JPS5628383B2 - - Google Patents

Info

Publication number
JPS5628383B2
JPS5628383B2 JP3636475A JP3636475A JPS5628383B2 JP S5628383 B2 JPS5628383 B2 JP S5628383B2 JP 3636475 A JP3636475 A JP 3636475A JP 3636475 A JP3636475 A JP 3636475A JP S5628383 B2 JPS5628383 B2 JP S5628383B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3636475A
Other languages
Japanese (ja)
Other versions
JPS51110985A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3636475A priority Critical patent/JPS5628383B2/ja
Publication of JPS51110985A publication Critical patent/JPS51110985A/ja
Publication of JPS5628383B2 publication Critical patent/JPS5628383B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Photovoltaic Devices (AREA)
JP3636475A 1975-03-25 1975-03-25 Expired JPS5628383B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3636475A JPS5628383B2 (enrdf_load_stackoverflow) 1975-03-25 1975-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3636475A JPS5628383B2 (enrdf_load_stackoverflow) 1975-03-25 1975-03-25

Publications (2)

Publication Number Publication Date
JPS51110985A JPS51110985A (enrdf_load_stackoverflow) 1976-09-30
JPS5628383B2 true JPS5628383B2 (enrdf_load_stackoverflow) 1981-07-01

Family

ID=12467766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3636475A Expired JPS5628383B2 (enrdf_load_stackoverflow) 1975-03-25 1975-03-25

Country Status (1)

Country Link
JP (1) JPS5628383B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3423172A1 (de) * 1983-06-22 1985-01-10 Hitachi, Ltd., Tokio/Tokyo Verfahren zur herstellung einer solarbatterie

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384495A (en) * 1976-12-29 1978-07-25 Japan Solar Energy Semiconductor electrode and method of forming same
JPS54179075U (enrdf_load_stackoverflow) * 1978-06-07 1979-12-18
JPS57172777A (en) * 1981-04-15 1982-10-23 Nippon Sheet Glass Co Ltd Modularization of photocell
JPS58190050A (ja) * 1982-04-30 1983-11-05 Nec Home Electronics Ltd ダイオ−ド組立方法
JPS59211286A (ja) * 1983-05-17 1984-11-30 Canon Inc 太陽電池ユニツト
JPS60107872A (ja) * 1983-11-16 1985-06-13 Kanegafuchi Chem Ind Co Ltd 光起電力装置
JPS6182485A (ja) * 1984-09-29 1986-04-26 Toshiba Corp 太陽電池パネル
JPH01121959U (enrdf_load_stackoverflow) * 1988-02-10 1989-08-18
JP2002319689A (ja) * 2001-04-20 2002-10-31 Sharp Corp 光電変換素子及びその製造方法
JP4153785B2 (ja) * 2002-12-19 2008-09-24 京セラ株式会社 太陽電池モジュール
JP4024161B2 (ja) * 2003-02-12 2007-12-19 三洋電機株式会社 太陽電池モジュールの製造方法
GB2416621A (en) * 2004-07-27 2006-02-01 Cambridge Display Tech Ltd Laminated interconnects for opto-electronic device modules
US8759664B2 (en) 2009-12-28 2014-06-24 Hanergy Hi-Tech Power (Hk) Limited Thin film solar cell strings
CN104412357B (zh) 2012-04-17 2017-09-22 环球太阳能公司 积体薄膜太阳能晶胞电池的互连
JP2014075430A (ja) * 2012-10-03 2014-04-24 Sharp Corp 太陽電池モジュール
CN105164816B (zh) 2013-01-28 2017-03-08 环球太阳能公司 光伏互连系统、装置和方法
DE102013219526B4 (de) 2013-09-27 2022-10-13 Meyer Burger (Germany) Gmbh Solarzellenverbund mit Verbindungselement und Verfahren zum Herstellen eines Solarzellenverbunds
US12244265B2 (en) 2018-03-28 2025-03-04 The Boeing Company Wiring for a rigid panel solar array

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3423172A1 (de) * 1983-06-22 1985-01-10 Hitachi, Ltd., Tokio/Tokyo Verfahren zur herstellung einer solarbatterie
US4562637A (en) * 1983-06-22 1986-01-07 Hitachi, Ltd. Method of manufacturing solar battery

Also Published As

Publication number Publication date
JPS51110985A (enrdf_load_stackoverflow) 1976-09-30

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