JPS5628383B2 - - Google Patents
Info
- Publication number
- JPS5628383B2 JPS5628383B2 JP3636475A JP3636475A JPS5628383B2 JP S5628383 B2 JPS5628383 B2 JP S5628383B2 JP 3636475 A JP3636475 A JP 3636475A JP 3636475 A JP3636475 A JP 3636475A JP S5628383 B2 JPS5628383 B2 JP S5628383B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/10—Configurations of laterally-adjacent chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3636475A JPS5628383B2 (https=) | 1975-03-25 | 1975-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3636475A JPS5628383B2 (https=) | 1975-03-25 | 1975-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51110985A JPS51110985A (https=) | 1976-09-30 |
| JPS5628383B2 true JPS5628383B2 (https=) | 1981-07-01 |
Family
ID=12467766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3636475A Expired JPS5628383B2 (https=) | 1975-03-25 | 1975-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5628383B2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3423172A1 (de) * | 1983-06-22 | 1985-01-10 | Hitachi, Ltd., Tokio/Tokyo | Verfahren zur herstellung einer solarbatterie |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5384495A (en) * | 1976-12-29 | 1978-07-25 | Japan Solar Energy | Semiconductor electrode and method of forming same |
| JPS54179075U (https=) * | 1978-06-07 | 1979-12-18 | ||
| JPS57172777A (en) * | 1981-04-15 | 1982-10-23 | Nippon Sheet Glass Co Ltd | Modularization of photocell |
| JPS58190050A (ja) * | 1982-04-30 | 1983-11-05 | Nec Home Electronics Ltd | ダイオ−ド組立方法 |
| JPS59211286A (ja) * | 1983-05-17 | 1984-11-30 | Canon Inc | 太陽電池ユニツト |
| JPS60107872A (ja) * | 1983-11-16 | 1985-06-13 | Kanegafuchi Chem Ind Co Ltd | 光起電力装置 |
| JPS6182485A (ja) * | 1984-09-29 | 1986-04-26 | Toshiba Corp | 太陽電池パネル |
| JPH01121959U (https=) * | 1988-02-10 | 1989-08-18 | ||
| JP2002319689A (ja) * | 2001-04-20 | 2002-10-31 | Sharp Corp | 光電変換素子及びその製造方法 |
| JP4153785B2 (ja) * | 2002-12-19 | 2008-09-24 | 京セラ株式会社 | 太陽電池モジュール |
| JP4024161B2 (ja) * | 2003-02-12 | 2007-12-19 | 三洋電機株式会社 | 太陽電池モジュールの製造方法 |
| GB2416621A (en) * | 2004-07-27 | 2006-02-01 | Cambridge Display Tech Ltd | Laminated interconnects for opto-electronic device modules |
| US8759664B2 (en) | 2009-12-28 | 2014-06-24 | Hanergy Hi-Tech Power (Hk) Limited | Thin film solar cell strings |
| CN104412357B (zh) | 2012-04-17 | 2017-09-22 | 环球太阳能公司 | 积体薄膜太阳能晶胞电池的互连 |
| JP2014075430A (ja) * | 2012-10-03 | 2014-04-24 | Sharp Corp | 太陽電池モジュール |
| US9362433B2 (en) | 2013-01-28 | 2016-06-07 | Hanergy Hi-Tech Power (Hk) Limited | Photovoltaic interconnect systems, devices, and methods |
| DE102013219526B4 (de) | 2013-09-27 | 2022-10-13 | Meyer Burger (Germany) Gmbh | Solarzellenverbund mit Verbindungselement und Verfahren zum Herstellen eines Solarzellenverbunds |
| US12244265B2 (en) * | 2018-03-28 | 2025-03-04 | The Boeing Company | Wiring for a rigid panel solar array |
-
1975
- 1975-03-25 JP JP3636475A patent/JPS5628383B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3423172A1 (de) * | 1983-06-22 | 1985-01-10 | Hitachi, Ltd., Tokio/Tokyo | Verfahren zur herstellung einer solarbatterie |
| US4562637A (en) * | 1983-06-22 | 1986-01-07 | Hitachi, Ltd. | Method of manufacturing solar battery |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51110985A (https=) | 1976-09-30 |