JPS5647593A - Continuous plating method for wire material - Google Patents
Continuous plating method for wire materialInfo
- Publication number
- JPS5647593A JPS5647593A JP12184179A JP12184179A JPS5647593A JP S5647593 A JPS5647593 A JP S5647593A JP 12184179 A JP12184179 A JP 12184179A JP 12184179 A JP12184179 A JP 12184179A JP S5647593 A JPS5647593 A JP S5647593A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- roll
- tank
- wire material
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 13
- 239000000463 material Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000007788 liquid Substances 0.000 abstract 5
- 239000004020 conductor Substances 0.000 abstract 2
- 238000001556 precipitation Methods 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000002244 precipitate Substances 0.000 abstract 1
Abstract
PURPOSE: To carry out a high grade plating of a wire material efficiently and continuously by a method wherein a receiving tank is arranged below a conductor roll arranged opposed against a plating tank and a plating liquid is introduced to maintain a surface of roll in a wet condition.
CONSTITUTION: A receiving tank 7 is provided below a conductor roll 4 arranged opposed against slits 3 of a plating tank 11 and a plating liquid is supplied from the plating tank 11 to immerse a lower portion of the roll 4. A wire material a is immersed in a plating liquid 2 in the receiving tank 7 according to the rotation of the roll 4 and the surface thereof is wased, wetted and prevented from being oxidized. Moreover, the surface of the roll is always in a wet condition by the plating liquid 2 and prevented from the precipitation of components in a plating liquid and the deposition of precipitates. Accordingly, even if in plural repeated platings in high speed and thick plating is carried out, a good plating surface without defects, being generated due to the precipitation is obtained.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12184179A JPS6056239B2 (en) | 1979-09-21 | 1979-09-21 | Continuous plating method for wire rods |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12184179A JPS6056239B2 (en) | 1979-09-21 | 1979-09-21 | Continuous plating method for wire rods |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5647593A true JPS5647593A (en) | 1981-04-30 |
JPS6056239B2 JPS6056239B2 (en) | 1985-12-09 |
Family
ID=14821250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12184179A Expired JPS6056239B2 (en) | 1979-09-21 | 1979-09-21 | Continuous plating method for wire rods |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6056239B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62146281U (en) * | 1986-03-04 | 1987-09-16 |
-
1979
- 1979-09-21 JP JP12184179A patent/JPS6056239B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62146281U (en) * | 1986-03-04 | 1987-09-16 |
Also Published As
Publication number | Publication date |
---|---|
JPS6056239B2 (en) | 1985-12-09 |
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