JPS5628383B2 - - Google Patents

Info

Publication number
JPS5628383B2
JPS5628383B2 JP3636475A JP3636475A JPS5628383B2 JP S5628383 B2 JPS5628383 B2 JP S5628383B2 JP 3636475 A JP3636475 A JP 3636475A JP 3636475 A JP3636475 A JP 3636475A JP S5628383 B2 JPS5628383 B2 JP S5628383B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3636475A
Other languages
Japanese (ja)
Other versions
JPS51110985A (sv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3636475A priority Critical patent/JPS5628383B2/ja
Publication of JPS51110985A publication Critical patent/JPS51110985A/ja
Publication of JPS5628383B2 publication Critical patent/JPS5628383B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Photovoltaic Devices (AREA)
JP3636475A 1975-03-25 1975-03-25 Expired JPS5628383B2 (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3636475A JPS5628383B2 (sv) 1975-03-25 1975-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3636475A JPS5628383B2 (sv) 1975-03-25 1975-03-25

Publications (2)

Publication Number Publication Date
JPS51110985A JPS51110985A (sv) 1976-09-30
JPS5628383B2 true JPS5628383B2 (sv) 1981-07-01

Family

ID=12467766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3636475A Expired JPS5628383B2 (sv) 1975-03-25 1975-03-25

Country Status (1)

Country Link
JP (1) JPS5628383B2 (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3423172A1 (de) * 1983-06-22 1985-01-10 Hitachi, Ltd., Tokio/Tokyo Verfahren zur herstellung einer solarbatterie

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384495A (en) * 1976-12-29 1978-07-25 Japan Solar Energy Semiconductor electrode and method of forming same
JPS54179075U (sv) * 1978-06-07 1979-12-18
JPS57172777A (en) * 1981-04-15 1982-10-23 Nippon Sheet Glass Co Ltd Modularization of photocell
JPS58190050A (ja) * 1982-04-30 1983-11-05 Nec Home Electronics Ltd ダイオ−ド組立方法
JPS59211286A (ja) * 1983-05-17 1984-11-30 Canon Inc 太陽電池ユニツト
JPS60107872A (ja) * 1983-11-16 1985-06-13 Kanegafuchi Chem Ind Co Ltd 光起電力装置
JPS6182485A (ja) * 1984-09-29 1986-04-26 Toshiba Corp 太陽電池パネル
JPH01121959U (sv) * 1988-02-10 1989-08-18
JP4153785B2 (ja) * 2002-12-19 2008-09-24 京セラ株式会社 太陽電池モジュール
JP4024161B2 (ja) * 2003-02-12 2007-12-19 三洋電機株式会社 太陽電池モジュールの製造方法
GB2416621A (en) * 2004-07-27 2006-02-01 Cambridge Display Tech Ltd Laminated interconnects for opto-electronic device modules
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
US9385254B2 (en) 2012-04-17 2016-07-05 Hanergy Hi-Tech Power (Hk) Limited Integrated thin film solar cell interconnection
JP2014075430A (ja) * 2012-10-03 2014-04-24 Sharp Corp 太陽電池モジュール
CN105164816B (zh) 2013-01-28 2017-03-08 环球太阳能公司 光伏互连系统、装置和方法
DE102013219526B4 (de) 2013-09-27 2022-10-13 Meyer Burger (Germany) Gmbh Solarzellenverbund mit Verbindungselement und Verfahren zum Herstellen eines Solarzellenverbunds
US20190305723A1 (en) * 2018-03-28 2019-10-03 The Boeing Company Wiring for a rigid panel solar array

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3423172A1 (de) * 1983-06-22 1985-01-10 Hitachi, Ltd., Tokio/Tokyo Verfahren zur herstellung einer solarbatterie
US4562637A (en) * 1983-06-22 1986-01-07 Hitachi, Ltd. Method of manufacturing solar battery

Also Published As

Publication number Publication date
JPS51110985A (sv) 1976-09-30

Similar Documents

Publication Publication Date Title
JPS5628383B2 (sv)
JPS51132796U (sv)
FR2310052B1 (sv)
JPS5626053B2 (sv)
JPS51150528U (sv)
JPS5278990U (sv)
JPS5618671Y2 (sv)
JPS5331420Y2 (sv)
JPS5416385Y2 (sv)
FR2297853B3 (sv)
JPS52543U (sv)
JPS5218696U (sv)
JPS5254626U (sv)
JPS51100391U (sv)
CH601775A5 (sv)
CH598873A5 (sv)
CH604335A5 (sv)
CH604059A5 (sv)
CH603324A5 (sv)
CH603087A5 (sv)
CH602310A5 (sv)
CH602002A5 (sv)
CH595916A5 (sv)
CH597664A5 (sv)
CH601721A5 (sv)