JPS5633847A - Package molding for semiconductor - Google Patents

Package molding for semiconductor

Info

Publication number
JPS5633847A
JPS5633847A JP10996579A JP10996579A JPS5633847A JP S5633847 A JPS5633847 A JP S5633847A JP 10996579 A JP10996579 A JP 10996579A JP 10996579 A JP10996579 A JP 10996579A JP S5633847 A JPS5633847 A JP S5633847A
Authority
JP
Japan
Prior art keywords
cavities
thermoplastic resin
plate shaped
resin plate
shaped substances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10996579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6122467B2 (cg-RX-API-DMAC10.html
Inventor
Mitsuyoshi Nakatsuka
Keiji Hazama
Shinichi Oota
Fumio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP10996579A priority Critical patent/JPS5633847A/ja
Publication of JPS5633847A publication Critical patent/JPS5633847A/ja
Publication of JPS6122467B2 publication Critical patent/JPS6122467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W90/756—

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)
JP10996579A 1979-08-28 1979-08-28 Package molding for semiconductor Granted JPS5633847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10996579A JPS5633847A (en) 1979-08-28 1979-08-28 Package molding for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10996579A JPS5633847A (en) 1979-08-28 1979-08-28 Package molding for semiconductor

Publications (2)

Publication Number Publication Date
JPS5633847A true JPS5633847A (en) 1981-04-04
JPS6122467B2 JPS6122467B2 (cg-RX-API-DMAC10.html) 1986-05-31

Family

ID=14523633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10996579A Granted JPS5633847A (en) 1979-08-28 1979-08-28 Package molding for semiconductor

Country Status (1)

Country Link
JP (1) JPS5633847A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6313352A (ja) * 1986-07-04 1988-01-20 Sumitomo Bakelite Co Ltd 半導体類の封止方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6313352A (ja) * 1986-07-04 1988-01-20 Sumitomo Bakelite Co Ltd 半導体類の封止方法

Also Published As

Publication number Publication date
JPS6122467B2 (cg-RX-API-DMAC10.html) 1986-05-31

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