JPS563679B2 - - Google Patents
Info
- Publication number
- JPS563679B2 JPS563679B2 JP15147976A JP15147976A JPS563679B2 JP S563679 B2 JPS563679 B2 JP S563679B2 JP 15147976 A JP15147976 A JP 15147976A JP 15147976 A JP15147976 A JP 15147976A JP S563679 B2 JPS563679 B2 JP S563679B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15147976A JPS5376366A (en) | 1976-12-18 | 1976-12-18 | Method of producing ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15147976A JPS5376366A (en) | 1976-12-18 | 1976-12-18 | Method of producing ceramic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5376366A JPS5376366A (en) | 1978-07-06 |
| JPS563679B2 true JPS563679B2 (fr) | 1981-01-26 |
Family
ID=15519394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15147976A Granted JPS5376366A (en) | 1976-12-18 | 1976-12-18 | Method of producing ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5376366A (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55138294A (en) * | 1979-04-11 | 1980-10-28 | Matsushita Electric Ind Co Ltd | Method of forming through hole connector |
| JPS55138296A (en) * | 1979-04-11 | 1980-10-28 | Matsushita Electric Ind Co Ltd | Method of fabricating printed circuit board |
| JPS55138297A (en) * | 1979-04-13 | 1980-10-28 | Matsushita Electric Ind Co Ltd | Method of connecting wind through of multilayer printed circuit board |
| JPS56140696A (en) * | 1980-04-04 | 1981-11-04 | Sony Corp | Method of manufacturing circuit board |
| JPS57120398A (en) * | 1981-01-19 | 1982-07-27 | Sanyo Electric Co | Method of connecting both-side printed foil of both-side printed circuit board |
| JPS57120059A (en) * | 1981-01-19 | 1982-07-26 | Sanyo Electric Co Ltd | Water heater utilizing solar heat |
| JPH0719963B2 (ja) * | 1985-11-29 | 1995-03-06 | 富士通株式会社 | 多層セラミツク回路基板の製造方法 |
| JPH01253994A (ja) * | 1988-04-01 | 1989-10-11 | Murata Mfg Co Ltd | セラミック多層基板のバイアホール形成方法 |
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1976
- 1976-12-18 JP JP15147976A patent/JPS5376366A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5376366A (en) | 1978-07-06 |