JPS56164565A - Lead frame and manufacture thereof - Google Patents
Lead frame and manufacture thereofInfo
- Publication number
- JPS56164565A JPS56164565A JP6914780A JP6914780A JPS56164565A JP S56164565 A JPS56164565 A JP S56164565A JP 6914780 A JP6914780 A JP 6914780A JP 6914780 A JP6914780 A JP 6914780A JP S56164565 A JPS56164565 A JP S56164565A
- Authority
- JP
- Japan
- Prior art keywords
- section
- pins
- product
- lead frame
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To lower manufacturing cost by making it possible to reduce in size and to facilitate manufacturing process, by arranging plural pieces of leads in radial configuration centering position of a pad, arranging pins on the circumference, and manufactuing a product by punching process using a metallic mold of the same shape. CONSTITUTION:A lead frame is to take such a shape that plural leads extend in a radial configuration from a pad section 17, which is for being loaded with a chip and located on the center, toward a shortcircuit section 16, and outside of this, pins 13 are arranged toward a connecting section 15. In order to manufacture this, after punching a pilot hole 12 at process I, at process II, a punch-out section 14a between the leads 14 and a punch-out section 13a between the pins 13 are punched out in the position determined by the hole 12, by 6 sets of punching molds provided in the position set at 60 deg., respectively, in a radial configuration. Others are manufactured in turn by the metallic mold of the same shape by shifting positioning angle, and the lead frame is thus prepared. As it is possible, by doing so, to simplify shape of a product, it becomes possible to reduce in size of the product, and further since a metallic mold of the same shape is used, it is possible to facilitate process control and to lower the production cost.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914780A JPS56164565A (en) | 1980-05-22 | 1980-05-22 | Lead frame and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914780A JPS56164565A (en) | 1980-05-22 | 1980-05-22 | Lead frame and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56164565A true JPS56164565A (en) | 1981-12-17 |
Family
ID=13394250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6914780A Pending JPS56164565A (en) | 1980-05-22 | 1980-05-22 | Lead frame and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56164565A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6276781A (en) * | 1985-09-30 | 1987-04-08 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| JPS6279674A (en) * | 1985-10-03 | 1987-04-13 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| US4868635A (en) * | 1988-01-13 | 1989-09-19 | Texas Instruments Incorporated | Lead frame for integrated circuit |
| JPH03120852A (en) * | 1989-10-04 | 1991-05-23 | Sumitomo Metal Mining Co Ltd | Manufacture of lead frame |
| JPH0425053A (en) * | 1990-05-16 | 1992-01-28 | Mitsui High Tec Inc | Manufacture of lead frame |
| JP2020162289A (en) * | 2019-03-27 | 2020-10-01 | アピックヤマダ株式会社 | Manufacturing method of motor core plate, manufacturing method of motor core, metal mold, and motor core plate manufacturing apparatus |
-
1980
- 1980-05-22 JP JP6914780A patent/JPS56164565A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6276781A (en) * | 1985-09-30 | 1987-04-08 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| JPS6279674A (en) * | 1985-10-03 | 1987-04-13 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| US4868635A (en) * | 1988-01-13 | 1989-09-19 | Texas Instruments Incorporated | Lead frame for integrated circuit |
| JPH03120852A (en) * | 1989-10-04 | 1991-05-23 | Sumitomo Metal Mining Co Ltd | Manufacture of lead frame |
| JPH0425053A (en) * | 1990-05-16 | 1992-01-28 | Mitsui High Tec Inc | Manufacture of lead frame |
| JPH0821660B2 (en) * | 1990-05-16 | 1996-03-04 | 株式会社三井ハイテック | Lead frame manufacturing method |
| JP2020162289A (en) * | 2019-03-27 | 2020-10-01 | アピックヤマダ株式会社 | Manufacturing method of motor core plate, manufacturing method of motor core, metal mold, and motor core plate manufacturing apparatus |
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