JPS5640253A - Inversion device for chip bonder - Google Patents

Inversion device for chip bonder

Info

Publication number
JPS5640253A
JPS5640253A JP11653979A JP11653979A JPS5640253A JP S5640253 A JPS5640253 A JP S5640253A JP 11653979 A JP11653979 A JP 11653979A JP 11653979 A JP11653979 A JP 11653979A JP S5640253 A JPS5640253 A JP S5640253A
Authority
JP
Japan
Prior art keywords
lever
nozzle
curve
reaches
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11653979A
Other languages
Japanese (ja)
Other versions
JPS5824017B2 (en
Inventor
Nobukichi Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP11653979A priority Critical patent/JPS5824017B2/en
Publication of JPS5640253A publication Critical patent/JPS5640253A/en
Publication of JPS5824017B2 publication Critical patent/JPS5824017B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To invert an arm for adsorbing a chip fixed to a rotary axis by linking a lever oscillating recillating reciprocally with a toothed wheel by a coupling rod wherein a pinion engaging with the toothed wheel is rotated. CONSTITUTION:A chip is adsorbed to the nozzle of an arm when the curve 20a with the minimum diameter of a cam 20 reaches a lever 23 and the lever 23 will rotate when a curve 20b reaches the lever and a toothed wheel 27 rotates in the same direction through a coupling rod 30. A pinion 36 will rotate due to the above process and the arm fixed to the pinion turns reversely. When a curve 20c with the maximum diameter reaches the lever 23, the nozzle will stop at a predetermined position and a working gadget falls down on the nozzle by a separate mechanism to receive the chip by synchronizing control and the working gadget 15 will rise after adsorbing the chip. Then, when the curve 20d of the cam 20 reaches the lever 23, the lever 23 starts to rotate in a reverse direction by a spring 26 and the nozzle will return to the original position when the curve 20a reaches the lever 23. After this process, repeated supplies of chips are continued. The final position of the nozzle will be decided either by adjusting the position contacting with the toothed wheel 27 by moving a stopper 27 or by adjusting the length of the coupling rod 30.
JP11653979A 1979-09-10 1979-09-10 Reversing device in chip bonder Expired JPS5824017B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11653979A JPS5824017B2 (en) 1979-09-10 1979-09-10 Reversing device in chip bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11653979A JPS5824017B2 (en) 1979-09-10 1979-09-10 Reversing device in chip bonder

Publications (2)

Publication Number Publication Date
JPS5640253A true JPS5640253A (en) 1981-04-16
JPS5824017B2 JPS5824017B2 (en) 1983-05-18

Family

ID=14689618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11653979A Expired JPS5824017B2 (en) 1979-09-10 1979-09-10 Reversing device in chip bonder

Country Status (1)

Country Link
JP (1) JPS5824017B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03159197A (en) * 1989-11-16 1991-07-09 Matsushita Electric Ind Co Ltd Bonding device for flip chip
JP2010073927A (en) * 2008-09-19 2010-04-02 Panasonic Corp Component pickup apparatus
JP2010073928A (en) * 2008-09-19 2010-04-02 Panasonic Corp Component pickup apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180210A (en) * 1986-02-05 1987-08-07 Shigeji Hakoyama Tilt angle measuring instrument

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03159197A (en) * 1989-11-16 1991-07-09 Matsushita Electric Ind Co Ltd Bonding device for flip chip
JP2010073927A (en) * 2008-09-19 2010-04-02 Panasonic Corp Component pickup apparatus
JP2010073928A (en) * 2008-09-19 2010-04-02 Panasonic Corp Component pickup apparatus
JP4752889B2 (en) * 2008-09-19 2011-08-17 パナソニック株式会社 Component mounting equipment

Also Published As

Publication number Publication date
JPS5824017B2 (en) 1983-05-18

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