JPS5645035A - Preparation of semiconductor-supporting electrode - Google Patents

Preparation of semiconductor-supporting electrode

Info

Publication number
JPS5645035A
JPS5645035A JP11936979A JP11936979A JPS5645035A JP S5645035 A JPS5645035 A JP S5645035A JP 11936979 A JP11936979 A JP 11936979A JP 11936979 A JP11936979 A JP 11936979A JP S5645035 A JPS5645035 A JP S5645035A
Authority
JP
Japan
Prior art keywords
fibers
plates
semiconductor
bundle
disorder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11936979A
Other languages
Japanese (ja)
Inventor
Hitoshi Onuki
Noboru Baba
Hiroshi Soeno
Keiichi Kuniya
Hideo Arakawa
Takuzo Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11936979A priority Critical patent/JPS5645035A/en
Publication of JPS5645035A publication Critical patent/JPS5645035A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain a semiconductor-supporting electrode having small and uniform thermal expansion coefficient by alternately piling a composite material of Cu and spiral C fibers and Cu plates to form one body so that the disorder of the fibers in the lateral and longitudinal directions can be prevented. CONSTITUTION:When the C in a Cu-C fiber is made above 50vol%, a bundle of the fibers can have a fairly even Cu plated layer, and therefore the bundle can be coiled uniformly, so that the undulation of the C fibers is prevented. Moreover, hot- pressing several coiled Cu-C fibers sandwiching Cu plates permits the Cu plates to prevent the deformation of the fibers. Consequently, the contraction coefficient decreases, and also the longitudinal disorder of the fibers largely reduces. In addition, the electrical conductivity can be adjusted by increasing or decreasing the volume of the Cu. The constitution permits an electrode having a uniform thermal expansion coefficient to be formed at a large yield.
JP11936979A 1979-09-19 1979-09-19 Preparation of semiconductor-supporting electrode Pending JPS5645035A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11936979A JPS5645035A (en) 1979-09-19 1979-09-19 Preparation of semiconductor-supporting electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11936979A JPS5645035A (en) 1979-09-19 1979-09-19 Preparation of semiconductor-supporting electrode

Publications (1)

Publication Number Publication Date
JPS5645035A true JPS5645035A (en) 1981-04-24

Family

ID=14759788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11936979A Pending JPS5645035A (en) 1979-09-19 1979-09-19 Preparation of semiconductor-supporting electrode

Country Status (1)

Country Link
JP (1) JPS5645035A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573872A (en) * 1982-12-27 1986-03-04 Tokyo Shibaura Denki Kabushiki Kaisha High temperature heat resistant structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573872A (en) * 1982-12-27 1986-03-04 Tokyo Shibaura Denki Kabushiki Kaisha High temperature heat resistant structure

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