JPS5643658B2 - - Google Patents
Info
- Publication number
- JPS5643658B2 JPS5643658B2 JP9681876A JP9681876A JPS5643658B2 JP S5643658 B2 JPS5643658 B2 JP S5643658B2 JP 9681876 A JP9681876 A JP 9681876A JP 9681876 A JP9681876 A JP 9681876A JP S5643658 B2 JPS5643658 B2 JP S5643658B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9681876A JPS5322365A (en) | 1976-08-13 | 1976-08-13 | Resin mold type semiconductor device and its production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9681876A JPS5322365A (en) | 1976-08-13 | 1976-08-13 | Resin mold type semiconductor device and its production |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57123842A Division JPS5882543A (ja) | 1982-07-15 | 1982-07-15 | レジンモ−ルド型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5322365A JPS5322365A (en) | 1978-03-01 |
JPS5643658B2 true JPS5643658B2 (xx) | 1981-10-14 |
Family
ID=14175152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9681876A Granted JPS5322365A (en) | 1976-08-13 | 1976-08-13 | Resin mold type semiconductor device and its production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5322365A (xx) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5378607A (en) * | 1976-12-23 | 1978-07-12 | Mitsubishi Heavy Ind Ltd | Internal combustion type vibratory pile driver |
JPS5825134B2 (ja) * | 1976-12-24 | 1983-05-25 | 三菱重工業株式会社 | 振動杭打機 |
JPS5718330A (en) * | 1980-07-10 | 1982-01-30 | Toshiba Corp | Method of and apparatus for soldering semiconductor device |
JPS5987152U (ja) * | 1982-11-30 | 1984-06-13 | 三菱電機株式会社 | 半導体装置用フレ−ム |
JPH07123153B2 (ja) * | 1986-11-12 | 1995-12-25 | 日立電線株式会社 | 半導体装置用リ−ドフレ−ムの製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS513742U (xx) * | 1974-06-25 | 1976-01-12 | ||
JPS5117383A (xx) * | 1974-08-05 | 1976-02-12 | Asahi Chemical Ind | |
JPS5143078A (ja) * | 1974-10-09 | 1976-04-13 | Nippon Electric Co | Handotaisochi |
JPS5162668A (ja) * | 1974-11-27 | 1976-05-31 | New Nippon Electric Co | Moorudogatahandotaisochino seizohoho |
-
1976
- 1976-08-13 JP JP9681876A patent/JPS5322365A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS513742U (xx) * | 1974-06-25 | 1976-01-12 | ||
JPS5117383A (xx) * | 1974-08-05 | 1976-02-12 | Asahi Chemical Ind | |
JPS5143078A (ja) * | 1974-10-09 | 1976-04-13 | Nippon Electric Co | Handotaisochi |
JPS5162668A (ja) * | 1974-11-27 | 1976-05-31 | New Nippon Electric Co | Moorudogatahandotaisochino seizohoho |
Also Published As
Publication number | Publication date |
---|---|
JPS5322365A (en) | 1978-03-01 |