CN206689277U - A kind of lower mould of electronic component punching - Google Patents
A kind of lower mould of electronic component punching Download PDFInfo
- Publication number
- CN206689277U CN206689277U CN201720583093.4U CN201720583093U CN206689277U CN 206689277 U CN206689277 U CN 206689277U CN 201720583093 U CN201720583093 U CN 201720583093U CN 206689277 U CN206689277 U CN 206689277U
- Authority
- CN
- China
- Prior art keywords
- installing plate
- punching
- substrate
- projection
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
A kind of lower mould of electronic component punching is the utility model is related to, it includes：Substrate；First punching mechanism；Second punching mechanism, second punching mechanism is arranged at the side of first punching mechanism and has same symmetry axis with it, it forms the second material strip groove being engaged with the first material strip groove in the second projection of the second installing plate upper surface and formation including being fixed on the second installing plate of the upper surface of base plate, being formed between the second projection upper surface and spaced two second spacing raised lines, two second spacing raised lines；Multiple first locating sleeves；Multiple support projections；Multiple rows of hole punching.It can so realize and continuous cutting is carried out to the material web continued through and makes its shaping, be advantageously implemented automated production.
Description
Technical field
It the utility model is related to a kind of die cutting die, and in particular to a kind of lower mould of electronic component punching.
Background technology
Electronic component is electronic component and electric small-sized machine, the part of instrument, and itself is often by some parts
Form, can be general in like product；Often refer to electrical equipment, radio, some parts of the industry such as instrument, as electric capacity, transistor,
The general name of the sub- device such as hairspring, clockwork spring.
Electronic component is because size is smaller, when its structure is more complicated, it usually needs by Multi-step forming ability
Shaping.At present, with the continuous improvement of electronic component process equipment automaticity, electronic component is generally by automatic feed
Material strip carry out repeatedly punching through cutter head assembly and formed, this just needs to design the supporting lower mould of electronic component punching.
Utility model content
The purpose of the utility model is to provide a kind of electronic component punching lower mould for overcome the deficiencies in the prior art.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of lower mould of electronic component punching, it is wrapped
Include：
Substrate, the substrate have by two long sides being oppositely arranged and two narrow skirts being oppositely arranged into upper table
Face；
First punching mechanism, the symmetry axis of first punching mechanism is overlapping with the symmetry axis on the narrow side, and it includes solid
It is scheduled on the first installing plate of the upper surface of base plate, formation exists in the first projection of the first installing plate upper surface and formation
The first projection upper surface and spaced two first spacing raised lines, is formed between two first spacing raised lines
One material strip groove；
Second punching mechanism, second punching mechanism are arranged at the side of first punching mechanism and had with it same
One symmetry axis, it includes being fixed on the second installing plate of the upper surface of base plate, formed in the second installing plate upper surface
Second projection and formed in the second projection upper surface and spaced two second spacing raised lines, two described second
The second material strip groove being engaged with the first material strip groove is formed between spacing raised line；
Multiple first locating sleeves, multiple first locating sleeves are arranged on the upper surface of base plate and positioned at described the
The both sides of one installing plate and second installing plate；
Multiple support projections, multiple support projections are arranged on the upper surface of base plate and are located at first installing plate
With the both sides of second installing plate；
Multiple rows of hole punching, multiple hole punchings are arranged between two first spacing raised lines and two described second
Between spacing raised line.
Optimally, two sides that the substrate is correspondingly arranged are provided with more lifting booms.
Optimally, it also includes multiple second locating sleeves, and multiple second locating sleeves are separately positioned on described
On one installing plate and second installing plate and positioned at the both sides of first projection and second projection.
Optimally, it also includes the positioning for being arranged on the upper surface of base plate and being connected with the second installing plate side
Screw group.
Because above-mentioned technical proposal is used, the utility model has following advantages compared with prior art：The utility model
The lower mould of electronic component punching, it is engaged and the first punching mechanism of specific structure, the second punching by being formed in upper surface of base plate
Mechanism and support projection are cut, can so realize and continuous cutting is carried out to the material web continued through and makes its shaping, be advantageous to
Realize automated production.
Brief description of the drawings
Accompanying drawing 1 is the structural representation of the lower mould of the utility model electronic component punching.
Embodiment
The utility model preferred embodiment is described in detail below in conjunction with accompanying drawing：
The lower mould of electronic component punching as shown in Figure 1, mainly includes substrate 1, the first punching mechanism 2, the second bicker
Structure 3, support projection 4, the first locating sleeve 5 and hole punching 8 etc..
Wherein, substrate 1 has upper surface 11, the narrow side that it is oppositely arranged by two long sides being oppositely arranged 111 and two
112 head and the tail are connected and surrounded.The symmetry axis of first punching mechanism 2 is overlapping with the symmetry axis on narrow side 112, and it includes being fixed on substrate
First installing plate 21 of 1 upper surface 11, formation are convex first in the first projection 22 of the upper surface of the first installing plate 21 and formation
The upper surface of block 22 and spaced two first spacing raised lines 23, the first material strip groove is formed between two first spacing raised lines 23
24.Second punching mechanism 3 is arranged on the side of the first punching mechanism 2 and setting adjacent thereto, and they have same symmetry axis, it
Including be fixed on the upper surface 11 of substrate 1 the second installing plate 31, formed the upper surface of the second installing plate 31 the second projection 32 with
And formed between the upper surface of the second projection 32 and spaced two second spacing raised lines 33, two second spacing raised lines 33
Form the second material strip groove 34 being engaged with the first material strip groove 24.First locating sleeve 5 has multiple（Typically at least there are four）, it
Be arranged on the upper surface 11 of substrate 1 and respectively positioned at the both sides of the first installing plate 21 and the second installing plate 31.Support projection 4 also has
It is multiple（Typically at least there are four）, they are arranged on the upper surface 11 of substrate 1 and are located at the first installing plate 21 and the second installing plate 31
Both sides.Hole punching 8 has multiple rows of, and their specification and shape is correspondingly arranged according to the hole size for being actually needed punching molding,
They are partly arranged between two first spacing raised lines 23 and remainder is arranged between two second spacing raised lines 33, are made
It must be partially submerged into the first installing plate 21 and remainder is arranged in the second installing plate 31.
In the present embodiment, two sides that substrate 1 is correspondingly arranged are provided with more lifting booms 6.Electronic component is punched
Lower mould also includes multiple second locating sleeves 9（Typically at least there are four）, they are separately positioned on the first installing plate 21 and second
On installing plate 31 and positioned at the both sides of the first projection 22 and the second projection 32.The lower mould of electronic component punching also includes being arranged on base
The upper surface of plate 1 and at least two groups of positioning screw groups 7 being connected with the side of the second installing plate 31, positioning screw group 7 include passing through
Adjusting screw is arranged on the fixation bottom plate of the upper surface of substrate 1, is fixed on the fixed block of fixed plate upper surface and through fixation
Trip bolt in block and the second installing plate 31 of insertion.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this,
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (4)
1. a kind of lower mould of electronic component punching, it is characterised in that it includes：
Substrate（1）, the substrate（1）With by two long sides being oppositely arranged（111）With two narrow sides being oppositely arranged（112）
The upper surface surrounded（11）；
First punching mechanism（2）, first punching mechanism（2）Symmetry axis and the narrow side（112）Symmetry axis it is overlapping, it
Including being fixed on the substrate（1）Upper surface（11）The first installing plate（21）, formed in first installing plate（21）Upper table
First projection in face（22）And formed in first projection（22）Upper surface and spaced two first spacing raised lines
（23）, two first spacing raised lines（23）Between form the first material strip groove（24）；
Second punching mechanism（3）, second punching mechanism（3）It is arranged at first punching mechanism（2）Side and and its
With same symmetry axis, it includes being fixed on the substrate（1）Upper surface（11）The second installing plate（31）, formed described the
Two installing plates（31）Second projection of upper surface（32）And formed in second projection（32）Upper surface and spaced
Two second spacing raised lines（33）, two second spacing raised lines（33）Between formed with the first material strip groove（24）Match
The the second material strip groove closed（34）；
Multiple first locating sleeves（5）, multiple first locating sleeves（5）It is arranged on the substrate（1）Upper surface（11）And
Positioned at first installing plate（21）With second installing plate（31）Both sides；
Multiple support projections（4）, multiple support projections（4）It is arranged on the substrate（1）Upper surface（11）And positioned at described
First installing plate（21）With second installing plate（31）Both sides；
Multiple rows of hole punching（8）, multiple hole punchings（8）It is arranged at two first spacing raised lines（23）Between and two institutes
State the second spacing raised line（33）Between.
2. the lower mould of electronic component punching according to claim 1, it is characterised in that：The substrate（1）It is correspondingly arranged
Two sides are provided with more lifting booms（6）.
3. the lower mould of electronic component punching according to claim 1, it is characterised in that：It also includes multiple second positioning sleeves
Pipe（9）, multiple second locating sleeves（9）It is separately positioned on first installing plate（21）With second installing plate（31）
Go up and be located at first projection（22）With second projection（32）Both sides.
4. the lower mould of electronic component punching according to claim 1, it is characterised in that：It also includes being arranged on the substrate
（1）Upper surface and with second installing plate（31）The positioning screw group that side is connected（7）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720583093.4U CN206689277U (en) | 2017-05-24 | 2017-05-24 | A kind of lower mould of electronic component punching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720583093.4U CN206689277U (en) | 2017-05-24 | 2017-05-24 | A kind of lower mould of electronic component punching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206689277U true CN206689277U (en) | 2017-12-01 |
Family
ID=60448750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720583093.4U Expired - Fee Related CN206689277U (en) | 2017-05-24 | 2017-05-24 | A kind of lower mould of electronic component punching |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206689277U (en) |
-
2017
- 2017-05-24 CN CN201720583093.4U patent/CN206689277U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171201 Termination date: 20200524 |