JPS5624981A - Sealing of solid image pickup device - Google Patents

Sealing of solid image pickup device

Info

Publication number
JPS5624981A
JPS5624981A JP10077379A JP10077379A JPS5624981A JP S5624981 A JPS5624981 A JP S5624981A JP 10077379 A JP10077379 A JP 10077379A JP 10077379 A JP10077379 A JP 10077379A JP S5624981 A JPS5624981 A JP S5624981A
Authority
JP
Japan
Prior art keywords
sealing material
package
glass
sealing
image pickup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10077379A
Other languages
Japanese (ja)
Inventor
Yoshiaki Hayashimoto
Okio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10077379A priority Critical patent/JPS5624981A/en
Publication of JPS5624981A publication Critical patent/JPS5624981A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To prevent the generation of air bubbles, yarnlike passages and latent deformation in the sealing material for a solid image pickup device by softening the sealing material upon preheating thereof, then contacting a package with an opening glass, pressurizing it, and bring it to regular heating. CONSTITUTION:A sealing material is coated on an opening glass 6 and on a ceramic package 1, and the glass 6 and the package 1 are chucked with jigs 10, 11 are heated to the sealing material softening point beforehand. Thereafter, both are made in contact with each other, pressure is applied thereto, are heated to hardening temperature to retain for predetermined time to be cured, the pressure is then removed, and the jigs are removed, to be cooled thereat. This configuration can dissipate gas during preheating step to produce no air bubbles nor yarnlike passage without leakage in sealing, and the sealing material is liquefied in the preheating step to be thus made contact at the glass with the package, and strain is therefore reduced thereat.
JP10077379A 1979-08-09 1979-08-09 Sealing of solid image pickup device Pending JPS5624981A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10077379A JPS5624981A (en) 1979-08-09 1979-08-09 Sealing of solid image pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10077379A JPS5624981A (en) 1979-08-09 1979-08-09 Sealing of solid image pickup device

Publications (1)

Publication Number Publication Date
JPS5624981A true JPS5624981A (en) 1981-03-10

Family

ID=14282797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10077379A Pending JPS5624981A (en) 1979-08-09 1979-08-09 Sealing of solid image pickup device

Country Status (1)

Country Link
JP (1) JPS5624981A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235260A (en) * 1988-03-15 1989-09-20 Rohm Co Ltd Manufacture of cap for optical element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235260A (en) * 1988-03-15 1989-09-20 Rohm Co Ltd Manufacture of cap for optical element

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