JPS5643854A - Control system of received carrier detecting circuit - Google Patents

Control system of received carrier detecting circuit

Info

Publication number
JPS5643854A
JPS5643854A JP11874479A JP11874479A JPS5643854A JP S5643854 A JPS5643854 A JP S5643854A JP 11874479 A JP11874479 A JP 11874479A JP 11874479 A JP11874479 A JP 11874479A JP S5643854 A JPS5643854 A JP S5643854A
Authority
JP
Japan
Prior art keywords
detecting circuit
received
circuit
signal
synchronizing signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11874479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6316938B2 (enrdf_load_stackoverflow
Inventor
Tsutomu Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11874479A priority Critical patent/JPS5643854A/ja
Publication of JPS5643854A publication Critical patent/JPS5643854A/ja
Publication of JPS6316938B2 publication Critical patent/JPS6316938B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L27/00—Modulated-carrier systems
    • H04L27/02—Amplitude-modulated carrier systems, e.g. using on-off keying; Single sideband or vestigial sideband modulation
    • H04L27/06—Demodulator circuits; Receiver circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Digital Transmission Methods That Use Modulated Carrier Waves (AREA)
  • Communication Control (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
JP11874479A 1979-09-18 1979-09-18 Control system of received carrier detecting circuit Granted JPS5643854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11874479A JPS5643854A (en) 1979-09-18 1979-09-18 Control system of received carrier detecting circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11874479A JPS5643854A (en) 1979-09-18 1979-09-18 Control system of received carrier detecting circuit

Publications (2)

Publication Number Publication Date
JPS5643854A true JPS5643854A (en) 1981-04-22
JPS6316938B2 JPS6316938B2 (enrdf_load_stackoverflow) 1988-04-12

Family

ID=14743977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11874479A Granted JPS5643854A (en) 1979-09-18 1979-09-18 Control system of received carrier detecting circuit

Country Status (1)

Country Link
JP (1) JPS5643854A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504435A (en) * 1982-10-04 1985-03-12 Texas Instruments Incorporated Method for semiconductor device packaging
JPS6075165A (ja) * 1983-10-01 1985-04-27 Nippon Telegr & Teleph Corp <Ntt> 電話回線切換制御回路
JPH02191365A (ja) * 1988-10-20 1990-07-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5371044A (en) * 1991-05-27 1994-12-06 Hitachi, Ltd. Method of uniformly encapsulating a semiconductor device in resin
US5766649A (en) * 1995-12-15 1998-06-16 Nec Corporation Resin sealing mold die set with less resin remainder for semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4504435A (en) * 1982-10-04 1985-03-12 Texas Instruments Incorporated Method for semiconductor device packaging
JPS6075165A (ja) * 1983-10-01 1985-04-27 Nippon Telegr & Teleph Corp <Ntt> 電話回線切換制御回路
JPH02191365A (ja) * 1988-10-20 1990-07-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5371044A (en) * 1991-05-27 1994-12-06 Hitachi, Ltd. Method of uniformly encapsulating a semiconductor device in resin
US5766649A (en) * 1995-12-15 1998-06-16 Nec Corporation Resin sealing mold die set with less resin remainder for semiconductor device

Also Published As

Publication number Publication date
JPS6316938B2 (enrdf_load_stackoverflow) 1988-04-12

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