JPS562655A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS562655A
JPS562655A JP7848479A JP7848479A JPS562655A JP S562655 A JPS562655 A JP S562655A JP 7848479 A JP7848479 A JP 7848479A JP 7848479 A JP7848479 A JP 7848479A JP S562655 A JPS562655 A JP S562655A
Authority
JP
Japan
Prior art keywords
metal layer
insulating material
prepared
internal lead
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7848479A
Other languages
English (en)
Other versions
JPS6154258B2 (ja
Inventor
Shigeru Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7848479A priority Critical patent/JPS562655A/ja
Publication of JPS562655A publication Critical patent/JPS562655A/ja
Publication of JPS6154258B2 publication Critical patent/JPS6154258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP7848479A 1979-06-21 1979-06-21 Semiconductor device Granted JPS562655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7848479A JPS562655A (en) 1979-06-21 1979-06-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7848479A JPS562655A (en) 1979-06-21 1979-06-21 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS562655A true JPS562655A (en) 1981-01-12
JPS6154258B2 JPS6154258B2 (ja) 1986-11-21

Family

ID=13663255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7848479A Granted JPS562655A (en) 1979-06-21 1979-06-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS562655A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233307A (ja) * 1987-03-20 1988-09-29 Nikon Corp パタ−ン検出装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233307A (ja) * 1987-03-20 1988-09-29 Nikon Corp パタ−ン検出装置

Also Published As

Publication number Publication date
JPS6154258B2 (ja) 1986-11-21

Similar Documents

Publication Publication Date Title
US3591839A (en) Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
DE3264724D1 (en) Method of connecting metal leads with electrodes of semiconductor device and metal lead
JPS562655A (en) Semiconductor device
JPS5721847A (en) Semiconductor device
JPS53112063A (en) Semiconductor and method of coating same
JPS5643816A (en) Structure of bonding pad part
EP0304929A3 (en) Semiconductor device having an electrode covered with a protective film
JPS54137968A (en) Method of mounting lead wire and method of assembling microminiature circuit
JPS5543415A (en) Semiconductor pressure converter
JPS5623768A (en) Semiconductor device
JPS5635448A (en) Semiconductor device
JPS5626446A (en) Semiconductor device
JPS5480679A (en) Manufacture for semiconductor device
JPS58155838U (ja) 半導体装置
JPS5375859A (en) Glass sealing semiconductor
JPS5718114A (en) Mounting method of elastic surface wave element
JPS55128848A (en) Semiconductor device
JPS5461471A (en) Semiconductor device
JPH02114943U (ja)
JPS5723254A (en) Semiconductor device
KR830002575B1 (ko) 기밀단자(氣密端子)의 제조방법
JPS57177546A (en) Semiconductor diode
JPS57196537A (en) Manufacture of semiconductor device
JPS57111041A (en) Semiconductor device
JPS57178371A (en) Insulating gate field-effect element