JPS564246A - Manufacture of semiconductor device, and semiconductor wafer bonding substrate therefor - Google Patents
Manufacture of semiconductor device, and semiconductor wafer bonding substrate thereforInfo
- Publication number
- JPS564246A JPS564246A JP7983479A JP7983479A JPS564246A JP S564246 A JPS564246 A JP S564246A JP 7983479 A JP7983479 A JP 7983479A JP 7983479 A JP7983479 A JP 7983479A JP S564246 A JPS564246 A JP S564246A
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- substrate
- projections
- wafer
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To prevent the position of a pellet from deviating, by bonding the wafer on the tops of plural projections of a semiconductor wafer bonding substrate, dividing the wafer into pellets and simultaneously thermocompression bonding a plurality of leads to the pellets. CONSTITUTION:Grooves are provided on a quartz glass 1a to make projections 11 of 1mu in width and thickness and 1mm. in height, for example, or fiber glass projections of 150mu in diameter are implanted at the rate of 16 pieces per square millimeter in a glass epoxy plate so that the flatness is set within a range of + or -20mu. A wafer 4 is bonded at 3 on the substrate 1a and divided into pellets 6 by a saw 5. Since only a part of each projection 11 is cut by the saw, the lifetime of its cutting edge is lengthened. Since the quantity of heat transferred through the projections is less than a half of that transferred through the plain substrate, the temperature of a heater tip 10 can be made lower than that of a heater tip in a conventional case and the lifetime of the former heater tip 10 is about twice longer than that of the latter. Because the position of each pellet does not deviate and is hardly changed by the cutting, the leads 7 can be continuously gang-bonded by moving the substrate at an interval equal to the disposition spacing of the pellets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7983479A JPS564246A (en) | 1979-06-25 | 1979-06-25 | Manufacture of semiconductor device, and semiconductor wafer bonding substrate therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7983479A JPS564246A (en) | 1979-06-25 | 1979-06-25 | Manufacture of semiconductor device, and semiconductor wafer bonding substrate therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS564246A true JPS564246A (en) | 1981-01-17 |
Family
ID=13701232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7983479A Pending JPS564246A (en) | 1979-06-25 | 1979-06-25 | Manufacture of semiconductor device, and semiconductor wafer bonding substrate therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS564246A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62178308A (en) * | 1986-01-31 | 1987-08-05 | ロ−ム株式会社 | Manufacture of semiconductor device |
-
1979
- 1979-06-25 JP JP7983479A patent/JPS564246A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62178308A (en) * | 1986-01-31 | 1987-08-05 | ロ−ム株式会社 | Manufacture of semiconductor device |
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