JPS56169339A - Table structure for ultrasonic wire bonding device - Google Patents

Table structure for ultrasonic wire bonding device

Info

Publication number
JPS56169339A
JPS56169339A JP7140280A JP7140280A JPS56169339A JP S56169339 A JPS56169339 A JP S56169339A JP 7140280 A JP7140280 A JP 7140280A JP 7140280 A JP7140280 A JP 7140280A JP S56169339 A JPS56169339 A JP S56169339A
Authority
JP
Japan
Prior art keywords
brake
wire bonding
bonding device
energized
accelerate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7140280A
Other languages
Japanese (ja)
Inventor
Shunei Uematsu
Kazuhisa Takashima
Nobuhiro Takasugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7140280A priority Critical patent/JPS56169339A/en
Publication of JPS56169339A publication Critical patent/JPS56169339A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To accelerate the wire bonding of an ultrasonic wire bonding device by disposing an electromanget brake on a table to accelerate the stoppage of the table. CONSTITUTION:A table 1 for placing a work is supported by a rotating shaft 10, and the lower end and the intermediate part of the shaft 10 are rotatbly mounted via bearings 12 at a housing base 11. An electromagnetic brake 15 is mounted at the rotating shaft part projected upwardly from the housing base 11. When the electromagnet is not energized, the body 17 is not brought into contact with a brake plate 18 but is rotated, and when it is energized, the brake plate 18 is intimately contacted via a spring with the body 17, thereby engaging the brake. Since the attenuating motion of the table 1 at the stopping time is constructed to be forcibly stopped by the brake 15 with extremely short length, the attenuating time of vibration can be shortened, and the wire bonding can be accelerated.
JP7140280A 1980-05-30 1980-05-30 Table structure for ultrasonic wire bonding device Pending JPS56169339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7140280A JPS56169339A (en) 1980-05-30 1980-05-30 Table structure for ultrasonic wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7140280A JPS56169339A (en) 1980-05-30 1980-05-30 Table structure for ultrasonic wire bonding device

Publications (1)

Publication Number Publication Date
JPS56169339A true JPS56169339A (en) 1981-12-26

Family

ID=13459478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7140280A Pending JPS56169339A (en) 1980-05-30 1980-05-30 Table structure for ultrasonic wire bonding device

Country Status (1)

Country Link
JP (1) JPS56169339A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116292685A (en) * 2023-05-17 2023-06-23 宁波尚进自动化科技有限公司 Plane motion braking device and bonding equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116292685A (en) * 2023-05-17 2023-06-23 宁波尚进自动化科技有限公司 Plane motion braking device and bonding equipment
CN116292685B (en) * 2023-05-17 2023-08-29 宁波尚进自动化科技有限公司 Plane motion braking device and bonding equipment

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