JPS5637641A - Apparatus for manufacturing semiconductor device - Google Patents

Apparatus for manufacturing semiconductor device

Info

Publication number
JPS5637641A
JPS5637641A JP11332379A JP11332379A JPS5637641A JP S5637641 A JPS5637641 A JP S5637641A JP 11332379 A JP11332379 A JP 11332379A JP 11332379 A JP11332379 A JP 11332379A JP S5637641 A JPS5637641 A JP S5637641A
Authority
JP
Japan
Prior art keywords
tape
tensile force
film carrier
displacement amount
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11332379A
Other languages
Japanese (ja)
Inventor
Susumu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11332379A priority Critical patent/JPS5637641A/en
Publication of JPS5637641A publication Critical patent/JPS5637641A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable the high speed feeding of frames by an apparatus wherein a tape made of conductive material is laid upon a film carrier to apply an added tensile force. CONSTITUTION:When a film carrier 21 is fed through the frame feeding in the direction as shown by an arrow, the displacement amount of a tape 22 for applying a tensile force decreases gradually, while the tape 22 for applying a tensile force that is introduced within a vacuum chnamber 26 for preventing the slack increases its displacement amount and descends gradually. On this occasion, a position detecting sensor is started to operate and the film carrier is supplied from a reel, so that the displacement amount of the tape 22 within a chamber 23 for applying the tensile force is reduced by half again. In the vacuum chamber 26 for preventing the slack, the displacement amount of the tape is reduced and the tape is ascended, so that the supply of th film carrier from the reel is stopped by a signal from the position detecting sensor. In such a manner, when the tensile force is applied by using vacuum, there is produced no increase in a dynamic force in relation to the sudden change in acceleration of the film carrier, thereby obtaining the sufficient strength of perforations with respect to the high speed frame feeding and further the stable tensile force.
JP11332379A 1979-09-04 1979-09-04 Apparatus for manufacturing semiconductor device Pending JPS5637641A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11332379A JPS5637641A (en) 1979-09-04 1979-09-04 Apparatus for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11332379A JPS5637641A (en) 1979-09-04 1979-09-04 Apparatus for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5637641A true JPS5637641A (en) 1981-04-11

Family

ID=14609315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11332379A Pending JPS5637641A (en) 1979-09-04 1979-09-04 Apparatus for manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5637641A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62129502U (en) * 1986-02-07 1987-08-15
JPS63179198U (en) * 1987-05-11 1988-11-21

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62129502U (en) * 1986-02-07 1987-08-15
JPS63179198U (en) * 1987-05-11 1988-11-21

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