GB1423530A - Acid copper electrolytes - Google Patents

Acid copper electrolytes

Info

Publication number
GB1423530A
GB1423530A GB319473A GB319473A GB1423530A GB 1423530 A GB1423530 A GB 1423530A GB 319473 A GB319473 A GB 319473A GB 319473 A GB319473 A GB 319473A GB 1423530 A GB1423530 A GB 1423530A
Authority
GB
United Kingdom
Prior art keywords
acid
substituted
alkyl
hydrocarbon
jan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB319473A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of GB1423530A publication Critical patent/GB1423530A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1423530 Acid copper electrolytes SCHERING AG 22 Jan 1973 [26 Jan 1972] 3194/73 Heading C7B An acid copper electrolyte contains (a) a quaternary phosphonium base of the Formula:- in which R 1 , R2, R3 and R 4 may be aromatic hydrocarbon, aliphatic hydrocarbon, cycloaliphatic hydrocarbon or heterocylic groups which may be substituted, e.g. an alkyl substituted by halogen, amino, hydroxyl, benzyl, cyano-benzyl, cycloalkyl, carboxyalkyl, naphthylalkyl, trialkylphosphonium-alkyl-diphenyl-alkyl or alkenyl groups, or R3 and R4 are as above and R 1 plus R2 and the phosphorus atom represent a heterocyclic group, e.g. a phosphindolinium group, or salts thereof with inorganic or organic acids, e.g. with HC1, HBr, HI, H 2 SO 4 , HNO 3 , methylsulphuric acid or acetic acid; or (b) a betain of the Formula:- in which R 1 ", R 2 " and R 3 " have the meanings of R 1 , R2 &c. above, and R 5 is an aromatic, aliphatic or cycloaliphatic hydrocarbon group which may be substituted and may be interrupted by hetero atoms, e.g. by an oxygen atom, and Y is an acid anion, e.g. of sulphuric, sulphurous, phosphoric, phosphorous or a carboxylic acid. The bath may be of CuSO 4 /H 2 SO 4 , or may contain phosphoric acid, or fluoboric and hydrochloric acids, or alkali metal chloride may be present. The bath may also include glossing agents and wetting agents, and may include organic thio, seleno, nitrogen containing thio, and phenazonium compounds, various examples of such compounds being given.
GB319473A 1972-01-26 1973-01-22 Acid copper electrolytes Expired GB1423530A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2204326A DE2204326C3 (en) 1972-01-26 1972-01-26 Aqueous acid bath for the galvanic deposition of shiny and ductile copper coatings

Publications (1)

Publication Number Publication Date
GB1423530A true GB1423530A (en) 1976-02-04

Family

ID=5834477

Family Applications (1)

Application Number Title Priority Date Filing Date
GB319473A Expired GB1423530A (en) 1972-01-26 1973-01-22 Acid copper electrolytes

Country Status (7)

Country Link
US (1) US3778357A (en)
JP (1) JPS5625517B2 (en)
DE (1) DE2204326C3 (en)
FR (1) FR2169222B1 (en)
GB (1) GB1423530A (en)
IE (1) IE37141B1 (en)
IT (1) IT973212B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076600A (en) * 1976-12-20 1978-02-28 R. O. Hull & Company, Inc. Leveling agent for acid zinc electroplating baths and method
JPH0762021B2 (en) * 1986-11-05 1995-07-05 第一工業製薬株式会社 Method for producing fourth phosphonium compound
JPH0720978B2 (en) * 1987-06-24 1995-03-08 株式会社クラレ Phosphonium salt and method for producing the same
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination
DE4211140A1 (en) * 1992-04-03 1993-10-07 Basf Ag Phosphonium salts and their use as brighteners for aqueous acidic galvanic nickel baths
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
US20060183328A1 (en) * 1999-05-17 2006-08-17 Barstad Leon R Electrolytic copper plating solutions
US20040045832A1 (en) * 1999-10-14 2004-03-11 Nicholas Martyak Electrolytic copper plating solutions
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US9399618B2 (en) * 2003-05-12 2016-07-26 Arkema Inc. High purity electrolytic sulfonic acid solutions
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
WO2016152983A1 (en) * 2015-03-26 2016-09-29 三菱マテリアル株式会社 Plating solution using phosphonium salt
JP6631348B2 (en) 2015-03-26 2020-01-15 三菱マテリアル株式会社 Plating solution using phosphonium salt
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath

Also Published As

Publication number Publication date
DE2204326C3 (en) 1981-07-09
FR2169222B1 (en) 1976-05-14
DE2204326B2 (en) 1980-08-21
IE37141B1 (en) 1977-05-11
JPS5625517B2 (en) 1981-06-12
DE2204326A1 (en) 1973-08-02
FR2169222A1 (en) 1973-09-07
IE37141L (en) 1973-07-26
IT973212B (en) 1974-06-10
US3778357A (en) 1973-12-11
JPS4886741A (en) 1973-11-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee