000-06-20 | Denso Corporation | Cooling apparatus for high-temperature medium by boiling and condensing refrigerant |
US6527045B1 (en) | 1996-03-14 | 2003-03-04 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
US7004239B2 (en) | 1996-03-14 | 2006-02-28 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant |
US6967841B1 (en) | 2004-05-07 | 2005-11-22 | International Business Machines Corporation | Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover |
JP2016164478A (en) * | 2015-03-06 | 2016-09-08 | 株式会社東芝 | Cooling device |
WO2020105323A1 (en) * | 2018-11-22 | 2020-05-28 | 株式会社Soken | Boiling cooling device |
Also Published As
Publication number | Publication date |
---|---|
JPS628036B2 (en) | 1987-02-20 |
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