JPS5625517B2 - - Google Patents
Info
- Publication number
- JPS5625517B2 JPS5625517B2 JP1020773A JP1020773A JPS5625517B2 JP S5625517 B2 JPS5625517 B2 JP S5625517B2 JP 1020773 A JP1020773 A JP 1020773A JP 1020773 A JP1020773 A JP 1020773A JP S5625517 B2 JPS5625517 B2 JP S5625517B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2204326A DE2204326C3 (de) | 1972-01-26 | 1972-01-26 | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und duktilen Kupferüberzügen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4886741A JPS4886741A (ja) | 1973-11-15 |
| JPS5625517B2 true JPS5625517B2 (ja) | 1981-06-12 |
Family
ID=5834477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1020773A Expired JPS5625517B2 (ja) | 1972-01-26 | 1973-01-24 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3778357A (ja) |
| JP (1) | JPS5625517B2 (ja) |
| DE (1) | DE2204326C3 (ja) |
| FR (1) | FR2169222B1 (ja) |
| GB (1) | GB1423530A (ja) |
| IE (1) | IE37141B1 (ja) |
| IT (1) | IT973212B (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4076600A (en) * | 1976-12-20 | 1978-02-28 | R. O. Hull & Company, Inc. | Leveling agent for acid zinc electroplating baths and method |
| JPH0762021B2 (ja) * | 1986-11-05 | 1995-07-05 | 第一工業製薬株式会社 | 第４ホスホニウム化合物の製造方法 |
| JPH0720978B2 (ja) * | 1987-06-24 | 1995-03-08 | 株式会社クラレ | ホスホニウム塩ならびにその製造方法 |
| US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
| DE4211140A1 (de) * | 1992-04-03 | 1993-10-07 | Basf Ag | Phosphoniumsalze und ihre Verwendung als Glanzmittel für wäßrig-saure galvanische Nickelbäder |
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| US20060183328A1 (en) * | 1999-05-17 | 2006-08-17 | Barstad Leon R | Electrolytic copper plating solutions |
| US20040045832A1 (en) * | 1999-10-14 | 2004-03-11 | Nicholas Martyak | Electrolytic copper plating solutions |
| DE10261852B3 (de) | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad |
| US9399618B2 (en) * | 2003-05-12 | 2016-07-26 | Arkema Inc. | High purity electrolytic sulfonic acid solutions |
| US9243339B2 (en) | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
| US9809891B2 (en) | 2014-06-30 | 2017-11-07 | Rohm And Haas Electronic Materials Llc | Plating method |
| WO2016152983A1 (ja) * | 2015-03-26 | 2016-09-29 | 三菱マテリアル株式会社 | ホスホニウム塩を用いためっき液 |
| JP6631348B2 (ja) | 2015-03-26 | 2020-01-15 | 三菱マテリアル株式会社 | ホスホニウム塩を用いためっき液 |
| US10988852B2 (en) | 2015-10-27 | 2021-04-27 | Rohm And Haas Electronic Materials Llc | Method of electroplating copper into a via on a substrate from an acid copper electroplating bath |
-
1972
- 1972-01-26 DE DE2204326A patent/DE2204326C3/de not_active Expired
- 1972-12-22 US US00317720A patent/US3778357A/en not_active Expired - Lifetime
- 1972-12-29 IT IT33935/72A patent/IT973212B/it active
-
1973
- 1973-01-22 GB GB319473A patent/GB1423530A/en not_active Expired
- 1973-01-23 IE IE109/73A patent/IE37141B1/xx unknown
- 1973-01-24 JP JP1020773A patent/JPS5625517B2/ja not_active Expired
- 1973-01-25 FR FR7302563A patent/FR2169222B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2204326C3 (de) | 1981-07-09 |
| FR2169222B1 (ja) | 1976-05-14 |
| DE2204326B2 (de) | 1980-08-21 |
| IE37141B1 (en) | 1977-05-11 |
| DE2204326A1 (de) | 1973-08-02 |
| FR2169222A1 (ja) | 1973-09-07 |
| IE37141L (en) | 1973-07-26 |
| IT973212B (it) | 1974-06-10 |
| GB1423530A (en) | 1976-02-04 |
| US3778357A (en) | 1973-12-11 |
| JPS4886741A (ja) | 1973-11-15 |